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F1206价格
参考价格：￥2.5468
型号：F1206A1R00FWTR 品牌：AVX 备注：这里有F1206多少钱，2026年最近7天走势，今日出价，今日竞价，F1206批发/采购报价，F1206行情走势销售排行榜，F1206报价。| 型号 | 功能描述 | 生产厂家 企业 | LOGO | 操作 |
|---|---|---|---|---|
F1206 | PATENTED GOLD METALIZED SILICON GATE ENHANCEMENT MODE RF POWER VDMOS TRANSISTOR??? General Description Silicon VDMOS and LDMOS transistors designed specifically for broadband RF applications. Suitable for Military Radios, Cellular and Paging Amplifier Base Stations, Broadcast FM/AM, MRI, Laser Driver and others. Polyfet process features gold metal for greatly extended lifetim | Polyfet |   | |
F1206 | Fast Acting Surface Mount Fuse | ETC 知名厂家 | ETC | |
F1206 | Intermediate Frequency Digital Variable Gain Amplifier 文件：2.41575 Mbytes Page：14 Pages | RENESAS 瑞萨 | | |
SolidMatrix® Surface Mount Fuses FA Series (Fast Acting), 1206 Size Features: • Multilayer monolithic structure with glass ceramic body and silver fusing element • Silver termination with nickel and pure-tin solder plating, providing excellent solderability • Compatible with both wave and reflow soldering processes • Operating temperature range: -55°C to +150° | AEM AEM科技 | | ||
SolidMatrix® Surface Mount Fuses FA Series (Fast Acting), 1206 Size Features: • Multilayer monolithic structure with glass ceramic body and silver fusing element • Silver termination with nickel and pure-tin solder plating, providing excellent solderability • Compatible with both wave and reflow soldering processes • Operating temperature range: -55°C to +150° | AEM AEM科技 | | ||
SolidMatrix® Surface Mount Fuses FA Series (Fast Acting), 1206 Size Features: • Multilayer monolithic structure with glass ceramic body and silver fusing element • Silver termination with nickel and pure-tin solder plating, providing excellent solderability • Compatible with both wave and reflow soldering processes • Operating temperature range: -55°C to +150° | AEM AEM科技 | | ||
SolidMatrix® Surface Mount Fuses FA Series (Fast Acting), 1206 Size Features: • Multilayer monolithic structure with glass ceramic body and silver fusing element • Silver termination with nickel and pure-tin solder plating, providing excellent solderability • Compatible with both wave and reflow soldering processes • Operating temperature range: -55°C to +150° | AEM AEM科技 | | ||
SolidMatrix® Surface Mount Fuses FA Series (Fast Acting), 1206 Size Features: • Multilayer monolithic structure with glass ceramic body and silver fusing element • Silver termination with nickel and pure-tin solder plating, providing excellent solderability • Compatible with both wave and reflow soldering processes • Operating temperature range: -55°C to +150° | AEM AEM科技 | | ||
SolidMatrix® Surface Mount Fuses FA Series (Fast Acting), 1206 Size Features: • Multilayer monolithic structure with glass ceramic body and silver fusing element • Silver termination with nickel and pure-tin solder plating, providing excellent solderability • Compatible with both wave and reflow soldering processes • Operating temperature range: -55°C to +150° | AEM AEM科技 | | ||
SolidMatrix® Surface Mount Fuses FA Series (Fast Acting), 1206 Size Features: • Multilayer monolithic structure with glass ceramic body and silver fusing element • Silver termination with nickel and pure-tin solder plating, providing excellent solderability • Compatible with both wave and reflow soldering processes • Operating temperature range: -55°C to +150° | AEM AEM科技 | | ||
