型号 功能描述 生产厂家 企业 LOGO 操作
CC2651R3SIPA

CC2652PSIP SimpleLink??Multiprotocol 2.4-GHz Wireless System-in-Package With Integrated Power Amplifier

1 Features Wireless microcontroller • Powerful 48-MHz Arm® Cortex®-M4F processor • 352KB flash program memory • 256KB of ROM for protocols and library functions • 8KB of cache SRAM • 80KB of ultra-low leakage SRAM with parity for high-reliability operation • Dynamic multiprotocol manager (

TI

德州仪器

CC2651R3SIPA

CC2651R3SIPA SimpleLink™ Multiprotocol 2.4 GHz Wireless System-in-Package Module with integrated Antenna & 352-KB Memory

1 Features Wireless microcontroller • Powerful 48-MHz Arm® Cortex®-M4 processor • 352KB flash program memory • 32KB of ultra-low leakage SRAM • 8KB of Cache SRAM (Alternatively available as general-purpose RAM) • Programmable radio includes support for 2- (G)FSK, 4-(G)FSK, MSK, Bluetooth®

TI

德州仪器

CC2651R3SIPA

具有集成天线的 SimpleLink™ 多协议 2.4GHz 无线系统级封装模块

TI

德州仪器

CC2674P10 SimpleLink™ High-Performance Multiprotocol 2.4-GHz Wireless MCU with Integrated Power Amplifier

1 Features Wireless microcontroller • Powerful 48 MHz Arm® Cortex®-M33 processor with TrustZone® • FPU and DSP extension • 1024 kB flash program memory • 8 kB of cache SRAM • 256 kB of ultra-low leakage SRAM with parity for high-reliability operation – 32 kB of additional SRAM is availabl

TI

德州仪器

CC2652PSIP SimpleLink??Multiprotocol 2.4-GHz Wireless System-in-Package With Integrated Power Amplifier

1 Features Wireless microcontroller • Powerful 48-MHz Arm® Cortex®-M4F processor • 352KB flash program memory • 256KB of ROM for protocols and library functions • 8KB of cache SRAM • 80KB of ultra-low leakage SRAM with parity for high-reliability operation • Dynamic multiprotocol manager (

TI

德州仪器

CC2642R-Q1 SimpleLink™ Bluetooth® 5.2 Low Energy Wireless MCU

1 Features Wireless microcontroller • Powerful 48-MHz Arm® Cortex®-M4 processor • EEMBC CoreMark® score: 148 • 352KB flash program memory • 256KB of ROM for protocols and library functions • 8KB of cache SRAM • 80KB of ultra-low leakage SRAM with parity for high-reliability operation • 2-

TI

德州仪器

CC2651R3 SimpleLink??Multiprotocol 2.4 GHz Wireless MCU

文件:2.66363 Mbytes Page:60 Pages

TI

德州仪器

CC2651P3 SimpleLink??Single-Protocol 2.4 GHz Wireless MCU With Integrated Power Amplifier

文件:3.51768 Mbytes Page:63 Pages

TI

德州仪器

CC2651R3SIPA SimpleLink™ Multiprotocol 2.4 GHz Wireless System-in-Package Module with integrated Antenna & 352-KB Memory

1 Features Wireless microcontroller • Powerful 48-MHz Arm® Cortex®-M4 processor • 352KB flash program memory • 32KB of ultra-low leakage SRAM • 8KB of Cache SRAM (Alternatively available as general-purpose RAM) • Programmable radio includes support for 2- (G)FSK, 4-(G)FSK, MSK, Bluetooth®

TI

德州仪器

更新时间:2025-12-19 15:28:00
IC供应商 芯片型号 品牌 批号 封装 库存 备注 价格
TI
21+
QFN48
10000
只做原装,质量保证
Texas Instruments
24+
VQFN-48
3265
全新原厂原装,进口正品现货,正规渠道可含税!!
TI/德州仪器
2223+
QFN48
26800
只做原装正品假一赔十为客户做到零风险
TI/德州仪器
22+
QFN48
12245
现货,原厂原装假一罚十!
TI/德州仪器
25+
原厂封装
10280
原厂授权代理,专注军工、汽车、医疗、工业、新能源!
TI/德州仪器
2023+
SMD
30018
原厂全新正品旗舰店优势现货
TI(德州仪器)
23+
N/A
6000
公司只做原装,可来电咨询
TI(德州仪器)
23+
VQFN-48(7x7)
13650
公司只做原装正品,假一赔十
TI
24+
VQFN48
39500
进口原装现货 支持实单价优
23+
TSSOP
7300
专注配单,只做原装进口现货

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