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1SS38价格
参考价格:¥0.1170
型号:1SS380 品牌:ROHM 备注:这里有1SS38多少钱,2025年最近7天走势,今日出价,今日竞价,1SS38批发/采购报价,1SS38行情走势销售排行榜,1SS38报价。| 型号 | 功能描述 | 生产厂家 企业 | LOGO | 操作 |
|---|---|---|---|---|
Surface Mount Switching Diode Surface Mount Switching Diode P/b Lead(Pb)-Free Features: * High relability * Low Rever Leakage Current * Small Outline Surface Mount SOD-323 Package | WEITRON | |||
Switching diode Switching Diode Features 1) Ultra small mold type. (UMD2) 2) High reliability Applications High speed switching | ROHM 罗姆 | |||
Silicon Epitaxial Planar Diode FEATURES ● Small surface mounting type ● High speed ● Suitable for high packing density APPLICATIONS ● High speed switching | BILIN 银河微电 | |||
SWITCHING DIODE Features ● Ultra small mold type. (UMD2) ● High reliability. | KEXIN 科信电子 | |||
SURFACE MOUNT FAST SWITCHING DIODE Silicon Epitaxial Planar Die Construction Fast Switching Speed Surface Mount Package Ideally Suited for Automatic Insertion For General Purpose Switching Applications Plastic Material – UL Recognition Flammability Classification 94V-0 | WTE Won-Top Electronics | |||
Silicon Epitaxial Planar Diodes Features ◇ Small surface mounting type. ◇ High speed. ◇ Suitable for high packing density. Applications ◇ High speed switching. | LUGUANG 鲁光电子 | |||
Silicon Epitaxial Planar Diode FEATURES ● Small surface mounting type ● High speed ● Suitable for high packing density APPLICATIONS ● High speed switching | CHENDA 辰达半导体 | |||
Silicon Epitaxial Planar Diode FEATURES ● Small surface mounting type. ● High speed. ● Suitable for high packing density. APPLICATIONS ● High speed switching. | DSK | |||
SWITCHING DIODE VOLTAGE 40 Volts CURRENT 0.1 Ampere VOLTAGE 40 Volts CURRENT 0.1 Ampere FEATURE * Small surface mounting type. (SC-76/SOD-323) * High speed. (TRR=1.5nSec Typ.) * Suitable for high packing density. * Maximum total power disspation is 150mW. * Peak forward current is 200mA. APPLICATION * Ultra high speed switching | CHENMKO 力勤 | |||
SURFACE MOUNT FAST SWITCHING DIODE Silicon Epitaxial Planar Die Construction Fast Switching Speed Surface Mount Package Ideally Suited for Automatic Insertion For General Purpose Switching Applications Plastic Material – UL Recognition Flammability Classification 94V-0 | WTE Won-Top Electronics | |||
Switching Diode (Low leakage) Features High reliability Small mold type Low IR Application General switching | ROHM 罗姆 | |||
Switching Diode (Low leakage) Features High reliability Small mold type Low IR Application General switching | ROHM 罗姆 | |||
RF Manual 16th edition | ETC 知名厂家 | ETC | ||
DIODE (VHF TUNER BAND SWITCH APPLICATIONS) VHF Tuner Band Switch Applications • Small package • Small total capacitance: CT = 1.2 pF (max) • Low series resistance: rs = 0.6 Ω (typ.) | TOSHIBA 东芝 | |||
VHF TUNER BAND SWITCH APPLICATIONS Features ● Small Total Capacitance: CT = 1.2pF(Max.) ● Low Series Resistance: rs =0.6Ω(Typ.) | KEXIN 科信电子 | |||
DIODE (ULTRA HIGH SPEED SWITCHING APLICATION) Ultra High Speed Switching Application ● Small package ● Composed of 2 independent diodes. ● Low forward voltage : VF (3) = 0.92V (typ.) ● Fast reverse recovery time: Trr = 1.6ns (typ.) | TOSHIBA 东芝 | |||
DIODE LOW VOLTAGE HIGH SPEED SWITCHING Low Voltage High Speed Switching Small package Composed of 2 independent diodes. Low forward voltage: VF (3) = 0.54V (typ.) Low reverse current: IR= 5μA (max) | TOSHIBA 东芝 | |||
Low Voltage High Speed Switching Low Voltage High Speed Switching Features Composed of 2 independent diodes. Low forward voltage: VF(3)= 0.54V (typ.) Low reverse current: IR=5 A(max) | KEXIN 科信电子 | |||
