型号 功能描述 生产厂家&企业 LOGO 操作
CC2651R3

CC2674R10SimpleLink™High-PerformanceMultiprotocol2.4-GHzWirelessMCU

1Features Wirelessmicrocontroller •Powerful48MHzArm®Cortex®-M33processor withTrustZone® •FPUandDSPextension •1024kBflashprogrammemory •8kBofcacheSRAM •256kBofultra-lowleakageSRAMwithparityfor high-reliabilityoperation –32kBofadditionalSRAMisavailabl

TI1Texas Instruments(TI)

德州仪器德州仪器 (TI)

TI1
CC2651R3

CC2674P10SimpleLink™High-PerformanceMultiprotocol2.4-GHzWirelessMCUwithIntegratedPowerAmplifier

1Features Wirelessmicrocontroller •Powerful48MHzArm®Cortex®-M33processor withTrustZone® •FPUandDSPextension •1024kBflashprogrammemory •8kBofcacheSRAM •256kBofultra-lowleakageSRAMwithparityfor high-reliabilityoperation –32kBofadditionalSRAMisavailabl

TITexas Instruments

德州仪器美国德州仪器公司

TI
CC2651R3

CC2652PSIPSimpleLink??Multiprotocol2.4-GHzWirelessSystem-in-PackageWithIntegratedPowerAmplifier

1Features Wirelessmicrocontroller •Powerful48-MHzArm®Cortex®-M4Fprocessor •352KBflashprogrammemory •256KBofROMforprotocolsandlibraryfunctions •8KBofcacheSRAM •80KBofultra-lowleakageSRAMwithparityfor high-reliabilityoperation •Dynamicmultiprotocolmanager(

TITexas Instruments

德州仪器美国德州仪器公司

TI
CC2651R3

CC2642R-Q1SimpleLink™Bluetooth®5.2LowEnergyWirelessMCU

1Features Wirelessmicrocontroller •Powerful48-MHzArm®Cortex®-M4processor •EEMBCCoreMark®score:148 •352KBflashprogrammemory •256KBofROMforprotocolsandlibraryfunctions •8KBofcacheSRAM •80KBofultra-lowleakageSRAMwithparityfor high-reliabilityoperation •2-

TITexas Instruments

德州仪器美国德州仪器公司

TI
CC2651R3

CC1354P10SimpleLink™High-PerformanceMulti-bandWirelessMCUWithIntegratedPowerAmplifier

1Features Wirelessmicrocontroller •Powerful48MHzArm®Cortex®-M33processor withTrustZone® •FPUandDSPextension •1024kBflashprogrammemory •8kBofcacheSRAM •256kBofultra-lowleakageSRAMwithparityfor high-reliabilityoperation –32kBofadditionalSRAMisavailabl

TI1Texas Instruments(TI)

德州仪器德州仪器 (TI)

TI1
CC2651R3

CC2340R5-Q1SimpleLink™Bluetooth®5.3LowEnergyWirelessMCU

1Features Wirelessmicrocontroller •AEC-Q100Grade2qualifiedforAutomotive applications •Optimized48-MHzArm®Cortex®-M0+processor •512KBofin-systemprogrammableflash •12KBofROMforbootloaderanddrivers •36KBofultra-lowleakageSRAM.FullRAM retentioninstandbymod

TI1Texas Instruments(TI)

德州仪器德州仪器 (TI)

TI1
CC2651R3

CC2340R2SimpleLink™Bluetooth®5.3LowEnergyWirelessMCU

1Features Wirelessmicrocontroller •Optimized48-MHzArm®Cortex®-M0+processor •256KBofin-systemprogrammableflash •12KBofROMforbootloaderanddrivers •28KBofultra-lowleakageSRAM.FullRAM retentioninstandbymode •2.4GHzRFtransceivercompatiblewith Bluetooth®5.3

TI1Texas Instruments(TI)

德州仪器德州仪器 (TI)

TI1
CC2651R3

CC2340R2SimpleLink™Bluetooth®5.3LowEnergyWirelessMCU

1Features Wirelessmicrocontroller •Optimized48-MHzArm®Cortex®-M0+processor •256KBofin-systemprogrammableflash •12KBofROMforbootloaderanddrivers •28KBofultra-lowleakageSRAM.FullRAM retentioninstandbymode •2.4GHzRFtransceivercompatiblewith Bluetooth®5.3