SolidMatrix® Surface Mount Fuses FA Series (Fast Acting), 1206 Size Features: • Multilayer monolithic structure with glass ceramic body and silver fusing element • Silver termination with nickel and pure-tin solder plating, providing excellent solderability • Compatible with both wave and reflow soldering processes • Operating temperature range: -55°C to +150° | AEM AEM科技 | | ||
SolidMatrix® Surface Mount Fuses FA Series (Fast Acting), 1206 Size Features: • Multilayer monolithic structure with glass ceramic body and silver fusing element • Silver termination with nickel and pure-tin solder plating, providing excellent solderability • Compatible with both wave and reflow soldering processes • Operating temperature range: -55°C to +150° | AEM AEM科技 | | ||
SolidMatrix® Surface Mount Fuses FA Series (Fast Acting), 1206 Size Features: • Multilayer monolithic structure with glass ceramic body and silver fusing element • Silver termination with nickel and pure-tin solder plating, providing excellent solderability • Compatible with both wave and reflow soldering processes • Operating temperature range: -55°C to +150° | AEM AEM科技 | | ||
SolidMatrix® Surface Mount Fuses FA Series (Fast Acting), 1206 Size Features: • Multilayer monolithic structure with glass ceramic body and silver fusing element • Silver termination with nickel and pure-tin solder plating, providing excellent solderability • Compatible with both wave and reflow soldering processes • Operating temperature range: -55°C to +150° | AEM AEM科技 | | ||
SolidMatrix® Surface Mount Fuses FA Series (Fast Acting), 1206 Size Features: • Multilayer monolithic structure with glass ceramic body and silver fusing element • Silver termination with nickel and pure-tin solder plating, providing excellent solderability • Compatible with both wave and reflow soldering processes • Operating temperature range: -55°C to +150° | AEM AEM科技 | | ||
SolidMatrix® Surface Mount Fuses FA Series (Fast Acting), 1206 Size Features: • Multilayer monolithic structure with glass ceramic body and silver fusing element • Silver termination with nickel and pure-tin solder plating, providing excellent solderability • Compatible with both wave and reflow soldering processes • Operating temperature range: -55°C to +150° | AEM AEM科技 | | ||
SolidMatrix® Surface Mount Fuses HI Series (High Inrush), 0603 Size Features: • High inrush current withstanding capability • Ceramic Monolithic structure • Silver fusing element and silver termination with nickel and tin plating • Symmetrical design with marking on both sides (optional) • Operating temperature range: -55°C to +150°C (with de-rating) | AEM AEM科技 | | ||
SolidMatrix® Surface Mount Fuses HI Series (High Inrush), 0603 Size Features: • High inrush current withstanding capability • Ceramic Monolithic structure • Silver fusing element and silver termination with nickel and tin plating • Symmetrical design with marking on both sides (optional) • Operating temperature range: -55°C to +150°C (with de-rating) | AEM AEM科技 | | ||
SMD PPTC RESETTABLE FUSE Product Features: Small surface mountable, Solid state, Faster time to trip than standard SMD devices, Lower resistance than standard SMD devices | AITSEMI 创瑞科技 | | ||
SMD PPTC RESETTABLE FUSE Product Features: Small surface mountable, Solid state, Faster time to trip than standard SMD devices, Lower resistance than standard SMD devices | AITSEMI 创瑞科技 | | ||
SMD PPTC RESETTABLE FUSE Product Features: Small surface mountable, Solid state, Faster time to trip than standard SMD devices, Lower resistance than standard SMD devices | AITSEMI 创瑞科技 | | ||
SMD PPTC RESETTABLE FUSE Product Features: Small surface mountable, Solid state, Faster time to trip than standard SMD devices, Lower resistance than standard SMD devices | AITSEMI 创瑞科技 | | ||
