型号 功能描述 生产厂家 企业 LOGO 操作
CABGA_V01

Amkor’s ChipArray® Ball Grid Array (CABGA) laminate based packages are compatible with SMT mounting processes worldwide.

FEATURES Cutting-edge technology and expanding package offerings provide a platform from prototype-toproduction Copper (Cu) wire interconnect method and high-volume infrastructure at all Amkor CABGA production facilities Lowest cost using Amkor standard CABGA bill of materials selection 1.

AMKOR

安靠科技

更新时间:2026-3-15 23:00:00
IC供应商 芯片型号 品牌 批号 封装 库存 备注 价格
AWKOR
24+
BGA
28550
只做原装 公司现货库存
AMKOR
2016+
BGA
1980
只做原装,假一罚十,公司可开17%增值税发票!
AMKOR
2023+
BGA
8635
一级代理优势现货,全新正品直营店
AMKOR
2026+
BGA
55
原装正品,假一罚十!
AMKOR
25+23+
BGA
42581
绝对原装正品全新进口深圳现货
AMKOR
2450+
BGA
9850
只做原厂原装正品现货或订货假一赔十!
AMKOR
24+
BGA
625
AMKOR
24+
LQFP64
9600
原装现货,优势供应,支持实单!
AWKOR
2447
BGA
100500
一级代理专营品牌!原装正品,优势现货,长期排单到货
AMKOR
13+
BGA
55
原装现货

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