型号 | 功能描述 | 生产厂家 企业 | LOGO | 操作 |
---|---|---|---|---|
CC1352P | CC2652PSIP SimpleLink??Multiprotocol 2.4-GHz Wireless System-in-Package With Integrated Power Amplifier 1 Features Wireless microcontroller • Powerful 48-MHz Arm® Cortex®-M4F processor • 352KB flash program memory • 256KB of ROM for protocols and library functions • 8KB of cache SRAM • 80KB of ultra-low leakage SRAM with parity for high-reliability operation • Dynamic multiprotocol manager ( | TI 德州仪器 | ||
CC1352P | CC2674R10 SimpleLink™ High-Performance Multiprotocol 2.4-GHz Wireless MCU 1 Features Wireless microcontroller • Powerful 48 MHz Arm® Cortex®-M33 processor with TrustZone® • FPU and DSP extension • 1024 kB flash program memory • 8 kB of cache SRAM • 256 kB of ultra-low leakage SRAM with parity for high-reliability operation – 32 kB of additional SRAM is availabl | TI 德州仪器 | ||
CC1352P | CC2674P10 SimpleLink™ High-Performance Multiprotocol 2.4-GHz Wireless MCU with Integrated Power Amplifier 1 Features Wireless microcontroller • Powerful 48 MHz Arm® Cortex®-M33 processor with TrustZone® • FPU and DSP extension • 1024 kB flash program memory • 8 kB of cache SRAM • 256 kB of ultra-low leakage SRAM with parity for high-reliability operation – 32 kB of additional SRAM is availabl | TI 德州仪器 | ||
CC1352P | CC1354P10 SimpleLink™ High-Performance Multi-band Wireless MCU With Integrated Power Amplifier 1 Features Wireless microcontroller • Powerful 48 MHz Arm® Cortex®-M33 processor with TrustZone® • FPU and DSP extension • 1024 kB flash program memory • 8 kB of cache SRAM • 256 kB of ultra-low leakage SRAM with parity for high-reliability operation – 32 kB of additional SRAM is availabl | TI 德州仪器 | ||
CC1352P | CC2340R5-Q1 SimpleLink™ Bluetooth ® 5.3 Low Energy Wireless MCU 1 Features Wireless microcontroller • AEC-Q100 Grade 2 qualified for Automotive applications • Optimized 48-MHz Arm® Cortex®-M0+ processor • 512 KB of in-system programmable flash • 12 KB of ROM for bootloader and drivers • 36 KB of ultra-low leakage SRAM. Full RAM retention in standby mod | TI 德州仪器 | ||
CC1352P | CC2340R2 SimpleLink™ Bluetooth ® 5.3 Low Energy Wireless MCU 1 Features Wireless microcontroller • Optimized 48-MHz Arm® Cortex®-M0+ processor • 256 KB of in-system programmable flash • 12 KB of ROM for bootloader and drivers • 28 KB of ultra-low leakage SRAM. Full RAM retention in standby mode • 2.4 GHz RF transceiver compatible with Bluetooth® 5.3 | TI 德州仪器 | ||
CC1352P | CC2340R2 SimpleLink™ Bluetooth ® 5.3 Low Energy Wireless MCU 1 Features Wireless microcontroller • Optimized 48-MHz Arm® Cortex®-M0+ processor • 256 KB of in-system programmable flash • 12 KB of ROM for bootloader and drivers • 28 KB of ultra-low leakage SRAM. Full RAM retention in standby mode • 2.4 GHz RF transceiver compatible with Bluetooth® 5.3 | TI 德州仪器 | ||
CC1352P | CC1314R10 SimpleLink™ High-Performance Sub-1GHz Wireless MCU 1 Features Wireless microcontroller • Powerful 48MHz Arm® Cortex®-M33 processor with TrustZone® • FPU and DSP extension • 1024kB flash program memory • 8kB of cache SRAM • 256kB of ultra-low leakage SRAM with parity for high-reliability operation – 32kB of additional SRAM if parity is dis | TI 德州仪器 | ||
CC1352P | CC1312R SimpleLink™ High-Performance Sub-1 GHz Wireless MCU 1 Features • Microcontroller – Powerful 48-MHz Arm® Cortex®-M4F processor – EEMBC CoreMark® score: 148 – 352KB of in-system programmable flash – 256KB of ROM for protocols and library functions – 8KB of cache SRAM (alternatively available as general-purpose RAM) – 80KB of ultra-low leakag | TI 德州仪器 | ||