DIODE (LOW VOLTAGE HIGH SPEED SWITCHING) Low Voltage High Speed Switching ● Small package ● Composed of 2 independent diodes. ● Low forward voltage: VF (2) = 0.23V (typ.) @IF = 5mA | TOSHIBA 东芝 | |||
DIODE (HIGH SPEED SWITCHING) High Speed Switching • Low forward voltage: VF (2) = 0.23V (typ.) @IF = 5mA • Small package | TOSHIBA 东芝 | |||
DIODE (HIGH SPEED SWITCHING) High Speed Switching • Low forward voltage: VF = 0.23V (typ.) @IF = 5mA • Ultra-small package | TOSHIBA 东芝 | |||
High-Speed Switching Applications High-Speed Switching Applications • Low forward voltage: VF = 0.23 V (typ.) @IF = 5 mA • Ultra-small package | TOSHIBA 东芝 | |||
DIODE (ULTRA HIGH SPEED SWITCHING APPLICATION) Ultra High Speed Switching Application Compact 2-pin package – ideal for high-density mounting Low forward voltage : VF (3) = 0.98V (typ.) Fast reverse recovery time : trr= 1.6ns (typ.) Small total capacitance : CT= 0.5pF (typ.) | TOSHIBA 东芝 | |||
High Speed Switching Diodes SWITCHING DIODE 100 m AMPERES 80 VOLTS Features: *Extremely High Switching Speed. *Low Reverse Leakage Current. *High Reliability. *Small Outline Surface Mount SOD-523 Package. Applications: *High Speed Switching. | WEITRON | |||
High Speed Switching Diode High Speed Switching Diode FEATURES Low forward voltage. Fast reverse recovery time. Small total capacitance. APPLICATIONS High-speed switching in surface mounted circuits. | BILIN 银河微电 | |||
85 Volts Switching Diode 85 Volts Switching Diode Features • High speed switching diode • Surface mountpackage • For general purpose switching applications • Marking: G • Epoxy meets UL 94 V-0 flammability rating • Moisture Sensitivity Level 1 | MCC | |||
TOSHIBA Diode Silicon Epitaxial Planar Type Switching Diodes Silicon Epitaxial Planar Features (1) Small package (2) Low forward voltage: VF(3) = 0.98 V (typ.) (3) Fast reverse recovery time: trr= 1.6 ns (typ.) (4) Small total capacitance: Ct = 0.5 pF (typ.) Applications • Ultra-High-Speed Switching | TOSHIBA 东芝 | |||
ULTRA HIGH SPEED SWITCHING APPLICATION ULTRA HIGH SPEED SWITCHING APPLICATION Features Small Package Low forward voltage :VF(3)= 0.98V(TYP.) Fast Forward Voltage :trr = 1.6ns(TYP.) Small Total Capacitance :CT= 0.5pF(TYP.) | KEXIN 科信电子 | |||
SURFACE MOUNT FAST SWITCHING DIODE Silicon Epitaxial Planar Die Construction Fast Switching Speed Surface Mount Package Ideally Suited for Automatic Insertion For General Purpose Switching Applications Plastic Material – UL Recognition Flammability Classification 94V-0 | WTE Won-Top Electronics | |||
High Speed Switching Diodes High Speed Switching Diodes Features Low forward voltage. Fast reverse recovery time. Small total capacitance. Applications High-speed switching in surface mounted circuits. | LUGUANG 鲁光电子 | |||
High Speed Switching Diode FEATURES Small surface mounting type High speed High reliability with high surge current handing capability | SXSEMI 瞬芯半导体 | |||
Switching Diodes Silicon Epitaxial Planar 1. Applications • Ultra-High-Speed Switching 2. Features (1) Small package (2) Low forward voltage: VF(3) = 0.98 V (typ.) (3) Fast reverse recovery time: trr = 1.6 ns (typ.) (4) Small total capacitance: Ct = 0.5 pF (typ.) | TOSHIBA 东芝 | |||
TOSHIBA Diode Silicon Epitaxial Planar Type Switching Diodes Silicon Epitaxial Planar Features (1) Small package (2) Low forward voltage: VF(3) = 0.98 V (typ.) (3) Fast reverse recovery time: trr= 1.6 ns (typ.) (4) Small total capacitance: Ct = 0.5 pF (typ.) Applications • Ultra-High-Speed Switching | TOSHIBA 东芝 | |||
