位置:CC2651R3SIPAT0MOUR > CC2651R3SIPAT0MOUR详情
CC2651R3SIPAT0MOUR中文资料
CC2651R3SIPAT0MOUR数据手册规格书PDF详情
1 Features
Wireless microcontroller
• Powerful 48-MHz Arm® Cortex®-M4 processor
• 352KB flash program memory
• 32KB of ultra-low leakage SRAM
• 8KB of Cache SRAM (Alternatively available as
general-purpose RAM)
• Programmable radio includes support for 2-
(G)FSK, 4-(G)FSK, MSK, Bluetooth® 5.2 Low
Energy, IEEE 802.15.4 PHY and MAC
• Supports over-the-air upgrade (OTA)
Low power consumption
• MCU consumption:
– 3.60 mA active mode, CoreMark
– 61 μA/MHz running CoreMark
– 0.8 μA standby mode, RTC, 32KB RAM
– 0.1 μA shutdown mode, wake-up on pin
• Radio Consumption:
– 6.8 mA RX
– 7.1 mA TX at 0 dBm
– 9.6 mA TX at +5 dBm
Wireless protocol support
• Zigbee®
• Bluetooth® 5.2 Low Energy
• SimpleLink™ TI 15.4-stack
• Proprietary systems
High performance radio
• -104 dBm for Bluetooth® Low Energy 125-kbps
• Output power up to +5 dBm with temperature
compensation
Regulatory compliance
• Regulatory certification for compliance with
worldwide radio frequency:
– ETSI RED (Europe)
– ISED (Canada)
– FCC (USA)
MCU peripherals
• Digital peripherals can be routed to any GPIO
• Four 32-bit or eight 16-bit general-purpose timers
• 12-bit ADC, 200 kSamples/s, 8 channels
• 8-bit DAC
• Two comparators
• Programmable current source
• UART, SSI, I2C, I2S
• Real-time clock (RTC)
• Integrated temperature and battery monitor
Security enablers
• AES 128-bit cryptographic accelerator
• True random number generator (TRNG)
• Additional cryptography drivers available in
Software Development Kit (SDK)
Development tools and software
• LP-CC2651R3SIPA Development Kit
• SimpleLink™ CC13xx and CC26xx Software
Development Kit (SDK)
• SmartRF™ Studio for simple radio configuration
• SysConfig system configuration tool
Operating range
• On-chip buck DC/DC converter
• 1.8-V to 3.8-V single supply voltage
• Tj: -40 to +105°C
Package
• 7-mm × 7-mm MOU (32 GPIOs)
• RoHS-compliant package
3 Description
The SimpleLink™ CC2651R3SIPA device is a multiprotocol 2.4-GHz wireless microcontroller (MCU) supporting
Zigbee®, Bluetooth® 5.2 Low Energy, IEEE 802.15.4g, TI 15.4-Stack (2.4 GHz). The CC2651R3SIPA is
based on an Arm® Cortex® M4 main processor and optimized for low-power wireless communication and
advanced sensing in grid infrastructure, building automation, retail automation, personal electronics and medical
applications.
The CC2651R3SIPA is an ultra-compact 7-mm x 7-mm certified wireless module 2.4 GHz with integrated
antenna, DCDC components, Balun, and high frequency crystal oscillator.
The CC2651R3SIPA has a software defined radio powered by an Arm® Cortex® M0, which allows support for
multiple physical layers and RF standards. The device supports operation in the 2360 to 2500-MHz frequency
band. The CC2651R3SIPA supports +5 dBm TX at 9.6 mA in the 2.4-GHz band. CC2651R3SIPA has a receive
sensitivity of -104 dBm for 125-kbps Bluetooth® Low Energy Coded PHY.
The CC2651R3SIPA has a low sleep current of 0.9 μA with RTC and 32KB RAM retention.
TI has a product life cycle policy with a commitment to product longevity and continuity of supply.
The CC2651R3SIPA device is part of the SimpleLink™ MCU platform, which consists of Wi-Fi®, Bluetooth® Low
Energy, Thread, Zigbee, Wi-SUN®, Amazon Sidewalk, mioty, Sub-1 GHz MCUs, and host MCU.CC2651R3SIPA
is part of a scalable portfolio with flash sizes from 32KB to 704KB with pin-to-pin compatible package options.
The common SimpleLink™CC13xx and CC26xx Software Development Kit (SDK) and SysConfig system
configuration tool supports migration between devices in the portfolio. A comprehensive number of software
stacks, application examples and SimpleLink™ Academy training sessions are included in the SDK. For more
information, visit wireless connectivity.
供应商 | 型号 | 品牌 | 批号 | 封装 | 库存 | 备注 | 价格 |
---|---|---|---|---|---|---|---|
TI |
23+ |
QFM50 |
24500 |
交个朋友支持实单 |
|||
TI/德州仪器 |
25+ |
原厂封装 |
10000 |
||||
TI |
25+ |
原封装 |
66330 |
郑重承诺只做原装进口现货 |
|||
TI/德州仪器 |
25+ |
原厂封装 |
10280 |
原厂授权代理,专注军工、汽车、医疗、工业、新能源! |
|||
TI/德州仪器 |
25+ |
原厂封装 |
9999 |
||||
TI/德州仪器 |
25+ |
原厂封装 |
10280 |
||||
TI(德州仪器) |
25+ |
QFM-59(7x7) |
500000 |
源自原厂成本,高价回收工厂呆滞 |
|||
TI |
21+ |
QFN48 |
10000 |
原装,品质保证,请来电咨询 |
|||
TI |
24+ |
QFN48 |
30000 |
原装正品公司现货,假一赔十! |
|||
TI |
24+ |
QFN48 |
6000 |
全新原装深圳仓库现货有单必成 |
CC2651R3SIPAT0MOUR 资料下载更多...
CC2651R3SIPAT0MOUR 芯片相关型号
Datasheet数据表PDF页码索引
- P1
- P2
- P3
- P4
- P5
- P6
- P7
- P8
- P9
- P10
- P11
- P12
- P13
- P14
- P15
- P16
- P17
- P18
- P19
- P20
- P21
- P22
- P23
- P24
- P25
- P26
- P27
- P28
- P29
- P30
- P31
- P32
- P33
- P34
- P35
- P36
- P37
- P38
- P39
- P40
- P41
- P42
- P43
- P44
- P45
- P46
- P47
- P48
- P49
- P50
- P51
- P52
- P53
- P54
- P55
- P56
- P57
- P58
- P59
- P60
- P61
- P62
- P63
- P64
- P65
- P66
- P67
- P68
- P69
- P70
- P71
- P72
- P73
- P74
- P75
- P76
- P77
- P78
- P79
- P80
- P81
- P82
- P83
- P84
- P85
- P86
- P87
- P88
- P89
- P90
- P91
- P92
- P93
- P94
- P95
- P96
- P97
- P98
- P99
- P100
- P101
- P102
- P103
- P104
- P105