型号 功能描述 生产厂家 企业 LOGO 操作
CC1352P

CC2652PSIP SimpleLink??Multiprotocol 2.4-GHz Wireless System-in-Package With Integrated Power Amplifier

1 Features Wireless microcontroller • Powerful 48-MHz Arm® Cortex®-M4F processor • 352KB flash program memory • 256KB of ROM for protocols and library functions • 8KB of cache SRAM • 80KB of ultra-low leakage SRAM with parity for high-reliability operation • Dynamic multiprotocol manager (

TI

德州仪器

CC1352P

CC2642R-Q1 SimpleLink™ Bluetooth® 5.2 Low Energy Wireless MCU

1 Features Wireless microcontroller • Powerful 48-MHz Arm® Cortex®-M4 processor • EEMBC CoreMark® score: 148 • 352KB flash program memory • 256KB of ROM for protocols and library functions • 8KB of cache SRAM • 80KB of ultra-low leakage SRAM with parity for high-reliability operation • 2-

TI

德州仪器

CC1352P

CC2674R10 SimpleLink™ High-Performance Multiprotocol 2.4-GHz Wireless MCU

1 Features Wireless microcontroller • Powerful 48 MHz Arm® Cortex®-M33 processor with TrustZone® • FPU and DSP extension • 1024 kB flash program memory • 8 kB of cache SRAM • 256 kB of ultra-low leakage SRAM with parity for high-reliability operation – 32 kB of additional SRAM is availabl

TI

德州仪器

CC1352P

CC2674P10 SimpleLink™ High-Performance Multiprotocol 2.4-GHz Wireless MCU with Integrated Power Amplifier

1 Features Wireless microcontroller • Powerful 48 MHz Arm® Cortex®-M33 processor with TrustZone® • FPU and DSP extension • 1024 kB flash program memory • 8 kB of cache SRAM • 256 kB of ultra-low leakage SRAM with parity for high-reliability operation – 32 kB of additional SRAM is availabl

TI

德州仪器

CC1352P

CC1354P10 SimpleLink™ High-Performance Multi-band Wireless MCU With Integrated Power Amplifier

1 Features Wireless microcontroller • Powerful 48 MHz Arm® Cortex®-M33 processor with TrustZone® • FPU and DSP extension • 1024 kB flash program memory • 8 kB of cache SRAM • 256 kB of ultra-low leakage SRAM with parity for high-reliability operation – 32 kB of additional SRAM is availabl

TI

德州仪器

CC1352P

CC2340R5-Q1 SimpleLink™ Bluetooth ® 5.3 Low Energy Wireless MCU

1 Features Wireless microcontroller • AEC-Q100 Grade 2 qualified for Automotive applications • Optimized 48-MHz Arm® Cortex®-M0+ processor • 512 KB of in-system programmable flash • 12 KB of ROM for bootloader and drivers • 36 KB of ultra-low leakage SRAM. Full RAM retention in standby mod

TI

德州仪器

CC1352P

CC2340R2 SimpleLink™ Bluetooth ® 5.3 Low Energy Wireless MCU

1 Features Wireless microcontroller • Optimized 48-MHz Arm® Cortex®-M0+ processor • 256 KB of in-system programmable flash • 12 KB of ROM for bootloader and drivers • 28 KB of ultra-low leakage SRAM. Full RAM retention in standby mode • 2.4 GHz RF transceiver compatible with Bluetooth® 5.3

TI

德州仪器

CC1352P

CC2340R2 SimpleLink™ Bluetooth ® 5.3 Low Energy Wireless MCU

1 Features Wireless microcontroller • Optimized 48-MHz Arm® Cortex®-M0+ processor • 256 KB of in-system programmable flash • 12 KB of ROM for bootloader and drivers • 28 KB of ultra-low leakage SRAM. Full RAM retention in standby mode • 2.4 GHz RF transceiver compatible with Bluetooth® 5.3

TI

德州仪器

CC1352P

CC1314R10 SimpleLink™ High-Performance Sub-1GHz Wireless MCU

1 Features Wireless microcontroller • Powerful 48MHz Arm® Cortex®-M33 processor with TrustZone® • FPU and DSP extension • 1024kB flash program memory • 8kB of cache SRAM • 256kB of ultra-low leakage SRAM with parity for high-reliability operation – 32kB of additional SRAM if parity is dis

