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型号 功能描述 生产厂家&企业 LOGO 操作
XCC3300ENJARSBR

CC330x SimpleLink™ Wi-Fi® 6 and Bluetooth® Low Energy Transceiver

1Features •HighlyoptimizedWi-Fi®6andBluetooth® LowEnergy5.2systemforlow-costindustrial embeddedapplications •DesignedtointegratewithanyMPUorMCUhost capableofrunningaTCP/IPstack •Wi-Fi6 –MAC,baseband,andRFtransceiverwith supportforIEEE802.11b/g/n/ax

TITexas Instruments

德州仪器美国德州仪器公司

TI
XCC3301ENJARSBR

CC330x SimpleLink™ Wi-Fi® 6 and Bluetooth® Low Energy Transceiver

1Features •HighlyoptimizedWi-Fi®6andBluetooth® LowEnergy5.2systemforlow-costindustrial embeddedapplications •DesignedtointegratewithanyMPUorMCUhost capableofrunningaTCP/IPstack •Wi-Fi6 –MAC,baseband,andRFtransceiverwith supportforIEEE802.11b/g/n/ax

TITexas Instruments

德州仪器美国德州仪器公司

TI
XCC3301MODENIAMOZR

CC330xMOD SimpleLink™ Wi-Fi 6 and Bluetooth® Low Energy Companion Module

1Features KeyFeatures •Wi-Fi6(802.11ax) •Bluetooth®LowEnergy5.4inCC33x1MOD •CompanionmoduletoanyprocessororMCUhost capableofrunningaTCP/IPstack •Integrated2.4GHzPAforcompletewireless systemwithupto+18dBmoutputpower •Operatingtemperature:–40°Cto+85°C

TITexas Instruments

德州仪器美国德州仪器公司

TI
XCC3350ENJARSBR

CC335x SimpleLink™ 2.4GHz and 5GHz Dual-Band Wi-Fi 6 and Bluetooth® Low Energy Companion IC

1Features KeyFeatures •Wi-Fi6(802.11ax) •Bluetooth®LowEnergy5.4inCC33x1devices •CompanionICtoanyprocessororMCUhost capableofrunningaTCP/IPstack •Integrated2.4/5GHzPAforcompletewireless solutionwithupto+20.5dBmoutputpower. •Operatingtemperature:–40°C

TI1Texas Instruments

德州仪器美国德州仪器公司

TI1
XCC3351ENJARSBR

CC335x SimpleLink™ 2.4GHz and 5GHz Dual-Band Wi-Fi 6 and Bluetooth® Low Energy Companion IC

1Features KeyFeatures •Wi-Fi6(802.11ax) •Bluetooth®LowEnergy5.4inCC33x1devices •CompanionICtoanyprocessororMCUhost capableofrunningaTCP/IPstack •Integrated2.4/5GHzPAforcompletewireless solutionwithupto+20.5dBmoutputpower. •Operatingtemperature:–40°C

TI1Texas Instruments

德州仪器美国德州仪器公司

TI1
XCC3500ENJARSHR

CC350xE 2.4GHz SimpleLink™ Wi-Fi 6 and Bluetooth®Low Energy Wireless MCU

1Features Microcontroller •Powerful160MHzArm®Cortex®-M33processor withFPU,TrustZone®,andAIacceleration •High-speedquad-SPIandoctal-SPIforXiPflash withon-the-flydecryption •Flexibleconfigurationoflow-latencyTCM(upto 32KB)andcache(32KBor64KB)forimproved code

TITexas Instruments

德州仪器美国德州仪器公司

TI
XCC3500ENJARSHR

CC35xE 2.4GHz SimpleLink™ Wi-Fi 6 and Bluetooth®Low Energy Wireless MCU

1Features Microcontroller •Powerful160MHzArm®Cortex®-M33processor withFPU,TrustZone®,andAIacceleration •High-speedquad-SPIandoctal-SPIforXiPflash withon-the-flydecryption •Flexibleconfigurationoflow-latencyTCM(upto 32KB)andCache(32KBor64KB)forimproved code

TI2Texas Instruments

德州仪器美国德州仪器公司

TI2
XCC3500ENJARSHR.B

CC35xE 2.4GHz SimpleLink™ Wi-Fi 6 and Bluetooth®Low Energy Wireless MCU

1Features Microcontroller •Powerful160MHzArm®Cortex®-M33processor withFPU,TrustZone®,andAIacceleration •High-speedquad-SPIandoctal-SPIforXiPflash withon-the-flydecryption •Flexibleconfigurationoflow-latencyTCM(upto 32KB)andCache(32KBor64KB)forimproved code

TI2Texas Instruments

德州仪器美国德州仪器公司

TI2
XCC3501ENJARSHR

CC350xE 2.4GHz SimpleLink™ Wi-Fi 6 and Bluetooth®Low Energy Wireless MCU

1Features Microcontroller •Powerful160MHzArm®Cortex®-M33processor withFPU,TrustZone®,andAIacceleration •High-speedquad-SPIandoctal-SPIforXiPflash withon-the-flydecryption •Flexibleconfigurationoflow-latencyTCM(upto 32KB)andcache(32KBor64KB)forimproved code

