型号 功能描述 生产厂家 企业 LOGO 操作

CC330x SimpleLink™ Wi-Fi® 6 and Bluetooth® Low Energy Transceiver

1 Features • Highly optimized Wi-Fi® 6 and Bluetooth® Low Energy 5.2 system for low-cost industrial embedded applications • Designed to integrate with any MPU or MCU host capable of running a TCP/IP stack • Wi-Fi 6 – MAC, baseband, and RF transceiver with support for IEEE 802.11 b/g/n/ax

TI

德州仪器

CC330x SimpleLink™ Wi-Fi® 6 and Bluetooth® Low Energy Transceiver

1 Features • Highly optimized Wi-Fi® 6 and Bluetooth® Low Energy 5.2 system for low-cost industrial embedded applications • Designed to integrate with any MPU or MCU host capable of running a TCP/IP stack • Wi-Fi 6 – MAC, baseband, and RF transceiver with support for IEEE 802.11 b/g/n/ax

TI

德州仪器

CC330xMOD SimpleLink™ Wi-Fi 6 and Bluetooth® Low Energy Companion Module

1 Features Key Features • Wi-Fi 6 (802.11ax) • Bluetooth®Low Energy 5.4 in CC33x1MOD • Companion module to any processor or MCU host capable of running a TCP/IP stack • Integrated 2.4GHz PA for complete wireless system with up to +18dBm output power • Operating temperature: –40°C to +85°C

TI

德州仪器

CC335x SimpleLink™ 2.4GHz and 5GHz Dual-Band Wi-Fi 6 and Bluetooth® Low Energy Companion IC

1 Features Key Features • Wi-Fi 6 (802.11ax) • Bluetooth® Low Energy 5.4 in CC33x1 devices • Companion IC to any processor or MCU host capable of running a TCP/IP stack • Integrated 2.4/5GHz PA for complete wireless solution with up to +20.5dBm output power. • Operating temperature: –40°C

TI

德州仪器

CC335xMOD SimpleLink™ 2.4GHz and 5GHz Dual-Band Wi-Fi 6 and Bluetooth® Low Energy Companion Module

1 Features Key Features • Wi-Fi 6 (802.11ax) • Bluetooth® Low Energy 5.4 in CC33x1MOD • Companion module to any processor or MCU host capable of running a TCP/IP stack • Integrated 2.4GHz and 5GHz PA for a complete wireless system with up to +18dBm output power • Operating temperature: –40

TI

德州仪器

CC335x SimpleLink™ 2.4GHz and 5GHz Dual-Band Wi-Fi 6 and Bluetooth® Low Energy Companion IC

1 Features Key Features • Wi-Fi 6 (802.11ax) • Bluetooth® Low Energy 5.4 in CC33x1 devices • Companion IC to any processor or MCU host capable of running a TCP/IP stack • Integrated 2.4/5GHz PA for complete wireless solution with up to +20.5dBm output power. • Operating temperature: –40°C

TI

德州仪器

CC335xMOD SimpleLink™ 2.4GHz and 5GHz Dual-Band Wi-Fi 6 and Bluetooth® Low Energy Companion Module

1 Features Key Features • Wi-Fi 6 (802.11ax) • Bluetooth® Low Energy 5.4 in CC33x1MOD • Companion module to any processor or MCU host capable of running a TCP/IP stack • Integrated 2.4GHz and 5GHz PA for a complete wireless system with up to +18dBm output power • Operating temperature: –40

TI

德州仪器

CC350xE 2.4GHz SimpleLink™ Wi-Fi 6 and Bluetooth®Low Energy Wireless MCU

1 Features Microcontroller • Powerful 160MHz Arm® Cortex®-M33 processor with FPU, TrustZone®, and AI acceleration • High-speed quad-SPI and octal-SPI for XiP flash with on-the-fly decryption • Flexible configuration of low-latency TCM (up to 32KB) and cache (32KB or 64KB) for improved code

TI

德州仪器

CC35xE 2.4GHz SimpleLink™ Wi-Fi 6 and Bluetooth®Low Energy Wireless MCU

1 Features Microcontroller • Powerful 160MHz Arm® Cortex®-M33 processor with FPU, TrustZone®, and AI acceleration • High-speed quad-SPI and octal-SPI for XiP flash with on-the-fly decryption • Flexible configuration of low-latency TCM (up to 32KB) and Cache (32KB or 64KB) for improved code