TI

德州仪器

CC1352P

CC1312R SimpleLink™ High-Performance Sub-1 GHz Wireless MCU

1 Features • Microcontroller – Powerful 48-MHz Arm® Cortex®-M4F processor – EEMBC CoreMark® score: 148 – 352KB of in-system programmable flash – 256KB of ROM for protocols and library functions – 8KB of cache SRAM (alternatively available as general-purpose RAM) – 80KB of ultra-low leakag

TI

德州仪器

CC1352P

CC2642R SimpleLink™ Bluetooth ® 5.2 Low Energy Wireless MCU

1 Features • Microcontroller – Powerful 48 MHz Arm® Cortex®-M4F processor – EEMBC CoreMark® score: 148 – 352 kB of in-system programmable flash – 256 kB of ROM for protocols and library functions – 8 kB of cache SRAM (alternatively available as general-purpose RAM) – 80 kB of ultra-low le

TI

德州仪器

CC1352P

CC2651P3 SimpleLink™ Single-Protocol 2.4 GHz Wireless MCU With Integrated Power Amplifier

1 Features Wireless microcontroller • Powerful 48-MHz Arm® Cortex®-M4 processor • 352KB flash program memory • 32KB of ultra-low leakage SRAM • 8KB of Cache SRAM (Alternatively available as general-purpose RAM) • Programmable radio includes support for 2- (G)FSK, 4-(G)FSK, MSK, Bluetooth®

TI

德州仪器

CC1352P

CC2652R SimpleLink™ Multiprotocol 2.4 GHz Wireless MCU

1 Features • Microcontroller – Powerful 48 MHz Arm® Cortex®-M4F processor – EEMBC CoreMark® score: 148 – 352 kB of in-system programmable flash – 256 kB of ROM for protocols and library functions – 8 kB of cache SRAM (alternatively available as general-purpose RAM) – 80 kB of ultra-low le

TI

德州仪器

CC1352P

CC2674P10 SimpleLink™ High-Performance Multiprotocol 2.4GHz Wireless MCU with Integrated Power Amplifier

1 Features Wireless microcontroller • Powerful 48MHz Arm® Cortex®-M33 processor with TrustZone® • FPU and DSP extension • 1024kB flash program memory • 8kB of cache SRAM • 256kB of ultra-low leakage SRAM with parity for high-reliability operation – 32kB of additional SRAM if parity is dis

TI

德州仪器

CC1352P

具有集成式功率放大器的 SimpleLink™ Arm Cortex-M4F 多协议低于 1GHz 和 2.4GHz 无线 MCU

TI

德州仪器

CC1352P

CC2652R7 SimpleLink??Multiprotocol 2.4 GHz Wireless MCU

文件:2.90059 Mbytes Page:58 Pages

TI

德州仪器

CC1352P

SimpleLink High-Performance Dual-Band Wireless MCU With Integrated Power Amplifier

文件:499.35 Kbytes Page:59 Pages

TI

德州仪器

CC1352P

SimpleLink High-Performance Dual-Band Wireless MCU With Integrated Power Amplifier

文件:502.43 Kbytes Page:60 Pages

TI

德州仪器

CC1352P

CC2651P3 SimpleLink??Single-Protocol 2.4 GHz Wireless MCU With Integrated Power Amplifier

文件:3.51768 Mbytes Page:63 Pages

TI

德州仪器

丝印代码:CC1352P1F3;SimpleLink High-Performance Dual-Band Wireless MCU With Integrated Power Amplifier

文件:502.43 Kbytes Page:60 Pages

TI

德州仪器

CC2340R5-Q1 SimpleLink™ Bluetooth ® 5.3 Low Energy Wireless MCU

1 Features Wireless microcontroller • AEC-Q100 Grade 2 qualified for Automotive applications • Optimized 48-MHz Arm® Cortex®-M0+ processor • 512 KB of in-system programmable flash • 12 KB of ROM for bootloader and drivers • 36 KB of ultra-low leakage SRAM. Full RAM retention in standby mod

TI

德州仪器

CC1354P10 SimpleLink™ High-Performance Multi-band Wireless MCU With Integrated Power Amplifier

1 Features Wireless microcontroller • Powerful 48 MHz Arm® Cortex®-M33 processor with TrustZone® • FPU and DSP extension • 1024 kB flash program memory • 8 kB of cache SRAM • 256 kB of ultra-low leakage SRAM with parity for high-reliability operation – 32 kB of additional SRAM is availabl

TI

德州仪器

CC2340R2 SimpleLink™ Bluetooth ® 5.3 Low Energy Wireless MCU

1 Features Wireless microcontroller • Optimized 48-MHz Arm® Cortex®-M0+ processor • 256 KB of in-system programmable flash • 12 KB of ROM for bootloader and drivers • 28 KB of ultra-low leakage SRAM. Full RAM retention in standby mode • 2.4 GHz RF transceiver compatible with Bluetooth® 5.3

