型号 功能描述 生产厂家 企业 LOGO 操作

SMART 3 ADVANCED BOOT BLOCK 4-, 8-, 16-, 32-MBIT FLASH MEMORY FAMILY

INTRODUCTION This datasheet contains the specifications for the Advanced Boot Block flash memory family, which is optimized for low power, portable systems. This family of products features 1.65 V–2.5 V or 2.7 V– 3.6 V I/Os and a low VCC/VPP operating range of 2.7 V–3.6 V for read, program, and e

Intel

英特尔

Advanced Boot Block Flash Memory (C3)

The 0.25 µm 3 Volt Advanced+ Boot Block, manufactured on Intel’s latest 0.25 µ technology, represents a feature-rich solution at overall lower system cost. Smart 3 flash memory devices incorporate low voltage capability (2.7 V read, program and erase) with high-speed, low-power operation. Flexible

Intel

英特尔

3 Volt Intel Advanced Boot Block Flash Memory

Device Description This section provides an overview of the Intel® Advanced+ Boot Block Flash Memory (C3) device features, packaging, signal naming, and device architecture. Product Overview The C3 device provides high-performance asynchronous reads in package-compatible densities with a 16 bit

Intel

英特尔

WORD-WIDE FlashFile MEMORY FAMILY

INTRODUCTION This datasheet contains 16- and 32-Mbit WordWide FlashFileTM memory (28F160S3 and 28F320S3) specifications. Section 1 provides a flash memory overview. Sections 2, 3, 4, and 5 describe the memory organization and functionality. Section 6 covers electrical specifications for extended

Intel

英特尔

WORD-WIDE FlashFile MEMORY FAMILY

Intel’s Word-Wide FlashFile™ memory family provides high-density, low-cost, nonvolatile, read/write storage solutions for a wide range of applications. The word-wide memories are available at various densities in the same package type. Their symmetrically-blocked architecture, voltage, and extende

Intel

英特尔

FAST BOOT BLOCK FLASH MEMORY FAMILY 8 AND 16 MBIT

Intel

英特尔

WORD-WIDE FlashFile MEMORY FAMILY

Intel

英特尔

WORD-WIDE FlashFile MEMORY FAMILY

Intel

英特尔

16 M-bit (1 MB x 16) Smart 3 Flash Memories

DESCRIPTION The LH28F160BG-TL/BGH-TL flash memories with Smart 3 technology are high-density, low-cost, nonvolatile, read/write storage solution for a wide range of applications. The LH28F160BG-TL/BGH-TL can operate at VCC and VPP = 2.7 V. FEATURES • Smart 3 technology – 2.7 to 3.6 V VCC

SHARPSharp Corporation

夏普

16 M-bit (1 MB x 16) Smart 3 Flash Memories

DESCRIPTION The LH28F160BG-TL/BGH-TL flash memories with Smart 3 technology are high-density, low-cost, nonvolatile, read/write storage solution for a wide range of applications. The LH28F160BG-TL/BGH-TL can operate at VCC and VPP = 2.7 V. FEATURES • Smart 3 technology – 2.7 to 3.6 V VCC

SHARPSharp Corporation

夏普

28F160产品属性

  • 类型

    描述

  • 型号

    28F160

  • 制造商

    INTEL

  • 制造商全称

    Intel Corporation

  • 功能描述

    SMART 3 ADVANCED BOOT BLOCK 4-, 8-, 16-, 32-MBIT FLASH MEMORY FAMILY

更新时间:2025-12-25 23:01:00
IC供应商 芯片型号 品牌 批号 封装 库存 备注 价格
INTERSIL
24+
NA/
4050
原装现货,当天可交货,原型号开票
INTEL/英特尔
24+
BGA
10426
只做原装 公司现货库存
INTEL/英特尔
25+
BGA
996880
只做原装,欢迎来电资询
INTEL/英特尔
23+
BGA
98900
原厂原装正品现货!!
Intel
24+
5000
原装现货,特价销售
INTEL
BGA
3350
一级代理 原装正品假一罚十价格优势长期供货
INTEL
原厂封装
9800
原装进口公司现货假一赔百
INTEL
25+
BGA
30
百分百原装正品 真实公司现货库存 本公司只做原装 可
Intel
25+
2
公司优势库存 热卖中!!
INTEL
25+23+
BGA
36824
绝对原装正品全新进口深圳现货

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    2020-12-31