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DA146价格

参考价格:¥57.6211

型号:DA146 品牌:Duracell 备注:这里有DA146多少钱,2025年最近7天走势,今日出价,今日竞价,DA146批发/采购报价,DA146行情走势销售排行榜,DA146报价。
型号 功能描述 生产厂家 企业 LOGO 操作

Bluetooth Low Energy 4.2 SoC with FLASH

Features  Complies to Bluetooth v4.2, ETSI EN 300 328 and EN 300 440 Class 2 (Europe), FCC CFR47 Part 15 (US) and ARIB STD-T66 (Japan)  Flexible processing power  0 Hz up to 96 MHz 32-bit ARM Cortex-M0 with 4-way associative cache  Three optimised power modes (Extended sleep, Deep slee

RENESAS

瑞萨

Bluetooth Low Energy 4.2 SoC FINAL

General description The DA14681 is a flexible System-on-Chip combining an application processor, memories, cryptography engine, power management unit, digital and analog peripherals and a Bluetooth Low Energy MAC engine and radio transceiver. The DA14681 is based on an ARM® Cortex®-M0 CPU d

RENESAS

瑞萨

Bluetooth Low Energy 5.0 SoC with Enhanced Security and FLASH FINAL

General description The DA14682 is a flexible System-on-Chip combining an application processor, memories, cryptography engine, power management unit, digital and analog peripherals and a Bluetooth Low Energy MAC engine and radio transceiver. The DA14682 is based on an Arm® Cortex®-M0 CPU d

RENESAS

瑞萨

Bluetooth Low Energy 5.0 SoC with Enhanced Security

General description The DA14683 is a flexible System-on-Chip combining an application processor, memories, cryptography engine, power management unit, digital and analog peripherals and a Bluetooth Low Energy MAC engine and radio transceiver. The DA14683 is based on an ARM® Cortex®-M0 CPU d

RENESAS

瑞萨

SmartBond Bluetooth® LE 5.2 Module

■ Bluetooth □ Compatible with Bluetooth® 5.2, ETSI EN 300 328 and EN 300 440 Class 2 (Europe), FCC CFR47 Part 15 (US) and ARIB STD-T66 (Japan) □ Supports up to eight connections □ Supports up to 2 Mbps throughput □ Renesas registered BD address preprogrammed in OTP ■ Processing and memori

RENESAS

瑞萨

SmartBond Bluetooth® LE 5.2 Module

■ Bluetooth □ Compatible with Bluetooth® 5.2, ETSI EN 300 328 and EN 300 440 Class 2 (Europe), FCC CFR47 Part 15 (US) and ARIB STD-T66 (Japan) □ Supports up to eight connections □ Supports up to 2 Mbps throughput □ Renesas registered BD address preprogrammed in OTP ■ Processing and memori

RENESAS

瑞萨

SmartBond Bluetooth® LE 5.2 Module

■ Bluetooth □ Compatible with Bluetooth® 5.2, ETSI EN 300 328 and EN 300 440 Class 2 (Europe), FCC CFR47 Part 15 (US) and ARIB STD-T66 (Japan) □ Supports up to eight connections □ Supports up to 2 Mbps throughput □ Renesas registered BD address preprogrammed in OTP ■ Processing and memori

RENESAS

瑞萨

Multi-Core Bluetooth® 5.2 SoC Family with System PMU

Key Features ■ Compatible with Bluetooth® 5.2, ETSI EN 300 328 and EN 300 440 Class 2 (Europe), FCC CFR47 Part 15 (US) and ARIB STDT66 (Japan) ■ Flexible processing power □ 32 kHz up to 96 MHz 32-bit Arm Cortex- M33 with 16 kB, 4-way associative cache and FPU □ A flexible and configurable

