型号 功能描述 生产厂家&企业 LOGO 操作
CC1311P3

CC2674R10 SimpleLink™ High-Performance Multiprotocol 2.4-GHz Wireless MCU

1 Features Wireless microcontroller • Powerful 48 MHz Arm® Cortex®-M33 processor with TrustZone® • FPU and DSP extension • 1024 kB flash program memory • 8 kB of cache SRAM • 256 kB of ultra-low leakage SRAM with parity for high-reliability operation – 32 kB of additional SRAM is availabl

TI1

德州仪器

CC1311P3

CC2674P10 SimpleLink™ High-Performance Multiprotocol 2.4-GHz Wireless MCU with Integrated Power Amplifier

1 Features Wireless microcontroller • Powerful 48 MHz Arm® Cortex®-M33 processor with TrustZone® • FPU and DSP extension • 1024 kB flash program memory • 8 kB of cache SRAM • 256 kB of ultra-low leakage SRAM with parity for high-reliability operation – 32 kB of additional SRAM is availabl

TI

德州仪器

CC1311P3

CC2340R5-Q1 SimpleLink™ Bluetooth ® 5.3 Low Energy Wireless MCU

1 Features Wireless microcontroller • AEC-Q100 Grade 2 qualified for Automotive applications • Optimized 48-MHz Arm® Cortex®-M0+ processor • 512 KB of in-system programmable flash • 12 KB of ROM for bootloader and drivers • 36 KB of ultra-low leakage SRAM. Full RAM retention in standby mod

TI1

德州仪器

CC1311P3

CC1354P10 SimpleLink™ High-Performance Multi-band Wireless MCU With Integrated Power Amplifier

1 Features Wireless microcontroller • Powerful 48 MHz Arm® Cortex®-M33 processor with TrustZone® • FPU and DSP extension • 1024 kB flash program memory • 8 kB of cache SRAM • 256 kB of ultra-low leakage SRAM with parity for high-reliability operation – 32 kB of additional SRAM is availabl

TI1

德州仪器

CC1311P3

CC2340R2 SimpleLink™ Bluetooth ® 5.3 Low Energy Wireless MCU

1 Features Wireless microcontroller • Optimized 48-MHz Arm® Cortex®-M0+ processor • 256 KB of in-system programmable flash • 12 KB of ROM for bootloader and drivers • 28 KB of ultra-low leakage SRAM. Full RAM retention in standby mode • 2.4 GHz RF transceiver compatible with Bluetooth® 5.3

TI1

德州仪器

CC1311P3

CC2340R2 SimpleLink™ Bluetooth ® 5.3 Low Energy Wireless MCU

1 Features Wireless microcontroller • Optimized 48-MHz Arm® Cortex®-M0+ processor • 256 KB of in-system programmable flash • 12 KB of ROM for bootloader and drivers • 28 KB of ultra-low leakage SRAM. Full RAM retention in standby mode • 2.4 GHz RF transceiver compatible with Bluetooth® 5.3

TI1

德州仪器

CC1311P3

CC1314R10 SimpleLink™ High-Performance Sub-1GHz Wireless MCU

1 Features Wireless microcontroller • Powerful 48MHz Arm® Cortex®-M33 processor with TrustZone® • FPU and DSP extension • 1024kB flash program memory • 8kB of cache SRAM • 256kB of ultra-low leakage SRAM with parity for high-reliability operation – 32kB of additional SRAM if parity is dis

TI1

德州仪器

CC1311P3

CC2674P10 SimpleLink™ High-Performance Multiprotocol 2.4GHz Wireless MCU with Integrated Power Amplifier

1 Features Wireless microcontroller • Powerful 48MHz Arm® Cortex®-M33 processor with TrustZone® • FPU and DSP extension • 1024kB flash program memory • 8kB of cache SRAM • 256kB of ultra-low leakage SRAM with parity for high-reliability operation – 32kB of additional SRAM if parity is dis

TI1

德州仪器

CC1311P3

CC2652PSIP SimpleLink??Multiprotocol 2.4-GHz Wireless System-in-Package With Integrated Power Amplifier

1 Features Wireless microcontroller • Powerful 48-MHz Arm® Cortex®-M4F processor • 352KB flash program memory • 256KB of ROM for protocols and library functions • 8KB of cache SRAM • 80KB of ultra-low leakage SRAM with parity for high-reliability operation • Dynamic multiprotocol manager (

TI

德州仪器

CC1311P3

CC2642R-Q1 SimpleLink™ Bluetooth® 5.2 Low Energy Wireless MCU

1 Features Wireless microcontroller • Powerful 48-MHz Arm® Cortex®-M4 processor • EEMBC CoreMark® score: 148 • 352KB flash program memory • 256KB of ROM for protocols and library functions • 8KB of cache SRAM • 80KB of ultra-low leakage SRAM with parity for high-reliability operation • 2-

TI

德州仪器

CC1311P3

CC1311P3 SimpleLink??High-Performance Sub-1 GHz Wireless MCU With Integrated Power Amplifier

文件:3.3882 Mbytes Page:63 Pages

TI

德州仪器

CC1311P3

CC2651P3 SimpleLink??Single-Protocol 2.4 GHz Wireless MCU With Integrated Power Amplifier

文件:3.51768 Mbytes Page:63 Pages

TI

德州仪器

CC1311P3 SimpleLink??High-Performance Sub-1 GHz Wireless MCU With Integrated Power Amplifier

文件:3.3882 Mbytes Page:63 Pages

TI

德州仪器

封装/外壳:48-VFQFN 裸露焊盘 包装:托盘 描述:SIMPLELINK ARM CORTEX-M4 SUB-1 G RF/IF,射频/中频和 RFID 射频收发器 IC

TI2

德州仪器

更新时间:2025-8-15 15:41:00
IC供应商 芯片型号 品牌 批号 封装 库存 备注 价格
NA
23+
NA
26094
10年以上分销经验原装进口正品,做服务型企业
Texas Instruments
20+
VQFN-48
29860
TI微控制器MCU-可开原型号增税票
TI/德州仪器
25+
原厂封装
10280
原厂授权代理,专注军工、汽车、医疗、工业、新能源!
TI/德州仪器
20+
VQFN-48
5000
原厂原装订货诚易通正品现货会员认证企业
TI/德州仪器
23+
VQFN-48
9990
只有原装
TI德州仪器
22+
24000
原装正品现货,实单可谈,量大价优
TI/德州仪器
25+
原厂封装
10280
N/A
23+
80000
专注配单,只做原装进口现货
N/A
23+
80000
专注配单,只做原装进口现货
TI/德州仪器
23+
NA
36880
只做原装,QQ询价有询必回

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