封装/外壳：256-LBGA 包装：托盘 描述：IC FPGA 157 I/O 256FBGA 集成电路（IC） FPGA（现场可编程门阵列）

130-nm, 7-Layer Metal (6 Copper), Flash-Based CMOS Process

Features and Benefits High Capacity • 15 k to 1 M System Gates • Up to 144 kbits of True Dual-Port SRAM • Up to 300 User I/Os Reprogrammable Flash Technology • 130-nm, 7-Layer Metal (6 Copper), Flash-Based CMOS Process • Instant On Level 0 Support • Single-Chip Solution