| 型号 | 功能描述 | 生产厂家 企业 | LOGO | 操作 |
|---|---|---|---|---|
CC2651R3 | CC2674R10 SimpleLink™ High-Performance Multiprotocol 2.4-GHz Wireless MCU 1 Features Wireless microcontroller • Powerful 48 MHz Arm® Cortex®-M33 processor with TrustZone® • FPU and DSP extension • 1024 kB flash program memory • 8 kB of cache SRAM • 256 kB of ultra-low leakage SRAM with parity for high-reliability operation – 32 kB of additional SRAM is availabl | TI 德州仪器 | ||
CC2651R3 | CC2674P10 SimpleLink™ High-Performance Multiprotocol 2.4-GHz Wireless MCU with Integrated Power Amplifier 1 Features Wireless microcontroller • Powerful 48 MHz Arm® Cortex®-M33 processor with TrustZone® • FPU and DSP extension • 1024 kB flash program memory • 8 kB of cache SRAM • 256 kB of ultra-low leakage SRAM with parity for high-reliability operation – 32 kB of additional SRAM is availabl | TI 德州仪器 | ||
CC2651R3 | CC2652PSIP SimpleLink??Multiprotocol 2.4-GHz Wireless System-in-Package With Integrated Power Amplifier 1 Features Wireless microcontroller • Powerful 48-MHz Arm® Cortex®-M4F processor • 352KB flash program memory • 256KB of ROM for protocols and library functions • 8KB of cache SRAM • 80KB of ultra-low leakage SRAM with parity for high-reliability operation • Dynamic multiprotocol manager ( | TI 德州仪器 | ||
CC2651R3 | CC2642R-Q1 SimpleLink™ Bluetooth® 5.2 Low Energy Wireless MCU 1 Features Wireless microcontroller • Powerful 48-MHz Arm® Cortex®-M4 processor • EEMBC CoreMark® score: 148 • 352KB flash program memory • 256KB of ROM for protocols and library functions • 8KB of cache SRAM • 80KB of ultra-low leakage SRAM with parity for high-reliability operation • 2- | TI 德州仪器 | ||
CC2651R3 | CC1354P10 SimpleLink™ High-Performance Multi-band Wireless MCU With Integrated Power Amplifier 1 Features Wireless microcontroller • Powerful 48 MHz Arm® Cortex®-M33 processor with TrustZone® • FPU and DSP extension • 1024 kB flash program memory • 8 kB of cache SRAM • 256 kB of ultra-low leakage SRAM with parity for high-reliability operation – 32 kB of additional SRAM is availabl | TI 德州仪器 | ||
CC2651R3 | CC2340R5-Q1 SimpleLink™ Bluetooth ® 5.3 Low Energy Wireless MCU 1 Features Wireless microcontroller • AEC-Q100 Grade 2 qualified for Automotive applications • Optimized 48-MHz Arm® Cortex®-M0+ processor • 512 KB of in-system programmable flash • 12 KB of ROM for bootloader and drivers • 36 KB of ultra-low leakage SRAM. Full RAM retention in standby mod | TI 德州仪器 | ||
CC2651R3 | CC2340R2 SimpleLink™ Bluetooth ® 5.3 Low Energy Wireless MCU 1 Features Wireless microcontroller • Optimized 48-MHz Arm® Cortex®-M0+ processor • 256 KB of in-system programmable flash • 12 KB of ROM for bootloader and drivers • 28 KB of ultra-low leakage SRAM. Full RAM retention in standby mode • 2.4 GHz RF transceiver compatible with Bluetooth® 5.3 | TI 德州仪器 | ||
CC2651R3 | CC2340R2 SimpleLink™ Bluetooth ® 5.3 Low Energy Wireless MCU 1 Features Wireless microcontroller • Optimized 48-MHz Arm® Cortex®-M0+ processor • 256 KB of in-system programmable flash • 12 KB of ROM for bootloader and drivers • 28 KB of ultra-low leakage SRAM. Full RAM retention in standby mode • 2.4 GHz RF transceiver compatible with Bluetooth® 5.3 | TI 德州仪器 | ||
CC2651R3 | CC1314R10 SimpleLink™ High-Performance Sub-1GHz Wireless MCU 1 Features Wireless microcontroller • Powerful 48MHz Arm® Cortex®-M33 processor with TrustZone® • FPU and DSP extension • 1024kB flash program memory • 8kB of cache SRAM • 256kB of ultra-low leakage SRAM with parity for high-reliability operation – 32kB of additional SRAM if parity is dis | TI 德州仪器 | ||