TI

德州仪器

CC35xE 2.4GHz SimpleLink™ Wi-Fi 6 and Bluetooth®Low Energy Wireless MCU

1 Features Microcontroller • Powerful 160MHz Arm® Cortex®-M33 processor with FPU, TrustZone®, and AI acceleration • High-speed quad-SPI and octal-SPI for XiP flash with on-the-fly decryption • Flexible configuration of low-latency TCM (up to 32KB) and Cache (32KB or 64KB) for improved code

TI

德州仪器

CC350xE 2.4GHz SimpleLink™ Wi-Fi 6 and Bluetooth®Low Energy Wireless MCU

1 Features Microcontroller • Powerful 160MHz Arm® Cortex®-M33 processor with FPU, TrustZone®, and AI acceleration • High-speed quad-SPI and octal-SPI for XiP flash with on-the-fly decryption • Flexible configuration of low-latency TCM (up to 32KB) and cache (32KB or 64KB) for improved code

TI

德州仪器

CC35xE 2.4GHz SimpleLink™ Wi-Fi 6 and Bluetooth®Low Energy Wireless MCU

1 Features Microcontroller • Powerful 160MHz Arm® Cortex®-M33 processor with FPU, TrustZone®, and AI acceleration • High-speed quad-SPI and octal-SPI for XiP flash with on-the-fly decryption • Flexible configuration of low-latency TCM (up to 32KB) and Cache (32KB or 64KB) for improved code

TI

德州仪器

CC35xE 2.4GHz SimpleLink™ Wi-Fi 6 and Bluetooth®Low Energy Wireless MCU

1 Features Microcontroller • Powerful 160MHz Arm® Cortex®-M33 processor with FPU, TrustZone®, and AI acceleration • High-speed quad-SPI and octal-SPI for XiP flash with on-the-fly decryption • Flexible configuration of low-latency TCM (up to 32KB) and Cache (32KB or 64KB) for improved code

TI

德州仪器

CC355xE SimpleLink™ 2.4GHz and 5GHz Dual-Band Wi-Fi 6 and Bluetooth® Low Energy Wireless MCU

1 Features Microcontroller • Powerful 160MHz Arm® Cortex®-M33 processor with FPU, TrustZone®, and AI acceleration • High-speed quad-SPI and octal-SPI for XiP flash with on-the-fly decryption • Flexible configuration of low-latency TCM (up to 32KB) and Cache (32KB or 64KB) for improved code

TI

德州仪器

CC355xE SimpleLink™ 2.4GHz and 5GHz Dual-Band Wi-Fi 6 and Bluetooth® Low Energy Wireless MCU

1 Features Microcontroller • Powerful 160MHz Arm® Cortex®-M33 processor with FPU, TrustZone®, and AI acceleration • High-speed quad-SPI and octal-SPI for XiP flash with on-the-fly decryption • Flexible configuration of low-latency TCM (up to 32KB) and Cache (32KB or 64KB) for improved code

TI

德州仪器

CC355xE SimpleLink™ 2.4GHz and 5GHz Dual-Band Wi-Fi 6 and Bluetooth® Low Energy Wireless MCU

1 Features Microcontroller • Powerful 160MHz Arm® Cortex®-M33 processor with FPU, TrustZone®, and AI acceleration • High-speed quad-SPI and octal-SPI for XiP flash with on-the-fly decryption • Flexible configuration of low-latency TCM (up to 32KB) and Cache (32KB or 64KB) for improved code

TI

德州仪器

CC355xE SimpleLink™ 2.4GHz and 5GHz Dual-Band Wi-Fi 6 and Bluetooth® Low Energy Wireless MCU

1 Features Microcontroller • Powerful 160MHz Arm® Cortex®-M33 processor with FPU, TrustZone®, and AI acceleration • High-speed quad-SPI and octal-SPI for XiP flash with on-the-fly decryption • Flexible configuration of low-latency TCM (up to 32KB) and Cache (32KB or 64KB) for improved code

TI

德州仪器

CC355xE SimpleLink™ 2.4GHz and 5GHz Dual-Band Wi-Fi 6 and Bluetooth® Low Energy Wireless MCU