SMD PPTC RESETTABLE FUSE Product Features: Small surface mountable, Solid state, Faster time to trip than standard SMD devices, Lower resistance than standard SMD devices | AITSEMI 创瑞科技 | | ||
SMD PPTC RESETTABLE FUSE Product Features: Small surface mountable, Solid state, Faster time to trip than standard SMD devices, Lower resistance than standard SMD devices | AITSEMI 创瑞科技 | | ||
SMD PPTC RESETTABLE FUSE Product Features: Small surface mountable, Solid state, Faster time to trip than standard SMD devices, Lower resistance than standard SMD devices | AITSEMI 创瑞科技 | | ||
SMD PPTC RESETTABLE FUSE Product Features: Small surface mountable, Solid state, Faster time to trip than standard SMD devices, Lower resistance than standard SMD devices | AITSEMI 创瑞科技 | | ||
SMD PPTC RESETTABLE FUSE Product Features: Small surface mountable, Solid state, Faster time to trip than standard SMD devices, Lower resistance than standard SMD devices | AITSEMI 创瑞科技 | | ||
SMD PPTC RESETTABLE FUSE Product Features: Small surface mountable, Solid state, Faster time to trip than standard SMD devices, Lower resistance than standard SMD devices | AITSEMI 创瑞科技 | | ||
SMD PPTC RESETTABLE FUSE Product Features: Small surface mountable, Solid state, Faster time to trip than standard SMD devices, Lower resistance than standard SMD devices | AITSEMI 创瑞科技 | | ||
SMD PPTC RESETTABLE FUSE Product Features: Small surface mountable, Solid state, Faster time to trip than standard SMD devices, Lower resistance than standard SMD devices | AITSEMI 创瑞科技 | | ||
SMD PPTC RESETTABLE FUSE Product Features: Small surface mountable, Solid state, Faster time to trip than standard SMD devices, Lower resistance than standard SMD devices | AITSEMI 创瑞科技 | | ||
SMD PPTC RESETTABLE FUSE Product Features: Small surface mountable, Solid state, Faster time to trip than standard SMD devices, Lower resistance than standard SMD devices | AITSEMI 创瑞科技 | | ||
SMD PPTC RESETTABLE FUSE Product Features: Small surface mountable, Solid state, Faster time to trip than standard SMD devices, Lower resistance than standard SMD devices | AITSEMI 创瑞科技 | | ||
SMD PPTC RESETTABLE FUSE Product Features: Small surface mountable, Solid state, Faster time to trip than standard SMD devices, Lower resistance than standard SMD devices | AITSEMI 创瑞科技 | | ||
SMD PPTC RESETTABLE FUSE Product Features: Small surface mountable, Solid state, Faster time to trip than standard SMD devices, Lower resistance than standard SMD devices | AITSEMI 创瑞科技 | | ||
SMD PPTC RESETTABLE FUSE Product Features: Small surface mountable, Solid state, Faster time to trip than standard SMD devices, Lower resistance than standard SMD devices | AITSEMI 创瑞科技 | | ||
SMD PPTC RESETTABLE FUSE Product Features: Small surface mountable, Solid state, Faster time to trip than standard SMD devices, Lower resistance than standard SMD devices | AITSEMI 创瑞科技 | | ||
SMD PPTC RESETTABLE FUSE Product Features: Small surface mountable, Solid state, Faster time to trip than standard SMD devices, Lower resistance than standard SMD devices | AITSEMI 创瑞科技 | | ||
SMD PPTC RESETTABLE FUSE Product Features: Small surface mountable, Solid state, Faster time to trip than standard SMD devices, Lower resistance than standard SMD devices | AITSEMI 创瑞科技 | | ||
SMD PPTC RESETTABLE FUSE Product Features: Small surface mountable, Solid state, Faster time to trip than standard SMD devices, Lower resistance than standard SMD devices | AITSEMI 创瑞科技 | | ||
