型号 功能描述 生产厂家&企业 LOGO 操作
CC1352P

CC2652PSIPSimpleLink??Multiprotocol2.4-GHzWirelessSystem-in-PackageWithIntegratedPowerAmplifier

1Features Wirelessmicrocontroller •Powerful48-MHzArm®Cortex®-M4Fprocessor •352KBflashprogrammemory •256KBofROMforprotocolsandlibraryfunctions •8KBofcacheSRAM •80KBofultra-lowleakageSRAMwithparityfor high-reliabilityoperation •Dynamicmultiprotocolmanager(

TITexas Instruments

德州仪器美国德州仪器公司

TI
CC1352P

CC2642R-Q1SimpleLink™Bluetooth®5.2LowEnergyWirelessMCU

1Features Wirelessmicrocontroller •Powerful48-MHzArm®Cortex®-M4processor •EEMBCCoreMark®score:148 •352KBflashprogrammemory •256KBofROMforprotocolsandlibraryfunctions •8KBofcacheSRAM •80KBofultra-lowleakageSRAMwithparityfor high-reliabilityoperation •2-

TITexas Instruments

德州仪器美国德州仪器公司

TI
CC1352P

CC2674R10SimpleLink™High-PerformanceMultiprotocol2.4-GHzWirelessMCU

1Features Wirelessmicrocontroller •Powerful48MHzArm®Cortex®-M33processor withTrustZone® •FPUandDSPextension •1024kBflashprogrammemory •8kBofcacheSRAM •256kBofultra-lowleakageSRAMwithparityfor high-reliabilityoperation –32kBofadditionalSRAMisavailabl

TI1Texas Instruments

德州仪器美国德州仪器公司

TI1
CC1352P

CC2674P10SimpleLink™High-PerformanceMultiprotocol2.4-GHzWirelessMCUwithIntegratedPowerAmplifier

1Features Wirelessmicrocontroller •Powerful48MHzArm®Cortex®-M33processor withTrustZone® •FPUandDSPextension •1024kBflashprogrammemory •8kBofcacheSRAM •256kBofultra-lowleakageSRAMwithparityfor high-reliabilityoperation –32kBofadditionalSRAMisavailabl

TITexas Instruments

德州仪器美国德州仪器公司

TI
CC1352P

CC1354P10SimpleLink™High-PerformanceMulti-bandWirelessMCUWithIntegratedPowerAmplifier

1Features Wirelessmicrocontroller •Powerful48MHzArm®Cortex®-M33processor withTrustZone® •FPUandDSPextension •1024kBflashprogrammemory •8kBofcacheSRAM •256kBofultra-lowleakageSRAMwithparityfor high-reliabilityoperation –32kBofadditionalSRAMisavailabl

TI1Texas Instruments

德州仪器美国德州仪器公司

TI1
CC1352P

CC2340R5-Q1SimpleLink™Bluetooth®5.3LowEnergyWirelessMCU

1Features Wirelessmicrocontroller •AEC-Q100Grade2qualifiedforAutomotive applications •Optimized48-MHzArm®Cortex®-M0+processor •512KBofin-systemprogrammableflash •12KBofROMforbootloaderanddrivers •36KBofultra-lowleakageSRAM.FullRAM retentioninstandbymod

TI1Texas Instruments

德州仪器美国德州仪器公司

TI1
CC1352P

CC2340R2SimpleLink™Bluetooth®5.3LowEnergyWirelessMCU

1Features Wirelessmicrocontroller •Optimized48-MHzArm®Cortex®-M0+processor •256KBofin-systemprogrammableflash •12KBofROMforbootloaderanddrivers •28KBofultra-lowleakageSRAM.FullRAM retentioninstandbymode •2.4GHzRFtransceivercompatiblewith Bluetooth®5.3

TI1Texas Instruments

德州仪器美国德州仪器公司

TI1
CC1352P

CC2340R2SimpleLink™Bluetooth®5.3LowEnergyWirelessMCU

1Features Wirelessmicrocontroller •Optimized48-MHzArm®Cortex®-M0+processor •256KBofin-systemprogrammableflash •12KBofROMforbootloaderanddrivers •28KBofultra-lowleakageSRAM.FullRAM retentioninstandbymode •2.4GHzRFtransceivercompatiblewith Bluetooth®5.3

