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型号 功能描述 生产厂家 企业 LOGO 操作
DA14695MOD

SmartBond Bluetooth® LE 5.2 Module

■ Bluetooth □ Compatible with Bluetooth® 5.2, ETSI EN 300 328 and EN 300 440 Class 2 (Europe), FCC CFR47 Part 15 (US) and ARIB STD-T66 (Japan) □ Supports up to eight connections □ Supports up to 2 Mbps throughput □ Renesas registered BD address preprogrammed in OTP ■ Processing and memori

RENESAS

瑞萨

DA14695MOD

SmartBond Bluetooth® LE 5.2, High-integration (including USB Charger) Module

Based on the SmartBond DA14695 Bluetooth® Low Energy (LE) 5.2 system-on-chip (SoC), the DA14695 module brings out all the DA14695 hardware features and capabilities. The module integrates all passives, antenna, and a 32Mbit QSPI FLASH, and is supported by software that is easy to work with. The DA14 • Multi-core: CM33F at 96MHz as application core, CM0+ at 96MHz as configurable MAC, sensor node controller\n• Integrated (USB) charger (JEITA support, SW Fuel-gauge)\n• Integrated LCD display controller\n• Receive sensitivity -96dBm, transmit +6dBm\n• 8-ch. 14-bit Sigma-Delta ADC\n• 512KB RAM\n• 7 ;

RENESAS

瑞萨

SmartBond Bluetooth® LE 5.2 Module

■ Bluetooth □ Compatible with Bluetooth® 5.2, ETSI EN 300 328 and EN 300 440 Class 2 (Europe), FCC CFR47 Part 15 (US) and ARIB STD-T66 (Japan) □ Supports up to eight connections □ Supports up to 2 Mbps throughput □ Renesas registered BD address preprogrammed in OTP ■ Processing and memori

RENESAS

瑞萨

SmartBond Bluetooth® LE 5.2 Module

■ Bluetooth □ Compatible with Bluetooth® 5.2, ETSI EN 300 328 and EN 300 440 Class 2 (Europe), FCC CFR47 Part 15 (US) and ARIB STD-T66 (Japan) □ Supports up to eight connections □ Supports up to 2 Mbps throughput □ Renesas registered BD address preprogrammed in OTP ■ Processing and memori

RENESAS

瑞萨

Axial Lead Wirewound Resistors

Material Coating : Conformal Silicone Ceramic Material Core : Ceramic Material Terminals : Solder-Coated Copper Clad axial Lead. Derating Linearly from 100% @ +25°C to 0% @ +275°C Power Rating : Based on 25°C free air rating Overload : >5W: 5 times rated wattage for 5 seconds %5W

MULTICOMP

易络盟

Heyco®-Tite Brass Liquid Tight Cordgrips

文件:112.77 Kbytes Page:1 Pages

HEYCO

HighBay Assembly

文件:1.63358 Mbytes Page:26 Pages

LEDIL

ROHS COMPLIANT AXIAL LEAD WIREWOUND RESISTORS, SILICON, 1

文件:203.17 Kbytes Page:1 Pages

ETCList of Unclassifed Manufacturers

未分类制造商

DA14695MOD产品属性

  • 类型

    描述

  • Wireless Standard:

    BLE 5.2 Core specification + optional features

  • Proprietary 2G4 protocol:

    Yes

  • CPU:

    M33F

  • Flash Memory (KB):

    32000

  • ROM (KB):

    128

  • Memory Size (OTP) (KB):

    4

  • RAM (KB):

    512

  • GPIOs (#):

    40

  • Supply Voltage Vcc Range:

    2.4-4.75

  • Integrated DCDC:

    SIMO Buck DC-DC converter

  • Integrated Battery Charger:

    Yes

  • External Rails and Load Capacity:

    1x 3V @ 150mA

  • Tx Current (mA):

    3

  • Rx current (mA):

    1.8

  • Output Power Range (dBm):

    6

  • Sensitivity (dBm) (dBm):

    -96

  • Clock Rate (MHz):

    96

  • Flexible System Clock:

  • Execute from FLASH:

    是的

  • Hardware Crypto Engine:

    是的

  • QSPI Interface (#):

    1

  • SPI (#):

    2

  • I2C (#):

    2

  • UART (#):

    3

  • ADC:

    4ch 10b

  • USB Ports (#):

    1

  • LE Data Length Extensions:

    Supported

  • 2Mbps:

    Supported

  • LE Coded PHY (Long Range):

    Not Supported

  • Advertising Extensions:

    Supported

  • Periodic Advertising:

    Supported

  • AoA:

    Supported

  • AoD:

    TX Supported

  • GATT Caching:

    Not Supported

  • Bluetooth® Mesh:

    Not Supported

  • Pkg. Type:

    MODULE

更新时间:2026-5-19 16:12:00
IC供应商 芯片型号 品牌 批号 封装 库存 备注 价格
SUNPLUS
25+
QFP
18000
原装正品,全新来谈
Artesyn Embedded Technologies
22+
3000
原装现货 支持实单
N/A
2450+
QFN
9850
只做原厂原装正品现货或订货假一赔十!
SUNPLUS
23+
QFP
98900
原厂原装正品现货!!
N/A
24+
BGA
5645
公司原厂原装现货假一罚十!特价出售!强势库存!
SUNPLUS
16+
TQFP
1685
进口原装现货/价格优势!
IDT/RENESAS
25+
BGA
24500
瑞萨全系列在售
N/A
23+
TSSOP-10
6000
专注配单,只做原装进口现货
ICON ENERGY SYSTEM
23+
SMD
880000
明嘉莱只做原装正品现货
SUNPLUS
25+
QFP
20000
原装

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