TI

德州仪器

CC2340R2 SimpleLink™ Bluetooth ® 5.3 Low Energy Wireless MCU

1 Features Wireless microcontroller • Optimized 48-MHz Arm® Cortex®-M0+ processor • 256 KB of in-system programmable flash • 12 KB of ROM for bootloader and drivers • 28 KB of ultra-low leakage SRAM. Full RAM retention in standby mode • 2.4 GHz RF transceiver compatible with Bluetooth® 5.3

TI

德州仪器

CC1314R10 SimpleLink™ High-Performance Sub-1GHz Wireless MCU

1 Features Wireless microcontroller • Powerful 48MHz Arm® Cortex®-M33 processor with TrustZone® • FPU and DSP extension • 1024kB flash program memory • 8kB of cache SRAM • 256kB of ultra-low leakage SRAM with parity for high-reliability operation – 32kB of additional SRAM if parity is dis

TI

德州仪器

CC2674P10 SimpleLink™ High-Performance Multiprotocol 2.4-GHz Wireless MCU with Integrated Power Amplifier

1 Features Wireless microcontroller • Powerful 48 MHz Arm® Cortex®-M33 processor with TrustZone® • FPU and DSP extension • 1024 kB flash program memory • 8 kB of cache SRAM • 256 kB of ultra-low leakage SRAM with parity for high-reliability operation – 32 kB of additional SRAM is availabl

TI

德州仪器

CC2674R10 SimpleLink™ High-Performance Multiprotocol 2.4-GHz Wireless MCU

1 Features Wireless microcontroller • Powerful 48 MHz Arm® Cortex®-M33 processor with TrustZone® • FPU and DSP extension • 1024 kB flash program memory • 8 kB of cache SRAM • 256 kB of ultra-low leakage SRAM with parity for high-reliability operation – 32 kB of additional SRAM is availabl

TI

德州仪器

CC2642R-Q1 SimpleLink™ Bluetooth® 5.2 Low Energy Wireless MCU

1 Features Wireless microcontroller • Powerful 48-MHz Arm® Cortex®-M4 processor • EEMBC CoreMark® score: 148 • 352KB flash program memory • 256KB of ROM for protocols and library functions • 8KB of cache SRAM • 80KB of ultra-low leakage SRAM with parity for high-reliability operation • 2-

TI

德州仪器

CC2652PSIP SimpleLink??Multiprotocol 2.4-GHz Wireless System-in-Package With Integrated Power Amplifier

1 Features Wireless microcontroller • Powerful 48-MHz Arm® Cortex®-M4F processor • 352KB flash program memory • 256KB of ROM for protocols and library functions • 8KB of cache SRAM • 80KB of ultra-low leakage SRAM with parity for high-reliability operation • Dynamic multiprotocol manager (

TI

德州仪器

CC2674P10 SimpleLink™ High-Performance Multiprotocol 2.4GHz Wireless MCU with Integrated Power Amplifier

1 Features Wireless microcontroller • Powerful 48MHz Arm® Cortex®-M33 processor with TrustZone® • FPU and DSP extension • 1024kB flash program memory • 8kB of cache SRAM • 256kB of ultra-low leakage SRAM with parity for high-reliability operation – 32kB of additional SRAM if parity is dis

TI

德州仪器

CC2642R SimpleLink™ Bluetooth ® 5.2 Low Energy Wireless MCU

1 Features • Microcontroller – Powerful 48 MHz Arm® Cortex®-M4F processor – EEMBC CoreMark® score: 148 – 352 kB of in-system programmable flash – 256 kB of ROM for protocols and library functions – 8 kB of cache SRAM (alternatively available as general-purpose RAM) – 80 kB of ultra-low le

TI

德州仪器

CC2651P3 SimpleLink™ Single-Protocol 2.4 GHz Wireless MCU With Integrated Power Amplifier

1 Features Wireless microcontroller • Powerful 48-MHz Arm® Cortex®-M4 processor • 352KB flash program memory • 32KB of ultra-low leakage SRAM • 8KB of Cache SRAM (Alternatively available as general-purpose RAM) • Programmable radio includes support for 2- (G)FSK, 4-(G)FSK, MSK, Bluetooth®