RENESAS

瑞萨

The most integrated and flexible Bluetooth짰 low energy SoC

文件:576.05 Kbytes Page:5 Pages

DialogDialog Semiconductor

戴乐格

The most integrated and flexible Bluetooth짰 low energy SoC

文件:576.05 Kbytes Page:5 Pages

DialogDialog Semiconductor

戴乐格

SmartBond™ Bluetooth® Low Energy 4.2 System-on-Chip (SoC)

RENESAS

瑞萨

Bluetooth Low Energy 4.2 SoC

文件:5.29772 Mbytes Page:444 Pages

DialogDialog Semiconductor

戴乐格

Bluetooth Low Energy 4.2 SoC

文件:5.29772 Mbytes Page:444 Pages

DialogDialog Semiconductor

戴乐格

封装/外壳:60-VQFN 双排裸露焊盘 包装:托盘 描述:IC RF TXRX+MCU BLUETOOTH 60VQFN RF/IF,射频/中频和 RFID 射频收发器 IC

ETC

知名厂家

封装/外壳:53-UFBGA,WLCSP 包装:卷带(TR) 描述:IC RF TXRX+MCU BLUETOOTH 53UFBGA RF/IF,射频/中频和 RFID 射频收发器 IC

ETC

知名厂家

Bluetooth Low Energy 4.2 SoC

文件:5.29772 Mbytes Page:444 Pages

DialogDialog Semiconductor

戴乐格

Bluetooth Low Energy 5.0 SoC with Enhanced Security and FLASH

文件:4.51041 Mbytes Page:459 Pages

DialogDialog Semiconductor

戴乐格

SmartBond™ Bluetooth® Low Energy 5.0 SoC with Enhanced Security and Flash

RENESAS

瑞萨

Bluetooth Low Energy 5.0 SoC with Enhanced Security and FLASH

文件:4.51041 Mbytes Page:459 Pages

DialogDialog Semiconductor

戴乐格

Bluetooth Low Energy 5.0 SoC with Enhanced Security

文件:13.85622 Mbytes Page:469 Pages

DialogDialog Semiconductor

戴乐格

SmartBond™ Bluetooth® Low Energy 5.0 SoC with Enhanced Security

RENESAS

瑞萨

Bluetooth Low Energy 5.0 SoC with Enhanced Security

文件:13.85622 Mbytes Page:469 Pages

DialogDialog Semiconductor

戴乐格

Bluetooth Low Energy 5.0 SoC with Enhanced Security

文件:13.85622 Mbytes Page:469 Pages

DialogDialog Semiconductor

戴乐格

Bluetooth Low Energy 5.0 SoC with Enhanced Security

文件:13.85622 Mbytes Page:469 Pages

DialogDialog Semiconductor

戴乐格

INTERCONNECT BATTERY HOLDERS

文件:355.08 Kbytes Page:1 Pages

ETCList of Unclassifed Manufacturers

未分类制造商

LOW PROFILE - P.C. BOARD MOUNT AUDIO TRANSFORMERS

文件:376.28 Kbytes Page:2 Pages

HAMMONDHammond Manufacturing Company Limited

哈蒙德哈蒙德制造有限公司

LOW PROFILE - P.C. BOARD MOUNT AUDIO TRANSFORMERS

文件:376.28 Kbytes Page:2 Pages

HAMMONDHammond Manufacturing Company Limited

哈蒙德哈蒙德制造有限公司

Aluminum Capacitors SMD (Chip), High Temperature, Low Impedance

文件:116.41 Kbytes Page:11 Pages

VishayVishay Siliconix

威世威世科技公司

Aluminum Capacitors SMD (Chip), High Temperature, Low Impedance

文件:134.59 Kbytes Page:11 Pages

VishayVishay Siliconix

威世威世科技公司

更新时间:2025-12-24 19:58:00
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Dialog Semiconductor
20+
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DIALOG
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60AQFN
12500
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原厂可订货,技术支持,直接渠道。可签保供合同
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ORIGINAL
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DIALOG/戴乐格
2450+
QFN
8850
只做原装正品假一赔十为客户做到零风险!!

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