型号 功能描述 生产厂家&企业 LOGO 操作
CC2651R3

CC2674R10SimpleLink™High-PerformanceMultiprotocol2.4-GHzWirelessMCU

1Features Wirelessmicrocontroller •Powerful48MHzArm®Cortex®-M33processor withTrustZone® •FPUandDSPextension •1024kBflashprogrammemory •8kBofcacheSRAM •256kBofultra-lowleakageSRAMwithparityfor high-reliabilityoperation –32kBofadditionalSRAMisavailabl

TI1Texas Instruments

德州仪器美国德州仪器公司

TI1
CC2651R3

CC2674P10SimpleLink™High-PerformanceMultiprotocol2.4-GHzWirelessMCUwithIntegratedPowerAmplifier

1Features Wirelessmicrocontroller •Powerful48MHzArm®Cortex®-M33processor withTrustZone® •FPUandDSPextension •1024kBflashprogrammemory •8kBofcacheSRAM •256kBofultra-lowleakageSRAMwithparityfor high-reliabilityoperation –32kBofadditionalSRAMisavailabl

TITexas Instruments

德州仪器美国德州仪器公司

TI
CC2651R3

CC2652PSIPSimpleLink??Multiprotocol2.4-GHzWirelessSystem-in-PackageWithIntegratedPowerAmplifier

1Features Wirelessmicrocontroller •Powerful48-MHzArm®Cortex®-M4Fprocessor •352KBflashprogrammemory •256KBofROMforprotocolsandlibraryfunctions •8KBofcacheSRAM •80KBofultra-lowleakageSRAMwithparityfor high-reliabilityoperation •Dynamicmultiprotocolmanager(

TITexas Instruments

德州仪器美国德州仪器公司

TI
CC2651R3

CC2642R-Q1SimpleLink™Bluetooth®5.2LowEnergyWirelessMCU

1Features Wirelessmicrocontroller •Powerful48-MHzArm®Cortex®-M4processor •EEMBCCoreMark®score:148 •352KBflashprogrammemory •256KBofROMforprotocolsandlibraryfunctions •8KBofcacheSRAM •80KBofultra-lowleakageSRAMwithparityfor high-reliabilityoperation •2-

TITexas Instruments

德州仪器美国德州仪器公司

TI
CC2651R3

CC1354P10SimpleLink™High-PerformanceMulti-bandWirelessMCUWithIntegratedPowerAmplifier

1Features Wirelessmicrocontroller •Powerful48MHzArm®Cortex®-M33processor withTrustZone® •FPUandDSPextension •1024kBflashprogrammemory •8kBofcacheSRAM •256kBofultra-lowleakageSRAMwithparityfor high-reliabilityoperation –32kBofadditionalSRAMisavailabl

TI1Texas Instruments

德州仪器美国德州仪器公司

TI1
CC2651R3

CC2340R5-Q1SimpleLink™Bluetooth®5.3LowEnergyWirelessMCU

1Features Wirelessmicrocontroller •AEC-Q100Grade2qualifiedforAutomotive applications •Optimized48-MHzArm®Cortex®-M0+processor •512KBofin-systemprogrammableflash •12KBofROMforbootloaderanddrivers •36KBofultra-lowleakageSRAM.FullRAM retentioninstandbymod

TI1Texas Instruments

德州仪器美国德州仪器公司

TI1
CC2651R3

CC2340R2SimpleLink™Bluetooth®5.3LowEnergyWirelessMCU

1Features Wirelessmicrocontroller •Optimized48-MHzArm®Cortex®-M0+processor •256KBofin-systemprogrammableflash •12KBofROMforbootloaderanddrivers •28KBofultra-lowleakageSRAM.FullRAM retentioninstandbymode •2.4GHzRFtransceivercompatiblewith Bluetooth®5.3

TI1Texas Instruments

德州仪器美国德州仪器公司

TI1
CC2651R3

CC2340R2SimpleLink™Bluetooth®5.3LowEnergyWirelessMCU

1Features Wirelessmicrocontroller •Optimized48-MHzArm®Cortex®-M0+processor •256KBofin-systemprogrammableflash •12KBofROMforbootloaderanddrivers •28KBofultra-lowleakageSRAM.FullRAM retentioninstandbymode •2.4GHzRFtransceivercompatiblewith Bluetooth®5.3

TI1Texas Instruments

德州仪器美国德州仪器公司

TI1
CC2651R3

CC1314R10SimpleLink™High-PerformanceSub-1GHzWirelessMCU

1Features Wirelessmicrocontroller •Powerful48MHzArm®Cortex®-M33processor withTrustZone® •FPUandDSPextension •1024kBflashprogrammemory •8kBofcacheSRAM •256kBofultra-lowleakageSRAMwithparityfor high-reliabilityoperation –32kBofadditionalSRAMifparityisdis

