Key Features

■ Compatible with Bluetooth v5.1, ETSI EN 300 328 and EN 300 440 Class 2 (Europe), FCC CFR47 Part 15 (US) and ARIB STD-T66 (Japan)

■ Supports up to three BLE connections

■ Typical cold boot to radio active 35 ms

■ Processing power

□ 16 MHz 32-bit Arm® Cortex-M0+ with SWD interface

□ 18300 EEMBC IoTMark-BLE® score

□ Dedicated Link Layer and AES-128 Encryption Processor

□ Software-based True Random Number Generator (TRNG)

■ Memories

□ 32 kB One-Time-Programmable (OTP)

□ 48 kB Retainable System RAM

□ 144 kB ROM

■ Power management

□ Integrated core LDO with sleep mode

□ Clock-less hibernation mode 300 nA

□ Built-in temperature sensor for die temperature monitoring