CC1352P | CC2642R SimpleLink™ Bluetooth ® 5.2 Low Energy Wireless MCU 1 Features • Microcontroller – Powerful 48 MHz Arm® Cortex®-M4F processor – EEMBC CoreMark® score: 148 – 352 kB of in-system programmable flash – 256 kB of ROM for protocols and library functions – 8 kB of cache SRAM (alternatively available as general-purpose RAM) – 80 kB of ultra-low le | TI 德州仪器 | ||
CC1352P | CC2651P3 SimpleLink™ Single-Protocol 2.4 GHz Wireless MCU With Integrated Power Amplifier 1 Features Wireless microcontroller • Powerful 48-MHz Arm® Cortex®-M4 processor • 352KB flash program memory • 32KB of ultra-low leakage SRAM • 8KB of Cache SRAM (Alternatively available as general-purpose RAM) • Programmable radio includes support for 2- (G)FSK, 4-(G)FSK, MSK, Bluetooth® | TI 德州仪器 | ||
CC1352P | CC2652R SimpleLink™ Multiprotocol 2.4 GHz Wireless MCU 1 Features • Microcontroller – Powerful 48 MHz Arm® Cortex®-M4F processor – EEMBC CoreMark® score: 148 – 352 kB of in-system programmable flash – 256 kB of ROM for protocols and library functions – 8 kB of cache SRAM (alternatively available as general-purpose RAM) – 80 kB of ultra-low le | TI 德州仪器 | ||
CC1352P | CC2642R-Q1 SimpleLink™ Bluetooth® 5.2 Low Energy Wireless MCU 1 Features Wireless microcontroller • Powerful 48-MHz Arm® Cortex®-M4 processor • EEMBC CoreMark® score: 148 • 352KB flash program memory • 256KB of ROM for protocols and library functions • 8KB of cache SRAM • 80KB of ultra-low leakage SRAM with parity for high-reliability operation • 2- | TI 德州仪器 | ||
CC1352P | CC2674P10 SimpleLink™ High-Performance Multiprotocol 2.4GHz Wireless MCU with Integrated Power Amplifier 1 Features Wireless microcontroller • Powerful 48MHz Arm® Cortex®-M33 processor with TrustZone® • FPU and DSP extension • 1024kB flash program memory • 8kB of cache SRAM • 256kB of ultra-low leakage SRAM with parity for high-reliability operation – 32kB of additional SRAM if parity is dis | TI 德州仪器 | ||
CC1352P | 具有集成式功率放大器的 SimpleLink™ Arm Cortex-M4F 多协议低于 1GHz 和 2.4GHz 无线 MCU | TI 德州仪器 | ||
CC1352P | CC2651P3 SimpleLink??Single-Protocol 2.4 GHz Wireless MCU With Integrated Power Amplifier 文件:3.51768 Mbytes Page:63 Pages | TI 德州仪器 | ||
CC1352P | CC2652R7 SimpleLink??Multiprotocol 2.4 GHz Wireless MCU 文件:2.90059 Mbytes Page:58 Pages | TI 德州仪器 | ||
CC1352P | SimpleLink High-Performance Dual-Band Wireless MCU With Integrated Power Amplifier 文件:499.35 Kbytes Page:59 Pages | TI 德州仪器 | ||
CC1352P | SimpleLink High-Performance Dual-Band Wireless MCU With Integrated Power Amplifier 文件:502.43 Kbytes Page:60 Pages | TI 德州仪器 | ||
CC2652PSIP SimpleLink??Multiprotocol 2.4-GHz Wireless System-in-Package With Integrated Power Amplifier 1 Features Wireless microcontroller • Powerful 48-MHz Arm® Cortex®-M4F processor • 352KB flash program memory • 256KB of ROM for protocols and library functions • 8KB of cache SRAM • 80KB of ultra-low leakage SRAM with parity for high-reliability operation • Dynamic multiprotocol manager ( | TI 德州仪器 | |||
CC2674P10 SimpleLink™ High-Performance Multiprotocol 2.4-GHz Wireless MCU with Integrated Power Amplifier 1 Features Wireless microcontroller • Powerful 48 MHz Arm® Cortex®-M33 processor with TrustZone® • FPU and DSP extension • 1024 kB flash program memory • 8 kB of cache SRAM • 256 kB of ultra-low leakage SRAM with parity for high-reliability operation – 32 kB of additional SRAM is availabl | TI 德州仪器 | |||