1 Features Microcontroller • Powerful 160MHz Arm® Cortex®-M33 processor with FPU, TrustZone®, and AI acceleration • High-speed quad-SPI and octal-SPI for XiP flash with on-the-fly decryption • Flexible configuration of low-latency TCM (up to 32KB) and Cache (32KB or 64KB) for improved code

TI

德州仪器

CC355xE SimpleLink™ 2.4GHz and 5GHz Dual-Band Wi-Fi 6 and Bluetooth® Low Energy Wireless MCU

1 Features Microcontroller • Powerful 160MHz Arm® Cortex®-M33 processor with FPU, TrustZone®, and AI acceleration • High-speed quad-SPI and octal-SPI for XiP flash with on-the-fly decryption • Flexible configuration of low-latency TCM (up to 32KB) and Cache (32KB or 64KB) for improved code

TI

德州仪器

Module ??Wi-Fi 802.11b/g Network Processor

文件:1.63552 Mbytes Page:19 Pages

TI

德州仪器

TI SimpleLink CC3000 Module . Wi-Fi 802.11b/g Network Processor

文件:643.28 Kbytes Page:16 Pages

TI

德州仪器

SimpleLink Wi-Fi CC3000 Module from Texas Instruments

文件:41.41 Kbytes Page:3 Pages

TI

德州仪器

TI SimpleLink CC3000 Module . Wi-Fi 802.11b/g Network Processor

TI

德州仪器

包装:剪切带(CT)Digi-Reel® 得捷定制卷带 描述:IC RF FRONT END RF/IF,射频/中频和 RFID 射频前端(LNA + PA)

TI

德州仪器

包装:剪切带(CT)Digi-Reel® 得捷定制卷带 描述:IC RF FRONT END RF/IF,射频/中频和 RFID 射频前端(LNA + PA)

TI

德州仪器

SimpleLink Wi-Fi CERTIFIED Network Processor Internet-of-Things Module Solution for MCU Applications

文件:2.0633 Mbytes Page:52 Pages

TI

德州仪器

SimpleLink Wi-Fi CERTIFIED Dual-Band Network Processor Module Solution for MCU Applications

文件:1.71318 Mbytes Page:60 Pages

TI

德州仪器

SimpleLink Wi-Fi CERTIFIED Wireless Module Solution

文件:2.11812 Mbytes Page:82 Pages

TI

德州仪器

SimpleLink Wi-Fi CERTIFIED Wireless Module Solution

文件:2.11812 Mbytes Page:82 Pages

TI

德州仪器

CC3235MODAx SimpleLink??Wi-Fi CERTIFIED??Dual-band Wireless MCU Module

文件:2.13152 Mbytes Page:100 Pages

TI

德州仪器

CC3235MODAx SimpleLink??Wi-Fi CERTIFIED??Dual-band Wireless MCU Module

文件:2.13152 Mbytes Page:100 Pages

TI

德州仪器

SimpleLinkTM Wi-Fi CERTIFIED Dual-Band Wireless MCU Module

文件:1.87795 Mbytes Page:98 Pages

TI

德州仪器

SimpleLinkTM Wi-Fi CERTIFIED Dual-Band Wireless MCU Module

文件:1.87795 Mbytes Page:98 Pages

TI

德州仪器

XCC3产品属性

  • 类型

    描述

  • 型号

    XCC3

  • 制造商

    SAIA - BURGESS ELECTRONICS INC.

  • 功能描述

    Catalogue/XCC3

更新时间:2025-11-20 23:00:00
IC供应商 芯片型号 品牌 批号 封装 库存 备注 价格
TOREX/特瑞仕
24+
NA/
4250
原厂直销,现货供应,账期支持!
XILINX/赛灵思
21+
BGA
2315
附带出货证明-价格低于市场百分之五十
xilinx
22+
QFP
6800
MOTOROLA/摩托罗拉
23+
QFP144
3000
一级代理原厂VIP渠道,专注军工、汽车、医疗、工业、
CHINAXYJ
23+
1808
9868
专做原装正品,假一罚百!
XILINX
2138+
QFP
8960
专营BGA,QFP原装现货,假一赔十
Freescale
24+
BGA
2000
原装现货,可开13%税票
MOTOROLA
25+
TQFP144
4500
全新原装、诚信经营、公司现货销售
XILINX
24+
BGA
3178
十年沉淀唯有原装
ExcelsysTechnologies
5
全新原装 货期两周

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