位置：首页 > IC中文资料第6037页 > CABGA
| 型号 | 功能描述 | 生产厂家 企业 | LOGO | 操作 |
|---|---|---|---|---|
CABGA | Silver Wirebonding KEY FEATURES Ag-Alloy wire is softer than Cu wire resulting in lower Al-Splash and lower risk of bond pad damage Ag-Alloy wire has a wide process window that improves manufacturability for devices with fragile bond pad structures | amkor 安靠科技 |   | |
CABGA | ChipArray짰 Packages 文件：310.74 Kbytes Page：2 Pages | amkor 安靠科技 | | |
Amkor’s ChipArray® Ball Grid Array (CABGA) laminate based packages are compatible with SMT mounting processes worldwide. FEATURES Cutting-edge technology and expanding package offerings provide a platform from prototype-toproduction Copper (Cu) wire interconnect method and high-volume infrastructure at all Amkor CABGA production facilities Lowest cost using Amkor standard CABGA bill of materials selection 1. | amkor 安靠科技 | |
CABGA产品属性
- 类型
描述
- 型号
CABGA
- 制造商
AMKOR
- 制造商全称
AMKOR
- 功能描述
ChipArray㈢ Packages
| IC供应商 | 芯片型号 | 品牌 | 批号 | 封装 | 库存 | 备注 | 价格 |
|---|---|---|---|---|---|---|---|
AMKOR |
24+ |
NA/ |
55 |
优势代理渠道,原装正品,可全系列订货开增值税票 |
|||
AMKOR |
2016+ |
BGA |
1980 |
只做原装,假一罚十,公司可开17%增值税发票! |
|||
AMKOR |
2023+ |
BGA |
8635 |
一级代理优势现货,全新正品直营店 |
|||
AWKOR |
25+ |
BGA |
996880 |
只做原装,欢迎来电资询 |
|||
AMKOR |
25+23+ |
BGA |
42581 |
绝对原装正品全新进口深圳现货 |
|||
AMKOR |
25+ |
25000 |
原厂原包 深圳现货 主打品牌 假一赔百 可开票! |
||||
AMKOR |
24+ |
BGA |
625 |
||||
AMKOR |
19+ |
BGA |
189 |
一级代理,专注军工、汽车、医疗、工业、新能源、电力 |
|||
AMKOR |
24+ |
BGA |
8540 |
只做原装正品现货或订货假一赔十! |
|||
AMKOR |
24+ |
LQFP64 |
9600 |
原装现货,优势供应,支持实单! |
CABGA规格书下载地址
CABGA参数引脚图相关
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- CAB-9.6-1.2
- CAB-9.5-0.47
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DdatasheetPDF页码索引
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