TI1Texas Instruments

德州仪器美国德州仪器公司

TI1
CC1352P

CC1314R10SimpleLink™High-PerformanceSub-1GHzWirelessMCU

1Features Wirelessmicrocontroller •Powerful48MHzArm®Cortex®-M33processor withTrustZone® •FPUandDSPextension •1024kBflashprogrammemory •8kBofcacheSRAM •256kBofultra-lowleakageSRAMwithparityfor high-reliabilityoperation –32kBofadditionalSRAMifparityisdis

TI1Texas Instruments

德州仪器美国德州仪器公司

TI1
CC1352P

CC2674P10SimpleLink™High-PerformanceMultiprotocol2.4GHzWirelessMCUwithIntegratedPowerAmplifier

1Features Wirelessmicrocontroller •Powerful48MHzArm®Cortex®-M33processor withTrustZone® •FPUandDSPextension •1024kBflashprogrammemory •8kBofcacheSRAM •256kBofultra-lowleakageSRAMwithparityfor high-reliabilityoperation –32kBofadditionalSRAMifparityisdis

TI1Texas Instruments

德州仪器美国德州仪器公司

TI1
CC1352P

CC2651P3SimpleLink??Single-Protocol2.4GHzWirelessMCUWithIntegratedPowerAmplifier

文件:3.51768 Mbytes Page:63 Pages

TITexas Instruments

德州仪器美国德州仪器公司

TI
CC1352P

SimpleLinkHigh-PerformanceDual-BandWirelessMCUWithIntegratedPowerAmplifier

文件:502.43 Kbytes Page:60 Pages

TI1Texas Instruments

德州仪器美国德州仪器公司

TI1
CC1352P

CC2652R7SimpleLink??Multiprotocol2.4GHzWirelessMCU

文件:2.90059 Mbytes Page:58 Pages

TITexas Instruments

德州仪器美国德州仪器公司

TI
CC1352P

SimpleLinkHigh-PerformanceDual-BandWirelessMCUWithIntegratedPowerAmplifier

文件:499.35 Kbytes Page:59 Pages

TI1Texas Instruments

德州仪器美国德州仪器公司

TI1

CC2652PSIPSimpleLink??Multiprotocol2.4-GHzWirelessSystem-in-PackageWithIntegratedPowerAmplifier

1Features Wirelessmicrocontroller •Powerful48-MHzArm®Cortex®-M4Fprocessor •352KBflashprogrammemory •256KBofROMforprotocolsandlibraryfunctions •8KBofcacheSRAM •80KBofultra-lowleakageSRAMwithparityfor high-reliabilityoperation •Dynamicmultiprotocolmanager(

TITexas Instruments

德州仪器美国德州仪器公司

TI

CC2340R2SimpleLink™Bluetooth®5.3LowEnergyWirelessMCU

1Features Wirelessmicrocontroller •Optimized48-MHzArm®Cortex®-M0+processor •256KBofin-systemprogrammableflash •12KBofROMforbootloaderanddrivers •28KBofultra-lowleakageSRAM.FullRAM retentioninstandbymode •2.4GHzRFtransceivercompatiblewith Bluetooth®5.3

TI1Texas Instruments

德州仪器美国德州仪器公司

TI1

CC1314R10SimpleLink™High-PerformanceSub-1GHzWirelessMCU

1Features Wirelessmicrocontroller •Powerful48MHzArm®Cortex®-M33processor withTrustZone® •FPUandDSPextension •1024kBflashprogrammemory •8kBofcacheSRAM •256kBofultra-lowleakageSRAMwithparityfor high-reliabilityoperation –32kBofadditionalSRAMifparityisdis

TI1Texas Instruments

德州仪器美国德州仪器公司

TI1

CC2340R5-Q1SimpleLink™Bluetooth®5.3LowEnergyWirelessMCU

1Features Wirelessmicrocontroller •AEC-Q100Grade2qualifiedforAutomotive applications •Optimized48-MHzArm®Cortex®-M0+processor •512KBofin-systemprogrammableflash •12KBofROMforbootloaderanddrivers •36KBofultra-lowleakageSRAM.FullRAM retentioninstandbymod

