高速CAN/双LIN核心系统基础芯片

High-speed CAN/dual LIN core system basis chip

High-speed CAN/dual LIN core system basis chip

High-speed CAN/dual LIN core system basis chip

High-speed CAN/dual LIN core system basis chip

High-speed CAN/dual LIN core system basis chip

封装/外壳：32-TSSOP（0.240"，6.10mm 宽）裸露焊盘 包装：管件 描述：IC INTFACE SPECIALIZED 32HTSSOP 集成电路（IC） 专用

封装/外壳：32-TSSOP（0.240"，6.10mm 宽）裸露焊盘 包装：管件 描述：IC INTFACE SPECIALIZED 32HTSSOP 集成电路（IC） 专用

Inst, 12 Pr #2022 Str BC, PVC Ins E1, IS/OS, Blk PVC Jkt, 300V PLTC ITC CMG

Product Description UL Instrumentation, 12 Pair 20+22AWG (7x28) Bare Copper, PVC Insulation E1 Color Code, Individual & Overall Beldfoil® Shield, Black PVC Outer Jacket, PLTC ITC CMG AWM 2464 SUN RES

Desoldering Tool

Instruction Manual  Thank you for purchasing the HAKKO 475 desoldering tool. Please read this manual before operating the HAKKO 475. Keep this manual readily accessible for reference.

300V Power-Limited Tray Cables ??Overview

文件：1.05773 Mbytes Page：22 Pages

PMSM Sensorless motor FOC control

文件：2.10619 Mbytes Page：30 Pages

PCB Mount

文件：505.56 Kbytes Page：4 Pages