TI1Texas Instruments

德州仪器美国德州仪器公司

TI1
CC2651R3

CC2674P10SimpleLink™High-PerformanceMultiprotocol2.4GHzWirelessMCUwithIntegratedPowerAmplifier

1Features Wirelessmicrocontroller •Powerful48MHzArm®Cortex®-M33processor withTrustZone® •FPUandDSPextension •1024kBflashprogrammemory •8kBofcacheSRAM •256kBofultra-lowleakageSRAMwithparityfor high-reliabilityoperation –32kBofadditionalSRAMifparityisdis

TI1Texas Instruments

德州仪器美国德州仪器公司

TI1
CC2651R3

CC2651R3SimpleLink??Multiprotocol2.4GHzWirelessMCU

文件:2.66363 Mbytes Page:60 Pages

TITexas Instruments

德州仪器美国德州仪器公司

TI
CC2651R3

CC2651P3SimpleLink??Single-Protocol2.4GHzWirelessMCUWithIntegratedPowerAmplifier

文件:3.51768 Mbytes Page:63 Pages

TITexas Instruments

德州仪器美国德州仪器公司

TI

CC2652PSIPSimpleLink??Multiprotocol2.4-GHzWirelessSystem-in-PackageWithIntegratedPowerAmplifier

1Features Wirelessmicrocontroller •Powerful48-MHzArm®Cortex®-M4Fprocessor •352KBflashprogrammemory •256KBofROMforprotocolsandlibraryfunctions •8KBofcacheSRAM •80KBofultra-lowleakageSRAMwithparityfor high-reliabilityoperation •Dynamicmultiprotocolmanager(

TITexas Instruments

德州仪器美国德州仪器公司

TI

CC2651R3SIPASimpleLink™Multiprotocol2.4GHzWirelessSystem-in-PackageModulewithintegratedAntenna&352-KBMemory

1Features Wirelessmicrocontroller •Powerful48-MHzArm®Cortex®-M4processor •352KBflashprogrammemory •32KBofultra-lowleakageSRAM •8KBofCacheSRAM(Alternativelyavailableas general-purposeRAM) •Programmableradioincludessupportfor2- (G)FSK,4-(G)FSK,MSK,Bluetooth®

TITexas Instruments

德州仪器美国德州仪器公司

TI

CC2651R3SIPASimpleLink™Multiprotocol2.4GHzWirelessSystem-in-PackageModulewithintegratedAntenna&352-KBMemory

1Features Wirelessmicrocontroller •Powerful48-MHzArm®Cortex®-M4processor •352KBflashprogrammemory •32KBofultra-lowleakageSRAM •8KBofCacheSRAM(Alternativelyavailableas general-purposeRAM) •Programmableradioincludessupportfor2- (G)FSK,4-(G)FSK,MSK,Bluetooth®

TITexas Instruments

德州仪器美国德州仪器公司

TI

CC2651R3SimpleLink??Multiprotocol2.4GHzWirelessMCU

文件:2.66363 Mbytes Page:60 Pages

TITexas Instruments

德州仪器美国德州仪器公司

TI

CC2651R3SimpleLink??Multiprotocol2.4GHzWirelessMCU

文件:2.66363 Mbytes Page:60 Pages

TITexas Instruments

德州仪器美国德州仪器公司

TI

封装/外壳:40-VFQFN 裸露焊盘 包装:卷带(TR) 描述:SIMPLELINK32-BIT ARMCORTEX-M4 SI RF/IF,射频/中频和 RFID 射频收发器 IC

TI2Texas Instruments

德州仪器美国德州仪器公司

TI2
更新时间:2025-6-27 17:41:00
IC供应商 芯片型号 品牌 批号 封装 库存 备注 价格
TI(德州仪器)
2021+
VQFN-48(7x7)
499
TI
23+
QFN48
12700
买原装认准中赛美
TI/德州仪器
25+
原厂封装
10280
原厂授权代理,专注军工、汽车、医疗、工业、新能源!
TI
23+
QFN48
25630
原装正品
TI
24+
QFN48
30000
原装正品公司现货,假一赔十!
TI
21+
QFN48
10000
只做原装,质量保证
TI/德州仪器
2023+
SMD
30018
原厂全新正品旗舰店优势现货
TI(德州仪器)
23+
NA
20094
正纳10年以上分销经验原装进口正品做服务做口碑有支持
TI/德州仪器
24+
VQFN48
5000
原装正品现货假一罚十
TI(德州仪器)
24+/25+
10000
原装正品现货库存价优

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