CC2674R10 SimpleLink™ High-Performance Multiprotocol 2.4-GHz Wireless MCU 1 Features Wireless microcontroller • Powerful 48 MHz Arm® Cortex®-M33 processor with TrustZone® • FPU and DSP extension • 1024 kB flash program memory • 8 kB of cache SRAM • 256 kB of ultra-low leakage SRAM with parity for high-reliability operation – 32 kB of additional SRAM is availabl | TI 德州仪器 | |||
CC2340R2 SimpleLink™ Bluetooth ® 5.3 Low Energy Wireless MCU 1 Features Wireless microcontroller • Optimized 48-MHz Arm® Cortex®-M0+ processor • 256 KB of in-system programmable flash • 12 KB of ROM for bootloader and drivers • 28 KB of ultra-low leakage SRAM. Full RAM retention in standby mode • 2.4 GHz RF transceiver compatible with Bluetooth® 5.3 | TI 德州仪器 | |||
CC1314R10 SimpleLink™ High-Performance Sub-1GHz Wireless MCU 1 Features Wireless microcontroller • Powerful 48MHz Arm® Cortex®-M33 processor with TrustZone® • FPU and DSP extension • 1024kB flash program memory • 8kB of cache SRAM • 256kB of ultra-low leakage SRAM with parity for high-reliability operation – 32kB of additional SRAM if parity is dis | TI 德州仪器 | |||
CC2340R5-Q1 SimpleLink™ Bluetooth ® 5.3 Low Energy Wireless MCU 1 Features Wireless microcontroller • AEC-Q100 Grade 2 qualified for Automotive applications • Optimized 48-MHz Arm® Cortex®-M0+ processor • 512 KB of in-system programmable flash • 12 KB of ROM for bootloader and drivers • 36 KB of ultra-low leakage SRAM. Full RAM retention in standby mod | TI 德州仪器 | |||
CC1354P10 SimpleLink™ High-Performance Multi-band Wireless MCU With Integrated Power Amplifier 1 Features Wireless microcontroller • Powerful 48 MHz Arm® Cortex®-M33 processor with TrustZone® • FPU and DSP extension • 1024 kB flash program memory • 8 kB of cache SRAM • 256 kB of ultra-low leakage SRAM with parity for high-reliability operation – 32 kB of additional SRAM is availabl | TI 德州仪器 | |||
CC2340R2 SimpleLink™ Bluetooth ® 5.3 Low Energy Wireless MCU 1 Features Wireless microcontroller • Optimized 48-MHz Arm® Cortex®-M0+ processor • 256 KB of in-system programmable flash • 12 KB of ROM for bootloader and drivers • 28 KB of ultra-low leakage SRAM. Full RAM retention in standby mode • 2.4 GHz RF transceiver compatible with Bluetooth® 5.3 | TI 德州仪器 | |||
CC2674P10 SimpleLink™ High-Performance Multiprotocol 2.4GHz Wireless MCU with Integrated Power Amplifier 1 Features Wireless microcontroller • Powerful 48MHz Arm® Cortex®-M33 processor with TrustZone® • FPU and DSP extension • 1024kB flash program memory • 8kB of cache SRAM • 256kB of ultra-low leakage SRAM with parity for high-reliability operation – 32kB of additional SRAM if parity is dis | TI 德州仪器 | |||
CC2642R-Q1 SimpleLink™ Bluetooth® 5.2 Low Energy Wireless MCU 1 Features Wireless microcontroller • Powerful 48-MHz Arm® Cortex®-M4 processor • EEMBC CoreMark® score: 148 • 352KB flash program memory • 256KB of ROM for protocols and library functions • 8KB of cache SRAM • 80KB of ultra-low leakage SRAM with parity for high-reliability operation • 2- | TI 德州仪器 | |||
SimpleLink High-Performance Dual-Band Wireless MCU With Integrated Power Amplifier 文件:502.43 Kbytes Page:60 Pages | TI 德州仪器 | |||