TI1Texas Instruments

德州仪器美国德州仪器公司

TI1

CC1354P10SimpleLink™High-PerformanceMulti-bandWirelessMCUWithIntegratedPowerAmplifier

1Features Wirelessmicrocontroller •Powerful48MHzArm®Cortex®-M33processor withTrustZone® •FPUandDSPextension •1024kBflashprogrammemory •8kBofcacheSRAM •256kBofultra-lowleakageSRAMwithparityfor high-reliabilityoperation –32kBofadditionalSRAMisavailabl

TI1Texas Instruments

德州仪器美国德州仪器公司

TI1

CC2340R2SimpleLink™Bluetooth®5.3LowEnergyWirelessMCU

1Features Wirelessmicrocontroller •Optimized48-MHzArm®Cortex®-M0+processor •256KBofin-systemprogrammableflash •12KBofROMforbootloaderanddrivers •28KBofultra-lowleakageSRAM.FullRAM retentioninstandbymode •2.4GHzRFtransceivercompatiblewith Bluetooth®5.3

TI1Texas Instruments

德州仪器美国德州仪器公司

TI1

CC2674P10SimpleLink™High-PerformanceMultiprotocol2.4-GHzWirelessMCUwithIntegratedPowerAmplifier

1Features Wirelessmicrocontroller •Powerful48MHzArm®Cortex®-M33processor withTrustZone® •FPUandDSPextension •1024kBflashprogrammemory •8kBofcacheSRAM •256kBofultra-lowleakageSRAMwithparityfor high-reliabilityoperation –32kBofadditionalSRAMisavailabl

TITexas Instruments

德州仪器美国德州仪器公司

TI

CC2674R10SimpleLink™High-PerformanceMultiprotocol2.4-GHzWirelessMCU

1Features Wirelessmicrocontroller •Powerful48MHzArm®Cortex®-M33processor withTrustZone® •FPUandDSPextension •1024kBflashprogrammemory •8kBofcacheSRAM •256kBofultra-lowleakageSRAMwithparityfor high-reliabilityoperation –32kBofadditionalSRAMisavailabl

TI1Texas Instruments

德州仪器美国德州仪器公司

TI1

CC2642R-Q1SimpleLink™Bluetooth®5.2LowEnergyWirelessMCU

1Features Wirelessmicrocontroller •Powerful48-MHzArm®Cortex®-M4processor •EEMBCCoreMark®score:148 •352KBflashprogrammemory •256KBofROMforprotocolsandlibraryfunctions •8KBofcacheSRAM •80KBofultra-lowleakageSRAMwithparityfor high-reliabilityoperation •2-

TITexas Instruments

德州仪器美国德州仪器公司

TI

CC2674P10SimpleLink™High-PerformanceMultiprotocol2.4GHzWirelessMCUwithIntegratedPowerAmplifier

1Features Wirelessmicrocontroller •Powerful48MHzArm®Cortex®-M33processor withTrustZone® •FPUandDSPextension •1024kBflashprogrammemory •8kBofcacheSRAM •256kBofultra-lowleakageSRAMwithparityfor high-reliabilityoperation –32kBofadditionalSRAMifparityisdis

TI1Texas Instruments

德州仪器美国德州仪器公司

TI1

SimpleLinkHigh-PerformanceDual-BandWirelessMCUWithIntegratedPowerAmplifier

文件:502.43 Kbytes Page:60 Pages

TI1Texas Instruments

德州仪器美国德州仪器公司

TI1

SimpleLinkHigh-PerformanceDual-BandWirelessMCUWithIntegratedPowerAmplifier

文件:502.43 Kbytes Page:60 Pages

TI1Texas Instruments

德州仪器美国德州仪器公司

TI1

SimpleLinkHigh-PerformanceDual-BandWirelessMCUWithIntegratedPowerAmplifier

文件:502.43 Kbytes Page:60 Pages

TI1Texas Instruments

德州仪器美国德州仪器公司

TI1

SimpleLinkHigh-PerformanceDual-BandWirelessMCUWithIntegratedPowerAmplifier

文件:499.35 Kbytes Page:59 Pages

TI1Texas Instruments

德州仪器美国德州仪器公司

TI1

SimpleLinkHigh-PerformanceDual-BandWirelessMCUWithIntegratedPowerAmplifier

文件:499.35 Kbytes Page:59 Pages

TI1Texas Instruments

德州仪器美国德州仪器公司

TI1

SimpleLinkHigh-PerformanceDual-BandWirelessMCUWithIntegratedPowerAmplifier

文件:502.43 Kbytes Page:60 Pages

TI1Texas Instruments

德州仪器美国德州仪器公司

TI1

封装/外壳:48-VFQFN 裸露焊盘 包装:卷带(TR)剪切带(CT)Digi-Reel® 得捷定制卷带 描述:IC RF TXRX+MCU 802.15.4 48VQFN RF/IF,射频/中频和 RFID 射频收发器 IC

