High-speed CAN/LIN core system basis chip

High-speed CAN/LIN coresystem basis chip

保证原装正品参数列表搜索代替器件技术参数工作温度(Max)125 ℃工作温度(Min)-40 ℃电源电压4.5V ~ 28V封装参数安装方式Surface Mount引脚数32封装SOT-549-1外形尺寸封装SOT-549-1其他产品生命周期Active制造应用汽车级符合标准RoHS标准RoHS Compliant含铅标准Lead Free

高速CAN/LIN核心系统基础芯片

High-speed CAN/LIN core system basis chip

封装/外壳：32-TSSOP（0.240"，6.10mm 宽）裸露焊盘 包装：托盘 描述：IC INTFACE SPECIALIZED 32HTSSOP 集成电路（IC） 专用

封装/外壳：32-TSSOP（0.240"，6.10mm 宽）裸露焊盘 包装：卷带（TR） 描述：IC INTFACE SPECIALIZED 32HTSSOP 集成电路（IC） 专用

High-speed CAN/LIN core system basis chip

High-speed CAN/LIN core system basis chip

High-speed CAN/LIN core system basis chip

High-speed CAN/LIN core system basis chip

High-speed CAN/LIN core system basis chip

High-speed CAN/LIN core system basis chip

High-speed CAN/LIN core system basis chip

Customer Specification

Construction Diameters (In) 1) Component 1 15 X 1 COND a) Conductor 16 (19/.0117) AWG Tinned Copper 0.059 b) Insulation 0.032 Wall, Nom. PVC 0.123 (1) Color Code Alpha Wire Color Code F Cond Color Cond Color Cond Color 1 BLACK 6 BLUE 11 BLUE/BLACK 2 WHITE 7 WHITE/BLACK 12 BLACK/WHITE 3 RE

Customer Specification

Construction Diameters (In) 1) Component 1 15 X 1 COND a) Conductor 16 (19/.0117) AWG Tinned Copper 0.059 b) Insulation 0.032 Wall, Nom. PVC 0.123 (1) Color Code Alpha Wire Color Code F Cond Color Cond Color Cond Color 1 BLACK 6 BLUE 11 BLUE/BLACK 2 WHITE 7 WHITE/BLACK 12 BLACK/WHITE 3 RE

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