TITexas Instruments

德州仪器美国德州仪器公司

TI
XCC3501ENJARSHR

CC35xE 2.4GHz SimpleLink™ Wi-Fi 6 and Bluetooth®Low Energy Wireless MCU

1Features Microcontroller •Powerful160MHzArm®Cortex®-M33processor withFPU,TrustZone®,andAIacceleration •High-speedquad-SPIandoctal-SPIforXiPflash withon-the-flydecryption •Flexibleconfigurationoflow-latencyTCM(upto 32KB)andCache(32KBor64KB)forimproved code

TI2Texas Instruments

德州仪器美国德州仪器公司

TI2
XCC3501ENJARSHR.B

CC35xE 2.4GHz SimpleLink™ Wi-Fi 6 and Bluetooth®Low Energy Wireless MCU

1Features Microcontroller •Powerful160MHzArm®Cortex®-M33processor withFPU,TrustZone®,andAIacceleration •High-speedquad-SPIandoctal-SPIforXiPflash withon-the-flydecryption •Flexibleconfigurationoflow-latencyTCM(upto 32KB)andCache(32KBor64KB)forimproved code

TI2Texas Instruments

德州仪器美国德州仪器公司

TI2
XCC3550ENJARSHR

CC355xE SimpleLink™ 2.4GHz and 5GHz Dual-Band Wi-Fi 6 and Bluetooth® Low Energy Wireless MCU

1Features Microcontroller •Powerful160MHzArm®Cortex®-M33processor withFPU,TrustZone®,andAIacceleration •High-speedquad-SPIandoctal-SPIforXiPflash withon-the-flydecryption •Flexibleconfigurationoflow-latencyTCM(upto 32KB)andCache(32KBor64KB)forimproved code

TITexas Instruments

德州仪器美国德州仪器公司

TI
XCC3550ENJARSHR

CC355xE SimpleLink™ 2.4GHz and 5GHz Dual-Band Wi-Fi 6 and Bluetooth® Low Energy Wireless MCU

1Features Microcontroller •Powerful160MHzArm®Cortex®-M33processor withFPU,TrustZone®,andAIacceleration •High-speedquad-SPIandoctal-SPIforXiPflash withon-the-flydecryption •Flexibleconfigurationoflow-latencyTCM(upto 32KB)andCache(32KBor64KB)forimproved code

TI2Texas Instruments

德州仪器美国德州仪器公司

TI2
XCC3550ENJARSHR.B

CC355xE SimpleLink™ 2.4GHz and 5GHz Dual-Band Wi-Fi 6 and Bluetooth® Low Energy Wireless MCU

1Features Microcontroller •Powerful160MHzArm®Cortex®-M33processor withFPU,TrustZone®,andAIacceleration •High-speedquad-SPIandoctal-SPIforXiPflash withon-the-flydecryption •Flexibleconfigurationoflow-latencyTCM(upto 32KB)andCache(32KBor64KB)forimproved code

TI2Texas Instruments

德州仪器美国德州仪器公司

TI2
XCC3551ENJARSHR

CC355xE SimpleLink™ 2.4GHz and 5GHz Dual-Band Wi-Fi 6 and Bluetooth® Low Energy Wireless MCU

1Features Microcontroller •Powerful160MHzArm®Cortex®-M33processor withFPU,TrustZone®,andAIacceleration •High-speedquad-SPIandoctal-SPIforXiPflash withon-the-flydecryption •Flexibleconfigurationoflow-latencyTCM(upto 32KB)andCache(32KBor64KB)forimproved code

TITexas Instruments

德州仪器美国德州仪器公司

TI
XCC3551ENJARSHR

CC355xE SimpleLink™ 2.4GHz and 5GHz Dual-Band Wi-Fi 6 and Bluetooth® Low Energy Wireless MCU

1Features Microcontroller •Powerful160MHzArm®Cortex®-M33processor withFPU,TrustZone®,andAIacceleration •High-speedquad-SPIandoctal-SPIforXiPflash withon-the-flydecryption •Flexibleconfigurationoflow-latencyTCM(upto 32KB)andCache(32KBor64KB)forimproved code

TI2Texas Instruments

德州仪器美国德州仪器公司

TI2
XCC3551ENJARSHR.B

CC355xE SimpleLink™ 2.4GHz and 5GHz Dual-Band Wi-Fi 6 and Bluetooth® Low Energy Wireless MCU

1Features Microcontroller •Powerful160MHzArm®Cortex®-M33processor withFPU,TrustZone®,andAIacceleration •High-speedquad-SPIandoctal-SPIforXiPflash withon-the-flydecryption •Flexibleconfigurationoflow-latencyTCM(upto 32KB)andCache(32KBor64KB)forimproved code

