State-of-the-Art Advanced BiCMOS

Technology (ABT) Design for 3.3-V

Operation and Low Static Power

Dissipation

Support Mixed-Mode Signal Operation (5-V

Input and Output Voltages With 3.3-V VCC)

Support Unregulated Battery Operation

Down to 2.7 V

Typical VOLP (Output Ground Bounce)

< 0.8 V at VCC = 3.3 V, TA = 25°C

ESD Protection Exceeds 2000 V Per

MIL-STD-883C, Method 3015; Exceeds

200 V Using Machine Model

(C = 200 pF, R = 0)

Latch-Up Performance Exceeds 500 mA

Per JEDEC Standard JESD-17

Bus-Hold Data Inputs Eliminate the Need

for External Pullup Resistors

Support Live Insertion

Package Options Include Plastic

Small-Outline (DW), Shrink Small-Outline

(DB), and Thin Shrink Small-Outline (PW)

Packages, Ceramic Chip Carriers (FK),

Ceramic Flat (W) Packages, and Ceramic

(J) DIPs

description

These octal latches are designed specifically for low-voltage (3.3-V) VCC operation, but with the capability to

provide a TTL interface to a 5-V system environment.

The eight latches of the ’LVT573 are transparent D-type latches. While the latch-enable (LE) input is high, the

Q outputs follow the data (D) inputs. When LE is taken low, the Q outputs are latched at the logic levels set up

at the D inputs.

A buffered output-enable (OE) input can be used to place the eight outputs in either a normal logic state (high

or low logic levels) or a high-impedance state. In the high-impedance state, the outputs neither load nor drive

the bus lines significantly. The high-impedance state and increased drive provide the capability to drive bus

lines without need for interface or pullup components. OE does not affect the internal operations of the latches.

Old data can be retained or new data can be entered while the outputs are in the high-impedance state.

Active bus-hold circuitry is provided to hold unused or floating data inputs at a valid logic level.

To ensure the high-impedance state during power up or power down, OE should be tied to VCC through a pullup

resistor; the minimum value of the resistor is determined by the current-sinking capability of the driver.

The SN74LVT573 is available in TI’s shrink small-outline package (DB), which provides the same I/O pin count

and functionality of standard small-outline packages in less than half the printed-circuit-board area.

The SN54LVT573 is characterized for operation over the full military temperature range of −55°C to 125°C. The

SN74LVT573 is characterized for operation from −40°C to 85°C.