CC2651R3 | CC2674P10 SimpleLink™ High-Performance Multiprotocol 2.4GHz Wireless MCU with Integrated Power Amplifier 1 Features Wireless microcontroller • Powerful 48MHz Arm® Cortex®-M33 processor with TrustZone® • FPU and DSP extension • 1024kB flash program memory • 8kB of cache SRAM • 256kB of ultra-low leakage SRAM with parity for high-reliability operation – 32kB of additional SRAM if parity is dis | TI 德州仪器 | ||
CC2651R3 | CC2642R SimpleLink™ Bluetooth ® 5.2 Low Energy Wireless MCU 1 Features • Microcontroller – Powerful 48 MHz Arm® Cortex®-M4F processor – EEMBC CoreMark® score: 148 – 352 kB of in-system programmable flash – 256 kB of ROM for protocols and library functions – 8 kB of cache SRAM (alternatively available as general-purpose RAM) – 80 kB of ultra-low le | TI 德州仪器 | ||
CC2651R3 | CC2652R SimpleLink™ Multiprotocol 2.4 GHz Wireless MCU 1 Features • Microcontroller – Powerful 48 MHz Arm® Cortex®-M4F processor – EEMBC CoreMark® score: 148 – 352 kB of in-system programmable flash – 256 kB of ROM for protocols and library functions – 8 kB of cache SRAM (alternatively available as general-purpose RAM) – 80 kB of ultra-low le | TI 德州仪器 | ||
CC2651R3 | 具有 352KB 闪存的 SimpleLink™ 32 位 Arm® Cortex®-M4 单协议 2.4GHz 无线 MCU SimpleLink™ CC2651R3 器件是一款多协议 2.4GHz 无线微控制器 (MCU),支持Zigbee 、低功耗 蓝牙5.2、IEEE 802.15.4、支持 IPv6 的智能对象 (6LoWPAN) 以及专有系统(包括 TI 15.4-Stack (2.4GHz))。该器件经过优化,可用于楼宇安防系统、HVAC、医疗、有线网络、便携式电子产品、家庭影院和娱乐以及联网外设市场中的低功耗无线通信和高级检测。该器件的突出特性包括: SimpleLink™ CC13x2 和 CC26x2 软件开发套件 (SDK) 提供丰富灵活的协议栈支持。 完全 RAM 保持时具有 0.92µA 的低 • 微控制器 \n• EEMBC CoreMark 评分:148\n• 8KB 缓存 SRAM(也可作为通用 RAM 提供)\n• 双引脚 cJTAG 和 JTAG 调试\n• 符合 RoHS 标准的封装 \n• 5mm × 5mm RKP VQFN40( 23 个 GPIO)\n• 外设 \n• 四个 32 位或八个 16 位通用计时器\n• 具有内部 DAC 的比较器\n• SSI(SPI、MICROWIRE、TI)\n• I2S\n• AES 128 位加密加速计\n• 集成温度和电池监控器\n• 外部系统 \n• 低功耗 \n• 有源模式 RX:6.8 mA\n• 有源模式 TX (5; | TI 德州仪器 | ||
CC2651R3 | CC2651R3 SimpleLink??Multiprotocol 2.4 GHz Wireless MCU 文件:2.66363 Mbytes Page:60 Pages | TI 德州仪器 | ||
CC2651R3 | CC2651P3 SimpleLink??Single-Protocol 2.4 GHz Wireless MCU With Integrated Power Amplifier 文件:3.51768 Mbytes Page:63 Pages | TI 德州仪器 | ||
CC2652PSIP SimpleLink??Multiprotocol 2.4-GHz Wireless System-in-Package With Integrated Power Amplifier 1 Features Wireless microcontroller • Powerful 48-MHz Arm® Cortex®-M4F processor • 352KB flash program memory • 256KB of ROM for protocols and library functions • 8KB of cache SRAM • 80KB of ultra-low leakage SRAM with parity for high-reliability operation • Dynamic multiprotocol manager ( | TI 德州仪器 | |||
CC2651R3SIPA SimpleLink™ Multiprotocol 2.4 GHz Wireless System-in-Package Module with integrated Antenna & 352-KB Memory 1 Features Wireless microcontroller • Powerful 48-MHz Arm® Cortex®-M4 processor • 352KB flash program memory • 32KB of ultra-low leakage SRAM • 8KB of Cache SRAM (Alternatively available as general-purpose RAM) • Programmable radio includes support for 2- (G)FSK, 4-(G)FSK, MSK, Bluetooth® | TI 德州仪器 | |||
具有集成天线的 SimpleLink™ 多协议 2.4GHz 无线系统级封装模块 Wireless microcontroller \n• 352KB flash program memory\n• 8KB of Cache SRAM (Alternatively available as general-purpose RAM)\n• Supports over-the-air upgrade (OTA)\n• MCU consumption: \n• 61 µA/MHz running CoreMark\n• 0.1 µA shutdown mode, wake-up on pin\n• Radio Consumption: \n• 7.1 mA TX at 0 dB; | TI 德州仪器 | |||