Switching Diodes Silicon Epitaxial Planar 1. Applications • Ultra-High-Speed Switching 2. Features (1) Small package (2) Low forward voltage: VF(3) = 0.98 V (typ.) (3) Fast reverse recovery time: trr = 1.6 ns (typ.) (4) Small total capacitance: Ct = 0.5 pF (typ.) | TOSHIBA 东芝 | |||
Switching Diodes Silicon Epitaxial Planar 1. Applications • Ultra-High-Speed Switching 2. Features (1) Small package (2) Low forward voltage: VF(3) = 0.98 V (typ.) (3) Fast reverse recovery time: trr = 1.6 ns (typ.) (4) Small total capacitance: Ct = 0.5 pF (typ.) | TOSHIBA 东芝 | |||
SURFACE MOUNT SWITCHING DIODES SURFACE MOUNT SWITCHING DIODES VOLTAGE 80 Volts POWER 200 mWatts FEATURES • Fast switching Speed. • Electrically ldentical to Standerd JEDEC • Surface Mount Package ldeally Suited for Automatic lnsertion. • Lead free in comply with EU RoHS 2002/95/EC directives. • Green mold | PANJIT 強茂 | |||
Surface Mount Switching Diodes Features Fast switching Speed Electrically ldentical to Standerd JEDEC Surface Mount Package ldeally Suited for Automatic lnsertion Lead free in compliance with EU RoHS 2.0 Green molding compound as per IEC 61249 standard | PANJIT 強茂 | |||
Surface Mount Switching Diodes Features Fast switching Speed Electrically ldentical to Standerd JEDEC Surface Mount Package ldeally Suited for Automatic lnsertion Lead free in compliance with EU RoHS 2.0 Green molding compound as per IEC 61249 standard | PANJIT 強茂 | |||
SWITCHING DIODE VOLTAGE 85 Volts CURRENT 0.1 Ampere SURFACE MOUNT SWITCHING DIODE VOLTAGE 85 Volts CURRENT 0.1 Ampere FEATURE * Small surface mounting type. (SC-79/SOD-523) * Low VF and low IR * High reliability APPLICATION * Low barrier diode for detectors up to GHz frequencies CONSTRUCTION * Silicon epitaxial | CHENMKO 力勤 | |||
SURFACE MOUNT FAST SWITCHING DIODE Silicon Epitaxial Planar Die Construction Fast Switching Speed Surface Mount Package Ideally Suited for Automatic Insertion For General Purpose Switching Applications Plastic Material – UL Recognition Flammability Classification 94V-0 | WTE Won-Top Electronics | |||
Plastic-Encapsulate Diodes FEATURES Small surface mounting type High speed High reliability with high surge current handing capability | GWSEMI 唯圣电子 | |||
Plastic-Encapsulate Diodes FEATURES Small surface mounting type High speed High reliability with high surge current handing capability -CAR for automotive and other applications requiring unique site and control change requirements;AEC-Q101 qualified and PPAP capable | GWSEMI 唯圣电子 | |||
SILICON EPITAXIAL SCHOTTKY BARRIER DIODE SILICON EPITAXIAL SCHOTTKY BARRIER DIODE for high speed switching application | ZSELEC 淄博圣诺 | |||
Plastic-Encapsulate Diodes SCHOTTKY BARRIER DIODE Features: ◾ Small Pacakage; ◾ Low Forward Voltage; ◾ Low Reverse Current; | SHENZHENSLS 三联盛 | |||
High Speed Switching Diode FEATURES ● Small pacakage ● Low forward voltage : VF3 = 0.54 ( typ ) ● Low reverse current : IR = 5uA ( typ ) | ZHAOXINGWEI | |||
1SS388 FAST SWITCHING DIODE Features Fast switching devices SOD523 Micro SMD package RoHS compliant / Green EMC Surface Mount Package Ideally Suited for Automatic Insertion For General Purpose Switching Applications High Conductance All SMC parts are traceable to the wafer lot Additional testing can be offered upon | SMCDIODE 桑德斯微电子 | |||
High Speed Switching Diode FEATURES ● Low forw | DSK | |||
High Speed Switching Application ● High Speed Switching Application Small pacakage Low forward voltage : VF(3) = 0.54V ( typ ) Low reverse current : IR = 5uA ( typ ) | SKTECHNOLGYSHIKE Electronics 时科广东时科微实业有限公司 | |||
