型号 功能描述 生产厂家 企业 LOGO 操作

Advanced Single Chip Modem

DESCRIPTION The 73M2901/5V is a single-chip modem that combines all the controller (DTE) and data pump functions necessary to implement an intelligent V.22bis data modem. This device is based on TDK Semiconductor’s implementation of the industry standard 8032 microcontroller core with a proprie

TDK

东电化

Single Chip Modem

DESCRIPTION The 73M2901CE low speed modem integrates a data pump, controller, and analog front end in a 3.3 V device with a powerful AT command host interface. The modem reduces external component count/cost by incorporating many features like parallel phone detect, Line-In-Use and Ring detect

TERIDIAN

V.22bis Single Chip Modem

DESCRIPTION The 73M2901CE low speed modem integrates a data pump, controller, and analog front end in a 3.3 V device with a powerful AT command host interface. The modem reduces external component count/cost by incorporating many features like parallel phone detect, Line-In-Use and Ring detection

TERIDIAN

V.22bis Single Chip Modem

DESCRIPTION The 73M2901CE low speed modem integrates a data pump, controller, and analog front end in a 3.3 V device with a powerful AT command host interface. The modem reduces external component count/cost by incorporating many features like parallel phone detect, Line-In-Use and Ring detection

TERIDIAN

Single Chip Modem

DESCRIPTION The 73M2901CE low speed modem integrates a data pump, controller, and analog front end in a 3.3 V device with a powerful AT command host interface. The modem reduces external component count/cost by incorporating many features like parallel phone detect, Line-In-Use and Ring detect

TERIDIAN

73M2901CL-IGVR/F产品属性

  • 类型

    描述

  • 型号

    73M2901CL-IGVR/F

  • 功能描述

    电信线路管理 IC V.22bis Single-Chip Modem w/Cid Ppu Liu

  • RoHS

  • 制造商

    STMicroelectronics

  • 产品

    PHY

  • 接口类型

    UART

  • 电源电压-最大

    18 V

  • 电源电压-最小

    8 V

  • 电源电流

    30 mA

  • 最大工作温度

    + 85 C

  • 最小工作温度

    - 40 C

  • 安装风格

    SMD/SMT

  • 封装/箱体

    VFQFPN-48

  • 封装

    Tray

更新时间:2026-1-5 13:39:02
IC供应商 芯片型号 品牌 批号 封装 库存 备注 价格
MAXIM/美信
2025+
QFP
5000
原装进口价格优 请找坤融电子!
73M2901C-32IH/5
25+
405
405
TDK/东电化
24+
PLCC32
3580
原装现货/15年行业经验欢迎询价
TDK(东电化)
2021/2022+
标准封装
40000
原厂原装现货订货价格优势终端BOM表可配单提供样品
MAXIM/美信
22+
明嘉莱只做原装正品现货
2510000
TQFP-32
TERIDIAN
24+
QFP
60000
全新原装现货
TDK
24+
PLCC
20000
全新原厂原装,进口正品现货,正规渠道可含税!!
TDK/东电化
23+
PLCC
8160
原厂原装
TDK/东电化
24+
PLCC32
47186
郑重承诺只做原装进口现货
TERIDIAN
2403+
QFP
6489
原装现货热卖!十年芯路!坚持!

73M2901CL-IGVR/F数据表相关新闻