丝印代码:CC2651RSIPA;CC2651R3SIPA SimpleLink™ Multiprotocol 2.4 GHz Wireless System-in-Package Module with integrated Antenna & 352-KB Memory 1 Features Wireless microcontroller • Powerful 48-MHz Arm® Cortex®-M4 processor • 352KB flash program memory • 32KB of ultra-low leakage SRAM • 8KB of Cache SRAM (Alternatively available as general-purpose RAM) • Programmable radio includes support for 2- (G)FSK, 4-(G)FSK, MSK, Bluetooth® | TI 德州仪器 | |||
CC2651R3 SimpleLink??Multiprotocol 2.4 GHz Wireless MCU 文件:2.66363 Mbytes Page:60 Pages | TI 德州仪器 | |||
CC2651R3 SimpleLink??Multiprotocol 2.4 GHz Wireless MCU 文件:2.66363 Mbytes Page:60 Pages | TI 德州仪器 | |||
封装/外壳:40-VFQFN 裸露焊盘 包装:卷带(TR) 描述:SIMPLELINK32-BIT ARMCORTEX-M4 SI RF/IF,射频/中频和 RFID 射频收发器 IC | TI 德州仪器 |
CC2651R3产品属性
- 类型
描述
- RAM (KB):
40
- Type:
Wireless MCU
- Features:
LE 1M PHY
- GPIO:
31
- Peripherals:
1 SPI
- Security:
Cryptographic acceleration
- Sensitivity (best) (dBm):
-104
- Operating temperature range (C):
-40 to 105
- Rating:
Catalog
| IC供应商 | 芯片型号 | 品牌 | 批号 | 封装 | 库存 | 备注 | 价格 |
|---|---|---|---|---|---|---|---|
CC |
23+ |
QFN |
50000 |
全新原装正品现货,支持订货 |
|||
NA |
23+ |
10000 |
原厂授权一级代理,专业海外优势订货,价格优势、品种 |
||||
26+ |
N/A |
72000 |
一级代理-主营优势-实惠价格-不悔选择 |
||||
TI/德州仪器 |
26+ |
原厂封装 |
10280 |
||||
TI |
23+ |
QFM50 |
24500 |
交个朋友支持实单 |
|||
CC |
2447 |
QFN48 |
100500 |
一级代理专营品牌!原装正品,优势现货,长期排单到货 |
|||
CC |
23+ |
QFN |
50000 |
全新原装正品现货,支持订货 |
|||
A |
24+ |
DIP-8 |
21 |
||||
BluaTec |
25+ |
电联咨询 |
7800 |
公司现货,提供拆样技术支持 |
|||
TI(德州仪器) |
26+ |
VQFN-48-EP(7x7) |
6500 |
原装认证库存更多可原厂发货 |
CC2651R3规格书下载地址
CC2651R3参数引脚图相关
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- cs5532
- cs1
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- connector
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- CCD
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- CC2D33S
- CC2D33
- CC2D25S
- CC2D25
- CC2D23S
- CC2D23
- CC2-B0-12-690-31B-MG
- CC2A35
- CC2A33
- CC2A25
- CC2A23
- CC2975-000
- CC-29178-91.44M
- CC2824E253R-10
- CC2824E253R-00
- CC2824E113R-10
- CC2824E113R-00
- CC2824E105R-10
- CC2824E105R-00
- CC2824D225R-10
- CC2824D225R-00
- CC2824B475R-10
- CC2824B475R-00
- CC28-11EWA
- CC2687-000
- CC265SAD100/200
- CC2652R
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- CC2650
- CC265/4SAD200
- CC265
- CC2649-000
- CC2646-000
- CC2645-000
- CC2644-000
- CC2642R
- CC2642-000
- CC2641-000
- CC2640
- CC2630
- CC2628-000
- CC2627-000
- CC2626-000
- CC2621-000
- CC2620-000
- CC2620
- CC2619-000
- CC25X300RGBH
- CC25X250RGBH
- CC25X200BH
- CC25TTED
- CC25TTE
- CC25-BLACK
- CC2595
- CC2592
- CC2591
- CC2590
- CC2571
- CC2570
- CC256X
- CC2564C
- CC2564B
- CC2564
- CC2560B
- CC2560A
- CC2560
- CC2550
CC2651R3数据表相关新闻
CC2652P74T0RGZR
CC2652P74T0RGZR
2023-4-23CC3120MODRNMMOBR
www.58chip.com
2022-4-26CC2640R2FTWRGZRQ1
说明:射频微控制器 - MCU Autom Qualified SimpleLink Bluetooth
2021-11-26CC2650F128RHBR收发器封装QFN32原装现货18138231376
联系人:刘冬英 电话:0755-83203002 手机:18138231376 QQ号:1546282226、微信号:18138231376 公司名称:深圳市光华微科技有限公司 Shenzhen Guanghua Micro Technology Co., Ltd 公司地址:深圳市福田区振兴路华匀大厦1栋712室
2019-10-10CC3200R1M2RGCRSimpleLink?Wi-Fi?和IoT解决方案单芯片无线
原装正品,价格优势,竭力为您服务 0755-88600196/QQ3007281353
2019-6-24CC2640R2FRSMRSimpleLinkBluetooth?低耗能无线MCU:
原装正品,价格优势,竭力为您服务 0755-88600196/QQ3007281353
2019-6-24
DdatasheetPDF页码索引
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