SURFACE MOUNT SCHOTTKY BARRIER DIODE Low Turn-On Voltage Fast Switching Speed PN Junction Guard Ring for Transient and ESD Protection For General Purpose Switching Applications Plastic Material – UL Recognition Flammability Classification 94V-0 | WTE Won-Top Electronics | |||
SILICON EPITAXIAL SCHOTTKY BARRIER DIODE SILICON EPITAXIAL SCHOTTKY BARRIER DIODE for high speed switching application | SEMTECH_ELEC 先之科半导体 | |||
High Speed Switching Diode Features ◇ Low forward voltage. ◇ Low reverse current. ◇ Small package. Applications ◇ High-speed switching in surface mounted circuits. | LUGUANG 鲁光电子 | |||
High Speed SWITCHING Diode FEATURES ● Small pacakage ● Low forward voltage : VF3 = 0.54 ( typ ) ● Low reverse current : IR = 5uA ( typ ) | WINNERJOIN 永而佳 | |||
High Speed SWITCHING Diodes FEATURES ● Small pacakage ● Low forward voltage : VF3 = 0.54 ( typ ) ● Low reverse current : IR = 5uA ( typ ) | HTSEMI 金誉半导体 | |||
SCHOTTKY BARRIER DIODE SCHOTTKY BARRIER DIODE FEATURES ● Small pacakage ● Low forward voltage ● Low reverse current | JIANGSU 长电科技 | |||
SILICON EPITAXIAL SCHOTTKY BARRIER TYPE FEATURES • Low forward voltage : VF(3)=0.54V(typ.) • Low reverse current : IR=5μA(typ.) • Lead free in compliance with EU RoHS 2011/65/EU directive • Green molding compound as per IEC61249 Std. . (Halogen Free) APPLICATIONS • Case : SOD-523 plastic • Terminals : Solderable per MIL-STD-750,M | PANJIT 強茂 | |||
SILICON EPITAXIAL SCHOTTKY BARRIER TYPE FEATURES • Low forward voltage : VF(3)=0.54V(typ.) • Low reverse current : IR=5μA(typ.) • Lead free in compliance with EU RoHS 2011/65/EU directive • Green molding compound as per IEC61249 Std. . (Halogen Free) APPLICATIONS • Case : SOD-523 plastic • Terminals : Solderable per MIL-STD-750,M | PANJIT 強茂 | |||
HIGH SPEED SWITCHING APPLICATION Features ● Small Package ● Low Forward Voltage :VF(3) = 0.54V(TYP.) ● Low Reverse Current :IR = 5 Ìa(TYP.) | KEXIN 科信电子 | |||
SILICON EPITAXIAL SCHOTTKY BARRER DIODE FEATURES : * Small package * Low forward voltage * Low revese current * Pb / RoHS Free MECHANICAL DATA : * Lesd Finish : 100 Matte Sn (Tin) * Mounting Position : Any * Qualified Max Reflow Temperature : 260 °C | EIC | |||
High Speed Switching Application High Speed Switching Application ● Small package ● Low forward voltage: VF (3) = 0.54V (typ.) ● Low reverse current: IR = 5μA (typ.) | TOSHIBA 东芝 | |||
45 Volts Switching Diode Features • Halogen free available upon request by adding suffix -HF • High speed switching diode • Surface mount package • For general purpose switching applications • Marking: S3 • Epoxy meets UL 94 V-0 flammability rating • Moisture Sensitivity Level 1 | MCC |
1SS38产品属性
- 类型
描述
- 型号
1SS38
- 制造商
KEXIN
- 制造商全称
Guangdong Kexin Industrial Co.,Ltd
- 功能描述
SWITCHING DIODE
| IC供应商 | 芯片型号 | 品牌 | 批号 | 封装 | 库存 | 备注 | 价格 |
|---|---|---|---|---|---|---|---|
TOSHIBA/东芝 |
24+ |
NA/ |
2500 |
优势代理渠道,原装正品,可全系列订货开增值税票 |
|||
Toshiba |
25+23+ |
Sot-243 |
32078 |
绝对原装正品全新进口深圳现货 |
|||
TOSHIBA/东芝 |
2025+ |
SOT-343 |
5000 |
原装进口价格优 请找坤融电子! |
|||
TOSHIBA |
24+ |
SOT-343SOT-323-4 |
89600 |
新进库存/原装 |
|||
TOSHIBA |
25+ |
原厂原封装 |
86720 |
全新原装进口现货价格优惠 本公司承诺原装正品假一赔 |
|||
TOSHIBA/东芝 |
25+ |
SOT343 |
860000 |
明嘉莱只做原装正品现货 |
|||
TOSHIBA |
100 |
||||||
TOSHIBA |
24+ |
con |
100 |
现货常备产品原装可到京北通宇商城查价格 |
|||
TOSHIBA(东芝) |
25+ |
SC-82 |
500000 |
源自原厂成本,高价回收工厂呆滞 |
|||
TOSHIBA/东芝 |
2447 |
SOT343 |
100500 |
一级代理专营品牌!原装正品,优势现货,长期排单到货 |
1SS38规格书下载地址
1SS38参数引脚图相关
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DdatasheetPDF页码索引
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