TI

德州仪器

CC2652R SimpleLink™ Multiprotocol 2.4 GHz Wireless MCU

1 Features • Microcontroller – Powerful 48 MHz Arm® Cortex®-M4F processor – EEMBC CoreMark® score: 148 – 352 kB of in-system programmable flash – 256 kB of ROM for protocols and library functions – 8 kB of cache SRAM (alternatively available as general-purpose RAM) – 80 kB of ultra-low le

TI

德州仪器

SimpleLink High-Performance Dual-Band Wireless MCU With Integrated Power Amplifier

文件:502.43 Kbytes Page:60 Pages

TI

德州仪器

SimpleLink High-Performance Dual-Band Wireless MCU With Integrated Power Amplifier

文件:502.43 Kbytes Page:60 Pages

TI

德州仪器

SimpleLink High-Performance Dual-Band Wireless MCU With Integrated Power Amplifier

文件:502.43 Kbytes Page:60 Pages

TI

德州仪器

SimpleLink High-Performance Dual-Band Wireless MCU With Integrated Power Amplifier

文件:499.35 Kbytes Page:59 Pages

TI

德州仪器

SimpleLink High-Performance Dual-Band Wireless MCU With Integrated Power Amplifier

文件:499.35 Kbytes Page:59 Pages

TI

德州仪器

SimpleLink High-Performance Dual-Band Wireless MCU With Integrated Power Amplifier

文件:502.43 Kbytes Page:60 Pages

TI

德州仪器

封装/外壳:48-VFQFN 裸露焊盘 包装:卷带(TR)剪切带(CT)Digi-Reel® 得捷定制卷带 描述:IC RF TXRX+MCU 802.15.4 48VQFN RF/IF,射频/中频和 RFID 射频收发器 IC

TI

德州仪器

CC2651P3 SimpleLink??Single-Protocol 2.4 GHz Wireless MCU With Integrated Power Amplifier

文件:3.51768 Mbytes Page:63 Pages

TI

德州仪器

CC1352P7 SimpleLink??High-Performance Multi-Band Wireless MCU With Integrated Power Amplifier

文件:3.92276 Mbytes Page:82 Pages

TI

德州仪器

CC1352P7 SimpleLink??High-Performance Multi-Band Wireless MCU With Integrated Power Amplifier

文件:3.92276 Mbytes Page:82 Pages

TI

德州仪器

封装/外壳:48-VFQFN 裸露焊盘 包装:卷带(TR)剪切带(CT)Digi-Reel® 得捷定制卷带 描述:SIMPLELINK ARM CORTEX-M4F MULTIP RF/IF,射频/中频和 RFID 射频收发器 IC

TI

德州仪器

Category 6 Cable, 4 Pair, F/UTP, CMP

Product Description Category 6 Premise Horizontal Cable (250MHz), 4 Pair, 23 AWG Solid Bare Copper Conductors, F/UTP - Foil Shielded, Plenum-CMP, Flamarrest® PVC-LS Jacket

BELDEN

百通

Programmable Quad LDO

General Description The AS1352 is a high-performance quad CMOS low dropout voltage regulator in a single QFN package. The efficient set of programmable power supplies is optimized to deliver the best compromise between quiescent current and regulator performance for mobile phones, PDAs, MP3 pla

AMSCO

艾迈斯欧司朗

Programmable Quad LDO

文件:307.08 Kbytes Page:10 Pages

AMSCO

艾迈斯欧司朗

Programmable Quad LDO

文件:307.08 Kbytes Page:10 Pages

AMSCO

艾迈斯欧司朗

Programmable Quad LDO

文件:307.08 Kbytes Page:10 Pages

AMSCO

艾迈斯欧司朗

更新时间:2026-3-12 23:00:00
IC供应商 芯片型号 品牌 批号 封装 库存 备注 价格
TI
25+
VQFN-48(7x7)
12421
原装正品现货,原厂订货,可支持含税原型号开票。
TI
24+
VQFN48
28900
只做原装正品,公司现货
TI
21+
QFN48
2500
十年信誉,只做原装,有挂就有现货!
TI 专营CC系列
21+
QFN48
12500
一级代理,专注军工、汽车、医疗、工业、新能源、电力
Texas Instruments
24+
VQFN-48
3265
全新原厂原装,进口正品现货,正规渠道可含税!!
23+
NA
6800
原装正品,力挺实单
TI
23+
QFN48
7850
只做原装正品假一赔十为客户做到零风险!!
Texas Instruments
20+
VQFN-48
29860
TI微控制器MCU-可开原型号增税票
TI(德州仪器)
24+/25+
10000
原装正品现货库存价优
TI(德州仪器)
23+
NA
20094
正纳10年以上分销经验原装进口正品做服务做口碑有支持

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