Photo Transistor

SILICON MMIC 2.5 GHz FREQUENCY UP-CONVERTER FOR WIRELESS TRANSCEIVER

DESCRIPTION The µPC8172TB is a silicon monolithic integrated circuit designed as frequency up-converter for wireless transceiver transmitter stage. This IC is manufactured using NEC’s 30 GHz fmax. UHS0 (Ultra High Speed Process) silicon bipolar process. This IC is as same circuit current as conv

SILICON MMIC 2.0 GHz FREQUENCY UP-CONVERTER FOR CELLULAR TELEPHONE

DESCRIPTION The µPC8163TB is a silicon monolithic integrated circuit designed as frequency up-converter for cellular telephone transmitter stage. The µPC8163TB has improved intermodulation performance and smaller package. The µPC8163TB is manufactured using NEC’s 20 GHz fT NESATTMlll silicon bip

SILICON MMIC 2.0 GHz FREQUENCY UP-CONVERTER FOR CELLULAR/CORDLESS TELEPHONES

DESCRIPTION The µPC8106TB and µPC8109TB are silicon monolithic integrated circuit designed as frequency up-converter for cellular/cordless telephone transmitter stage. The µPC8106TB features improved intermodulation and µPC8109TB features low current consumption. From these two version, you can c

BIPOLAR ANALOG INTEGRATED CIRCUIT

FEATURES • Recommended operating frequency : fRFout = 0.8 to 2.0 GHz, fIFin = 50 to 300 MHz • Supply voltage : VCC = 2.7 to 3.3 V • High-density surface mounting : 6-pin super minimold package • Higher IP3 : OIP3 = +9.5 dBm @ fRFout = 830 MHz • Minimized carrier leakage : Due to double balanc

BIPOLAR ANALOG INTEGRATED CIRCUIT

FEATURES • High output frequency : fRFout = 0.8 to 2.5 GHz • High-density surface mounting : 6-pin super minimold package • Supply voltage : VCC = 2.7 to 3.3 V • Higher IP3 : OIP3 = +10 dBm @ fRFout = 1.9 GHz

BIPOLAR ANALOG INTEGRATED CIRCUIT

FEATURES • Recommended operating frequency : fRFout = 0.8 to 2.0 GHz, fIFin = 50 to 300 MHz • Supply voltage : VCC = 2.7 to 3.3 V • High-density surface mounting : 6-pin super minimold package • Higher IP3 : OIP3 = +9.5 dBm @ fRFout = 830 MHz • Minimized carrier leakage : Due to double balanc

SILICON MMIC 2.0 GHz FREQUENCY UP-CONVERTER FOR CELLULAR TELEPHONE

DESCRIPTION The µPC8163TB is a silicon monolithic integrated circuit designed as frequency up-converter for cellular telephone transmitter stage. The µPC8163TB has improved intermodulation performance and smaller package. The µPC8163TB is manufactured using NEC’s 20 GHz fT NESATTMlll silicon bip

SILICON RFIC HI-IP3 FREQUENCY UP-CONVERTER FOR WIRELESS TRANSCEIVER

文件：121.05 Kbytes Page：8 Pages

3 V SILICON RFIC FREQUENCY UPCONVERTER

文件：172.98 Kbytes Page：5 Pages

3 V SILICON RFIC FREQUENCY UPCONVERTER

封装/外壳：6-TSSOP，SC-88，SOT-363 包装：散装 描述：IC MIXER 50-300MHZ UP CONV 6SMD RF/IF，射频/中频和 RFID 射频混频器

3 V SILICON RFIC FREQUENCY UPCONVERTER

文件：172.98 Kbytes Page：5 Pages

包装：盒 描述：EVAL BOARD FOR UPC8163 900MHZ 开发板，套件，编程器 射频评估和开发套件，开发板

BIPOLAR ANALOG INTEGRATED CIRCUITS

文件：813.14 Kbytes Page：12 Pages

General-purpose Linear-Operational Amplifiers (op-amp)

BIPOLAR ANALOG INTEGRATED CIRCUITS

文件：813.14 Kbytes Page：12 Pages

PC Mount, Shocksafe 5x20mm / 6.3x32mm Fuses

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Panel Mount, Shocksafe 6.3x32mm Fuses

文件：78.01 Kbytes Page：1 Pages

Panel Mount for 6.3x32 mm Fuses

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Panel Mount for 5x20 mm und 6.3x32 mm Fuses

文件：178.31 Kbytes Page：1 Pages

PC Mount, Shocksafe 5x20mm / 6.3x32mm Fuses

文件：83.39 Kbytes Page：1 Pages