SimpleLink High-Performance Dual-Band Wireless MCU With Integrated Power Amplifier 文件:502.43 Kbytes Page:60 Pages | TI 德州仪器 | |||
SimpleLink High-Performance Dual-Band Wireless MCU With Integrated Power Amplifier 文件:502.43 Kbytes Page:60 Pages | TI 德州仪器 | |||
SimpleLink High-Performance Dual-Band Wireless MCU With Integrated Power Amplifier 文件:499.35 Kbytes Page:59 Pages | TI 德州仪器 | |||
SimpleLink High-Performance Dual-Band Wireless MCU With Integrated Power Amplifier 文件:499.35 Kbytes Page:59 Pages | TI 德州仪器 | |||
SimpleLink High-Performance Dual-Band Wireless MCU With Integrated Power Amplifier 文件:502.43 Kbytes Page:60 Pages | TI 德州仪器 | |||
封装/外壳:48-VFQFN 裸露焊盘 包装:卷带(TR)剪切带(CT)Digi-Reel® 得捷定制卷带 描述:IC RF TXRX+MCU 802.15.4 48VQFN RF/IF,射频/中频和 RFID 射频收发器 IC | TI 德州仪器 | |||
CC1352P7 SimpleLink??High-Performance Multi-Band Wireless MCU With Integrated Power Amplifier 文件:3.92276 Mbytes Page:82 Pages | TI 德州仪器 | |||
CC2651P3 SimpleLink??Single-Protocol 2.4 GHz Wireless MCU With Integrated Power Amplifier 文件:3.51768 Mbytes Page:63 Pages | TI 德州仪器 | |||
CC1352P7 SimpleLink??High-Performance Multi-Band Wireless MCU With Integrated Power Amplifier 文件:3.92276 Mbytes Page:82 Pages | TI 德州仪器 | |||
封装/外壳:48-VFQFN 裸露焊盘 包装:卷带(TR)剪切带(CT)Digi-Reel® 得捷定制卷带 描述:SIMPLELINK ARM CORTEX-M4F MULTIP RF/IF,射频/中频和 RFID 射频收发器 IC | TI 德州仪器 | |||
Category 6 Cable, 4 Pair, F/UTP, CMP Product Description Category 6 Premise Horizontal Cable (250MHz), 4 Pair, 23 AWG Solid Bare Copper Conductors, F/UTP - Foil Shielded, Plenum-CMP, Flamarrest® PVC-LS Jacket | BELDEN 百通 | |||
Programmable Quad LDO General Description The AS1352 is a high-performance quad CMOS low dropout voltage regulator in a single QFN package. The efficient set of programmable power supplies is optimized to deliver the best compromise between quiescent current and regulator performance for mobile phones, PDAs, MP3 pla | AMSCO 艾迈斯欧司朗 | |||
Programmable Quad LDO 文件:307.08 Kbytes Page:10 Pages | AMSCO 艾迈斯欧司朗 | |||
Programmable Quad LDO 文件:307.08 Kbytes Page:10 Pages | AMSCO 艾迈斯欧司朗 | |||
Programmable Quad LDO 文件:307.08 Kbytes Page:10 Pages | AMSCO 艾迈斯欧司朗 |
IC供应商 | 芯片型号 | 品牌 | 批号 | 封装 | 库存 | 备注 | 价格 |
---|---|---|---|---|---|---|---|
Texas Instruments |
20+ |
VQFN-48 |
29860 |
TI微控制器MCU-可开原型号增税票 |
|||
TI(德州仪器) |
24+ |
标准封装 |
10048 |
原厂直销,大量现货库存,交期快。价格优,支持账期 |
|||
23+ |
NA |
6800 |
原装正品,力挺实单 |
||||
TI(德州仪器) |
24+/25+ |
10000 |
原装正品现货库存价优 |
||||
Texas Instruments |
24+ |
VQFN-48 |
3265 |
全新原厂原装,进口正品现货,正规渠道可含税!! |
|||
TI |
21+ |
QFN48 |
2500 |
全新原装公司现货
|
|||
TI |
23+ |
QFN48 |
24500 |
交个朋友支持实单 |
|||
TI(德州仪器) |
2511 |
VQFN-48(7x7) |
5904 |
电子元器件采购降本30%!原厂直采,砍掉中间差价 |
|||
TI |
23+ |
QFN48 |
7850 |
只做原装正品假一赔十为客户做到零风险!! |
|||
TI(德州仪器) |
25+ |
QFN-48-EP(7x7) |
500000 |
源自原厂成本,高价回收工厂呆滞 |
CC1352P规格书下载地址
CC1352P参数引脚图相关
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- CC1350F128RGZT.B
- CC1350F128RGZT
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- CC1350_16
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- CC12H4A
- CC12H3A
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- CC12H1A
- CC12H
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- CC1210
- CC1206
- CC1201
CC1352P数据表相关新闻
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CC1310F32RSMT
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只做原装正品,原包装标签 欢迎咨询!
2021-4-13CC2500RGPRM24C64-FMB6TG原装正品,价格优势
原装正品, 价格优势 我们竭诚为您服务 13342971909 吴小姐
2019-3-8
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