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CC1311P3数据手册规格书PDF详情
1 Features
Wireless microcontroller
• AEC-Q100 Grade 2 qualified for Automotive
applications
• Optimized 48-MHz Arm® Cortex®-M0+ processor
• 512 KB of in-system programmable flash
• 12 KB of ROM for bootloader and drivers
• 36 KB of ultra-low leakage SRAM. Full RAM
retention in standby mode
• 2.4 GHz RF transceiver compatible with
Bluetooth® 5.3 Low Energy
• Integrated balun
• Supports over-the-air upgrade (OTA)
• Serial Wire Debug (SWD)
Low power consumption
• MCU consumption:
– 2.6 mA active mode, CoreMark®
– 53 μA/MHz running CoreMark®
– < 710 nA standby mode, RTC, 36 KB RAM
– 165 nA shutdown mode, wake-up on pin
• Radio Consumption:
– 5.3 mA RX
– 5.1 mA TX at 0 dBm
– < 11.0 mA TX at +8 dBm
Wireless protocol support
• Bluetooth® 5.3 Low Energy
High-performance radio
• -102 dBm for Bluetooth® Low Energy 125 kbps
• -96.5 dBm for Bluetooth® Low Energy 1 Mbps
• Output power up to +8 dBm with temperature
compensation
Regulatory compliance
• Suitable for systems targeting compliance with
these standards:
– EN 300 328 (Europe)
– FCC CFR47 Part 15
– ARIB STD-T66 (Japan)
MCU peripherals
• 19 I/O Pads
– 2 IO pads SWD, muxed with GPIOs
– 2 IO pads LFXT, muxed with GPIOs
– 15 DIOs (analog or digital IOs)
• 3 × 16-bit and 1× 24-bit general-purpose timers,
quadrature decode mode support
• 12-bit ADC, 1.2 Msps with external reference, 267
ksps with internal reference, 8 external ADC inputs
• 1× low power comparator
• 1× UART
• 1× SPI
• 1× I2C
• Real-time clock (RTC)
• Integrated temperature and battery monitor
• Watchdog timer
Security enablers
• AES 128-bit cryptographic accelerator
• Random number generator from on-chip analog
noise
Development tools and software
• LP-EM-CC2340R5 LaunchPad Development Kit
• SimpleLink™ CC23xx Software Development Kit
(SDK)
• SmartRF™ Studio for simple radio configuration
• SysConfig system configuration tool
Operating range
• On-chip buck DC/DC converter
• 1.71-V to 3.8-V single supply voltage
• Tj: -40 to +125°C
• HBM ESD Classification Level 2
• CDM ESD Classification Level C3
RoHS-compliant package
• 5-mm × 5-mm RHB QFN32 with wettable flanks
(19 GPIOs)
2 Applications
• Automotive
– Car access and security systems
• Passive entry passive start (PEPS)
• Remote keyless entry (RKE)
– Advanced driver assistance systems (ADAS)
– Tire pressure monitoring systems (TPMS)
3 Description
The SimpleLink™ CC2340R5-Q1 device is an AEC-Q100 compliant wireless microcontroller (MCU) targeting
Bluetooth 5 Low Energy automotive applications. The device is optimized for low-power wireless communication
in applications such as tire pressure monitoring systems (TPMS), car access including key fogs used in passive
entry passive start (PEPS) and remote keyless entry (RKE), cable replacement, and smartphone connectivity.
The Highlighted features of this device include:
• Support for Bluetooth ® 5 features: High Speed Mode (2 Mbps PHY), Long Range (LE Coded 125 kbps and
500 kbps PHYs), Privacy 1.2.1 and Channel Selection Algorithm #2, as well as backwards compatibility and
support for key features from the Bluetooth ® 4.2 and earlier Low Energy specifications.
• Fully-qualified Bluetooth ® 5.3 software protocol stack included with the SimpleLink™ CC23xx Software
Development Kit (SDK).
• Ultra-low standby current less than 0.71 μA with RTC operational and full RAM retention that enables
significant battery life extension especially for applications with longer sleep intervals.
• Integrated balun for reduced Bill-of-Material (BOM) board layout.
• Excellent radio sensitivity and robustness (selectivity and blocking) performance for Bluetooth ® Low Energy
(-102 dBm for 125 kbps LE Coded PHY, with integrated balun).
The CC2340R5-Q1 device is part of the SimpleLink™ MCU platform, which consists of Wi-Fi®, Bluetooth Low
Energy, Thread, Zigbee, Sub-1 GHz MCUs, and host MCUs that all share a common, easy-to-use development
environment with a single core software development kit (SDK) and rich tool set. A one-time integration of the
SimpleLink™ platform enables you to add any combination of the portfolio’s devices into your design, allowing
100 percent code reuse when your design requirements change. For more information, visit SimpleLink™ MCU
platform.
供应商 | 型号 | 品牌 | 批号 | 封装 | 库存 | 备注 | 价格 |
---|---|---|---|---|---|---|---|
TI德州仪器 |
22+ |
24000 |
原装正品现货,实单可谈,量大价优 |
||||
TI(德州仪器) |
23+ |
NA/ |
7350 |
现货供应,当天可交货!免费送样,原厂技术支持!!! |
|||
TI/德州仪器 |
23+ |
8355 |
只做原装现货/实单可谈/支持含税拆样 |
||||
TI |
21+ |
原厂COC随货 |
500000 |
原装正品 |
|||
TI |
23+ |
48-VFQFN |
6130 |
确保原装正品,专注终端客户一站式BOM配单 |
|||
N/A |
23+ |
80000 |
专注配单,只做原装进口现货 |
||||
N/A |
23+ |
80000 |
专注配单,只做原装进口现货 |
||||
TI/德州仪器 |
21+ |
VQFN-48 |
13880 |
公司只售原装,支持实单 |
|||
TI/德州仪器 |
22+ |
VQFN-48 |
8880 |
原装认准芯泽盛世! |
|||
TI/德州仪器 |
23+ |
VQFN-48 |
2500 |
原装正品,支持实单 |
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Texas Instruments(TI) 德州仪器 (TI)
德州仪器(Texas Instruments),简称TI,是全球领先的半导体公司,为现实世界的信号处理提供创新的数字信号处理(DSP)及模拟器件技术。除半导体业务外,还提供包括传感与控制、教育产品和数字光源处理解决方案。TI总部位于美国德克萨斯州的达拉斯,并在25多个国家设有制造、设计或销售机构。德州仪器是推动互联网时代不断发展的半导体引擎,作为实时技术的领导者,TI正在快速发展,在无线与宽带接入等大型市场及数码相机和数字音频等新兴市场方面,凭借性能卓越的半导体解决方案不断推动着互联网时代的前进步伐。TI预想未来世界的方方面面都渗透着TI产品的点点滴滴,每个电话、每次上网、拍的每张照片、听的每