TI1Texas Instruments(TI)

德州仪器德州仪器 (TI)

TI1
CC2651R3

CC2651R3SimpleLink??Multiprotocol2.4GHzWirelessMCU

文件:2.66363 Mbytes Page:60 Pages

TITexas Instruments

德州仪器美国德州仪器公司

TI
CC2651R3

CC2651P3SimpleLink??Single-Protocol2.4GHzWirelessMCUWithIntegratedPowerAmplifier

文件:3.51768 Mbytes Page:63 Pages

TITexas Instruments

德州仪器美国德州仪器公司

TI

CC2652PSIPSimpleLink??Multiprotocol2.4-GHzWirelessSystem-in-PackageWithIntegratedPowerAmplifier

1Features Wirelessmicrocontroller •Powerful48-MHzArm®Cortex®-M4Fprocessor •352KBflashprogrammemory •256KBofROMforprotocolsandlibraryfunctions •8KBofcacheSRAM •80KBofultra-lowleakageSRAMwithparityfor high-reliabilityoperation •Dynamicmultiprotocolmanager(

TITexas Instruments

德州仪器美国德州仪器公司

TI

CC2651R3SIPASimpleLink™Multiprotocol2.4GHzWirelessSystem-in-PackageModulewithintegratedAntenna&352-KBMemory

1Features Wirelessmicrocontroller •Powerful48-MHzArm®Cortex®-M4processor •352KBflashprogrammemory •32KBofultra-lowleakageSRAM •8KBofCacheSRAM(Alternativelyavailableas general-purposeRAM) •Programmableradioincludessupportfor2- (G)FSK,4-(G)FSK,MSK,Bluetooth®

TITexas Instruments

德州仪器美国德州仪器公司

TI

CC2651R3SIPASimpleLink™Multiprotocol2.4GHzWirelessSystem-in-PackageModulewithintegratedAntenna&352-KBMemory

1Features Wirelessmicrocontroller •Powerful48-MHzArm®Cortex®-M4processor •352KBflashprogrammemory •32KBofultra-lowleakageSRAM •8KBofCacheSRAM(Alternativelyavailableas general-purposeRAM) •Programmableradioincludessupportfor2- (G)FSK,4-(G)FSK,MSK,Bluetooth®

TITexas Instruments

德州仪器美国德州仪器公司

TI

CC2651R3SimpleLink??Multiprotocol2.4GHzWirelessMCU

文件:2.66363 Mbytes Page:60 Pages

TITexas Instruments

德州仪器美国德州仪器公司

TI

CC2651R3SimpleLink??Multiprotocol2.4GHzWirelessMCU

文件:2.66363 Mbytes Page:60 Pages

TITexas Instruments

德州仪器美国德州仪器公司

TI

封装/外壳:40-VFQFN 裸露焊盘 包装:卷带(TR) 描述:SIMPLELINK32-BIT ARMCORTEX-M4 SI RF/IF,射频/中频和 RFID 射频收发器 IC

TITexas Instruments

德州仪器美国德州仪器公司

TI
更新时间:2024-6-5 9:21:00
IC供应商 芯片型号 品牌 批号 封装 库存 备注 价格
Texas Instruments
2235+
QFM-50
6500
原装正品 公司现货 价格优惠
Texas Instruments
21+
48-VFQFN 裸露焊盘
12000
RF/IF/RFID全系配套产品,原装正品现货!
TI
22+
VQFN
9850
只做原装正品假一赔十!正规渠道订货!
TI(德州仪器)
10000
原装正品长期供货,如假包赔包换 徐小姐13714450367
TI(德州仪器)
23+
N/A
589610
新到现货 原厂一手货源 价格秒杀代理!
TI/德州仪器
22+
VQFN48
12500
原装正品
TI
21+
QFN48
12800
公司只做原装,诚信经营
TI
2339+
QFN48
32280
原装现货 假一罚十!十年信誉只做原装!
TI
23+
QFM50
24500
交个朋友支持实单
TI
22+
QFN48
258825
优势价格原装现货提供BOM一站式配单服务

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