TI2Texas Instruments

德州仪器美国德州仪器公司

TI2
XCC3000MOD

Module ??Wi-Fi 802.11b/g Network Processor

文件：1.63552 Mbytes Page：19 Pages

TI1Texas Instruments

德州仪器美国德州仪器公司

TI1
XCC3000MOD

TI SimpleLink CC3000 Module . Wi-Fi 802.11b/g Network Processor

文件：643.28 Kbytes Page：16 Pages

TITexas Instruments

德州仪器美国德州仪器公司

TI
XCC3000MOD

SimpleLink Wi-Fi CC3000 Module from Texas Instruments

文件：41.41 Kbytes Page：3 Pages

TITexas Instruments

德州仪器美国德州仪器公司

TI
XCC3100ZG1MRTDT

包装：剪切带（CT）Digi-Reel® 得捷定制卷带 描述：IC RF FRONT END RF/IF，射频/中频和 RFID 射频前端（LNA + PA）

TI2Texas Instruments

德州仪器美国德州仪器公司

TI2
XCC3101ZG1MRTDT

包装：剪切带（CT）Digi-Reel® 得捷定制卷带 描述：IC RF FRONT END RF/IF，射频/中频和 RFID 射频前端（LNA + PA）

TI2Texas Instruments

德州仪器美国德州仪器公司

TI2
xCC3120MODRNMMOBR

SimpleLink Wi-Fi CERTIFIED Network Processor Internet-of-Things Module Solution for MCU Applications

文件：2.0633 Mbytes Page：52 Pages

TI1Texas Instruments

德州仪器美国德州仪器公司

TI1
XCC3135MODRNMMOBR

SimpleLink Wi-Fi CERTIFIED Dual-Band Network Processor Module Solution for MCU Applications

文件：1.71318 Mbytes Page：60 Pages

TI1Texas Instruments

德州仪器美国德州仪器公司

TI1
XCC3220MODSF12MOBR

SimpleLink Wi-Fi CERTIFIED Wireless Module Solution

文件：2.11812 Mbytes Page：82 Pages

TI1Texas Instruments

德州仪器美国德州仪器公司

TI1
XCC3220MODSM2MOBR

SimpleLink Wi-Fi CERTIFIED Wireless Module Solution

文件：2.11812 Mbytes Page：82 Pages

TI1Texas Instruments

德州仪器美国德州仪器公司

TI1
XCC3235MODASF12MON

CC3235MODAx SimpleLink??Wi-Fi CERTIFIED??Dual-band Wireless MCU Module

文件：2.13152 Mbytes Page：100 Pages

TI1Texas Instruments

德州仪器美国德州仪器公司

TI1
XCC3235MODASM2MONR

CC3235MODAx SimpleLink??Wi-Fi CERTIFIED??Dual-band Wireless MCU Module

文件：2.13152 Mbytes Page：100 Pages

TI1Texas Instruments

德州仪器美国德州仪器公司

TI1
XCC3235MODSF12MOBR

SimpleLinkTM Wi-Fi CERTIFIED Dual-Band Wireless MCU Module

文件：1.87795 Mbytes Page：98 Pages

TI1Texas Instruments

德州仪器美国德州仪器公司

TI1
XCC3235MODSM2MOBR

SimpleLinkTM Wi-Fi CERTIFIED Dual-Band Wireless MCU Module

文件：1.87795 Mbytes Page：98 Pages

TI1Texas Instruments

德州仪器美国德州仪器公司

TI1

XCC3产品属性

  • 类型

    描述

  • 型号

    XCC3

  • 制造商

    SAIA - BURGESS ELECTRONICS INC.

  • 功能描述

    Catalogue/XCC3

XCC3供应商更多...

更新时间：2025-7-21 23:00:00
IC供应商 芯片型号 品牌 批号 封装 库存 备注 价格
深圳市得捷芯城科技有限公司
XCC6371A270PR
TOREX/特瑞仕
24+
NA/
4250
原厂直销,现货供应,账期支持!
询价
深圳市益百分电子有限公司
XCC5215-4HQ208C
xilinx
22+
QFP
6800
询价
深圳市英卓尔科技有限公司
XCC56366PV120
MOTO
20+
QFP
500
样品可出,优势库存欢迎实单
询价
深圳市科恒伟业电子有限公司
XCC508121
MOTO
1715+
SOP
251156
只做原装正品现货假一赔十!
询价
深圳市中赛美电子科技有限公司
XCC6VLX195TFG1156
XILINX/赛灵思
21+
BGA
2315
附带出货证明-价格低于市场百分之五十
询价
贸泽芯城（深圳）电子科技有限公司
XCC56366PV120
MOTOROLA/摩托罗拉
23+
QFP144
3000
一级代理原厂VIP渠道,专注军工、汽车、医疗、工业、
询价
深圳市振宏微科技有限公司
XCC44N3F470KG1
CHINAXYJ
23+
1808
9868
专做原装正品,假一罚百!
询价
深圳市欧立现代科技有限公司
XCC501RX200LDOB
Freescale
24+
BGA
2000
原装现货,可开13%税票
询价
深圳市福安瓯科技有限公司
XCC501RX200LDOB
Freescale
25+
BGA783
20
保证有货!质优价美!欢迎查询!!
询价
深圳市恒达亿科技有限公司
XCC56366PV120
MOTOROLA
25+
TQFP144
4500
全新原装、诚信经营、公司现货销售
询价

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XCC3规格书下载地址

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