SMD PPTC RESETTABLE FUSE Product Features: Small surface mountable, Solid state, Faster time to trip than standard SMD devices, Lower resistance than standard SMD devices | AITSEMI 创瑞科技 | | ||
SMD PPTC RESETTABLE FUSE Product Features: Small surface mountable, Solid state, Faster time to trip than standard SMD devices, Lower resistance than standard SMD devices | AITSEMI 创瑞科技 | | ||
SMD PPTC RESETTABLE FUSE Product Features: Small surface mountable, Solid state, Faster time to trip than standard SMD devices, Lower resistance than standard SMD devices | AITSEMI 创瑞科技 | | ||
SMD PPTC RESETTABLE FUSE Product Features: Small surface mountable, Solid state, Faster time to trip than standard SMD devices, Lower resistance than standard SMD devices | AITSEMI 创瑞科技 | | ||
SMD PPTC RESETTABLE FUSE Product Features: Small surface mountable, Solid state, Faster time to trip than standard SMD devices, Lower resistance than standard SMD devices | AITSEMI 创瑞科技 | | ||
SMD PPTC RESETTABLE FUSE Product Features: Small surface mountable, Solid state, Faster time to trip than standard SMD devices, Lower resistance than standard SMD devices | AITSEMI 创瑞科技 | | ||
SMD PPTC RESETTABLE FUSE Product Features: Small surface mountable, Solid state, Faster time to trip than standard SMD devices, Lower resistance than standard SMD devices | AITSEMI 创瑞科技 | | ||
SMD PPTC RESETTABLE FUSE Product Features: Small surface mountable, Solid state, Faster time to trip than standard SMD devices, Lower resistance than standard SMD devices | AITSEMI 创瑞科技 | | ||
SMD PPTC RESETTABLE FUSE Product Features: Small surface mountable, Solid state, Faster time to trip than standard SMD devices, Lower resistance than standard SMD devices | AITSEMI 创瑞科技 | | ||
SMD PPTC RESETTABLE FUSE Product Features: Small surface mountable, Solid state, Faster time to trip than standard SMD devices, Lower resistance than standard SMD devices | AITSEMI 创瑞科技 | | ||
SMD PPTC RESETTABLE FUSE Product Features: Small surface mountable, Solid state, Faster time to trip than standard SMD devices, Lower resistance than standard SMD devices | AITSEMI 创瑞科技 | | ||
SMD PPTC RESETTABLE FUSE Product Features: Small surface mountable, Solid state, Faster time to trip than standard SMD devices, Lower resistance than standard SMD devices | AITSEMI 创瑞科技 | | ||
SMD Thin-Film Fuse 文件：195.76 Kbytes Page：12 Pages | AVX | | ||
Accu-Guard, SMD Thin-Film Fuse 文件：315.57 Kbytes Page：23 Pages | AVX | | ||
SMD Thin-Film Fuse 文件：195.76 Kbytes Page：12 Pages | AVX | | ||
SMD Thin-Film Fuse 文件：195.76 Kbytes Page：12 Pages | AVX | | ||
SMD Thin-Film Fuse 文件：195.76 Kbytes Page：12 Pages | AVX | | ||
Accu-Guard, SMD Thin-Film Fuse 文件：315.57 Kbytes Page：23 Pages | AVX | | ||
封装/外壳：1206（3216 公制） 包装：卷带（TR）剪切带（CT）Digi-Reel® 得捷定制卷带 描述：FUSE BOARD MNT 250MA 32VDC 1206 电路保护 保险丝 | KSS 京瓷 | | ||
封装/外壳：1206（3216 公制） 包装：卷带（TR） 描述：FUSE BOARD MNT 250MA 32VDC 1206 电路保护 保险丝 | KSS 京瓷 | |
F1206产品属性
- 类型
描述
- 型号
F1206
- 制造商
FIS
| IC供应商 | 芯片型号 | 品牌 | 批号 | 封装 | 库存 | 备注 | 价格 |
|---|---|---|---|---|---|---|---|
AEM |
25+ |
ROHS |
880000 |
明嘉莱只做原装正品现货 |
|||
AVX |
24+ |
21000 |
|||||
AEM |
22+ |
SMD |
5000 |
全新原装现货!价格优惠!可长期 |
|||
AEM |
24+ |
SMD |
9000 |
只做原装正品 有挂有货 假一赔十 |
|||
AVX |
2019+ |
1206 |
30000 |
原厂渠道,提供技术支持 |
|||
AEM |
24+ |
1206 |
88900 |
郑重承诺只做原装进口现货 |
|||
AEM |
24+ |
SMD |
9600 |
原装现货,优势供应,支持实单! |
|||
AEM |
23+ |
SMD |
6800 |
专注配单,只做原装进口现货 |
|||
AEM |
25+ |
SMD1206 |
8000 |
只有原装 |
|||
JDT/集电通 |
2018+ |
SMD |
88000 |
原装现货 |
F1206规格书下载地址
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F0505S-1W ，全新原装当天发货或门市自取0755-82732291.
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DdatasheetPDF页码索引
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