Low Power Bluetooth 5.1 SoC

Key Features ■ Compatible with Bluetooth v5.1, ETSI EN 300 328 and EN 300 440 Class 2 (Europe), FCC CFR47 Part 15 (US) and ARIB STD-T66 (Japan) ■ Supports up to three BLE connections ■ Typical cold boot to radio active 35 ms ■ Processing power □ 16 MHz 32-bit Arm® Cortex-M0+ with SWD interfac

SmartBond™ Low Power Bluetooth 5.1 System-on-Chip

Low Power Bluetooth 5.1 SoC

Key Features ■ Compatible with Bluetooth v5.1, ETSI EN 300 328 and EN 300 440 Class 2 (Europe), FCC CFR47 Part 15 (US) and ARIB STD-T66 (Japan) ■ Supports up to three BLE connections ■ Typical cold boot to radio active 35 ms ■ Processing power □ 16 MHz 32-bit Arm® Cortex-M0+ with SWD interfac

Heyco®-Tite Brass Liquid Tight Cordgrips

文件：393.02 Kbytes Page：1 Pages

Florence series

文件：2.65565 Mbytes Page：43 Pages

Florence Lens

文件：2.76398 Mbytes Page：45 Pages

Power Transducer Series LT-UNIT

文件：130.55 Kbytes Page：5 Pages