TI2Texas Instruments

德州仪器美国德州仪器公司

TI2

CC2651P3SimpleLink??Single-Protocol2.4GHzWirelessMCUWithIntegratedPowerAmplifier

文件:3.51768 Mbytes Page:63 Pages

TITexas Instruments

德州仪器美国德州仪器公司

TI

CC1352P7SimpleLink??High-PerformanceMulti-BandWirelessMCUWithIntegratedPowerAmplifier

文件:3.92276 Mbytes Page:82 Pages

TITexas Instruments

德州仪器美国德州仪器公司

TI

CC1352P7SimpleLink??High-PerformanceMulti-BandWirelessMCUWithIntegratedPowerAmplifier

文件:3.92276 Mbytes Page:82 Pages

TITexas Instruments

德州仪器美国德州仪器公司

TI

封装/外壳:48-VFQFN 裸露焊盘 包装:卷带(TR)剪切带(CT)Digi-Reel® 得捷定制卷带 描述:SIMPLELINK ARM CORTEX-M4F MULTIP RF/IF,射频/中频和 RFID 射频收发器 IC

TI2Texas Instruments

德州仪器美国德州仪器公司

TI2

Category6Cable,4Pair,F/UTP,CMP

ProductDescription Category6PremiseHorizontalCable(250MHz),4Pair,23AWGSolidBareCopperConductors,F/UTP-FoilShielded,Plenum-CMP,Flamarrest®PVC-LS Jacket

BELDENBelden Inc.

百通电缆设计科技有限公司

BELDEN

ProgrammableQuadLDO

GeneralDescription TheAS1352isahigh-performancequadCMOSlowdropoutvoltageregulatorinasingleQFNpackage.Theefficientsetofprogrammablepowersuppliesisoptimizedtodeliverthebestcompromisebetweenquiescentcurrentandregulatorperformanceformobilephones,PDAs,MP3pla

AMSCOams AG

艾迈斯欧司朗艾迈斯欧司朗股份公司

AMSCO

ProgrammableQuadLDO

文件:307.08 Kbytes Page:10 Pages

AMSCOams AG

艾迈斯欧司朗艾迈斯欧司朗股份公司

AMSCO

ProgrammableQuadLDO

文件:307.08 Kbytes Page:10 Pages

AMSCOams AG

艾迈斯欧司朗艾迈斯欧司朗股份公司

AMSCO

ProgrammableQuadLDO

文件:307.08 Kbytes Page:10 Pages

AMSCOams AG

艾迈斯欧司朗艾迈斯欧司朗股份公司

AMSCO
更新时间:2025-6-25 22:59:00
IC供应商 芯片型号 品牌 批号 封装 库存 备注 价格
TI(德州仪器)
24+
标准封装
10048
原厂直销,大量现货库存,交期快。价格优,支持账期
TI(德州仪器)
24+
QFN48EP(7x7)
1083
只做原装,提供一站式配单服务,代工代料。BOM配单
TI
23+
QFN48
24500
交个朋友支持实单
Texas Instruments
24+
VQFN-48
3265
全新原厂原装,进口正品现货,正规渠道可含税!!
TI(德州仪器)
24+
标准
37211
热卖原装进口
TI
21+
2500
一级代理,专注军工、汽车、医疗、工业、新能源、电力
TI 主营CC系列
24+
VQFN48
5000
十年沉淀唯有原装
TI(德州仪器)
2024+
QFN-48-EP(7x7)
500000
诚信服务,绝对原装原盘
TI(德州仪器)
24+/25+
10000
原装正品现货库存价优
TI
21+
QFN48
2500
全新原装公司现货

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  • SY
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