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CC2564CRVMR.A中文资料

厂家型号

CC2564CRVMR.A

文件大小

788.93Kbytes

页面数量

58

功能描述

CC2564C Dual-Mode Bluetooth® Controller

数据手册

下载地址一下载地址二到原厂下载

生产厂商

TI2

CC2564CRVMR.A数据手册规格书PDF详情

1.1 Features 1

• TI's Single-Chip Bluetooth® Solution With

Bluetooth Basic Rate (BR), Enhanced Data Rate

(EDR), and Low Energy (LE) Support

• Bluetooth 5.1 Delaration ID D049226

• Highly Optimized for Size-Constrained and Low-

Cost Designs:

– Single-Ended 50-Ω RF Interface

– VQFNP-MR Package Family, RVM Footprint: 76

Terminals, 0.6-mm Pitch, 8-mm × 8-mm

• BR and EDR Features Include:

– Up to Seven Active Devices

– Scatternet: Up to Three Piconets

Simultaneously, One as Master and Two as

Slaves

– Up to Two Synchronous Connection Oriented

(SCO) Links on the Same Piconet

– Support for All Voice Air-Coding—Continuously

Variable Slope Delta (CVSD), A-Law, μ-Law,

Modified Subband Coding (mSBC), and

Transparent (Uncoded)

– Provide an Assisted Mode for HFP 1.6

Wideband Speech (WBS) Profile or A2DP

Profile to Reduce Host Processing and Power

– Support of Multiple Bluetooth Profiles With

Enhanced QoS

• Low Energy Features Include:

– Multiple Sniff Instances Tightly Coupled to

Achieve Minimum Power Consumption

– Independent Buffering for Low Energy Allows

Large Numbers of Multiple Connections Without

Affecting BR or EDR Performance

– Built-In Coexistence and Prioritization Handling

for BR, EDR, and Low Energy

– Capabilities of Link Layer Topology

Scatternet—Can Act Concurrently as Peripheral

and Central

– Network Support for up to 10 Devices

– Time Line Optimization Algorithms to Achieve

Maximum Channel Utliization

• Best-in-Class Bluetooth (RF) Performance (TX

Power, RX Sensitivity, Blocking)

– Class 1 TX Power up to +12 dBm

– Internal Temperature Detection and

Compensation to Ensure Minimal Variation in

RF Performance Over Temperature, No

External Calibration Required

– Improved Adaptive Frequency Hopping (AFH)

Algorithm With Minimum Adaptation Time

– Longer Range, Including Twice the Range of

Other Low-Energy-Only Solutions

• Advanced Power Management for Extended

Battery Life and Ease of Design

– On-Chip Power Management, Including Direct

Connection to Battery

– Low Power Consumption for Active, Standby,

and Scan Bluetooth Modes

– Shutdown and Sleep Modes to Minimize Power

Consumption

• Physical Interfaces:

– UART Interface With Support for Maximum

Bluetooth Data Rates

– UART Transport Layer (H4) With Maximum

Rate of 4 Mbps

– Three-Wire UART Transport Layer (H5) With

Maximum Rate of 4 Mbps

– Fully Programmable Digital Pulse-Code

Modulation (PCM)–I2S Codec Interface

• Flexibility for Easy Stack Integration and Validation

Into MCUs and MPUs

• HCI Tester Tool to Evaluate RF Performance of

the Device and Configure Service Pack

1.2 Applications

• Wireless Audio Solutions

• mPOS

• Medical Devices

• Set-Top Boxes (STBs)

• Wearable Devices

• Sensor Hub, Sensor Gateway

– Home and Factory Automation

1.3 Description

The CC2564C device from Texas Instruments™ is a complete Bluetooth® BR/EDR, and low energy HCI

level solution, providing high performance and robust Bluetooth solution. Based on TI’s seventhgeneration

Bluetooth core, the CC2564C device provides a product-proven solution that is Bluetooth 5.1-

compliant, adding LE security and enhancing support for complex topologies (dual mode and link layer

topologies). This HCI device offers best-in-class RF performance with about twice the throughput of other

Bluetooth low-energy solutions, and includes a royalty-free software stack compatible with several host

MCUs and MPUs, for a complete Bluetooth solution. Furthermore, TI’s power-management hardware and

software algorithms provide significant power savings in all commonly used Bluetooth BR, EDR, and low

energy modes of operation.

The TI dual-mode Bluetooth stack software is certified and provided royalty free for MCUs and MPUs. The

iPod® (MFi) protocol is supported by add-on software packages. For more information, see TI Dual-Mode

Bluetooth Stack. Multiple profiles and sample applications, including the following, are supported:

Serial port profile (SPP)

Advanced audio distribution profile (A2DP)

Audio/video remote control profile (AVRCP)

Hands-free profile (HFP)

Human interface device (HID)

Generic attribute profile (GATT)

Several Bluetooth low energy profiles and services

更新时间:2025-10-13 16:31:00
供应商 型号 品牌 批号 封装 库存 备注 价格
TI
24+
SMD
8000
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NA
53650
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2021+
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499
TI
22+
76VQFN Dual Rows
9000
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TI
21+
标准封装
3844
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TI(德州仪器)
23+
N/A
6000
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TI(德州仪器)
24+
VQFN76
7350
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TI(德州仪器)
24+
NA/
8735
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TI(德州仪器)
24+
N/A
20000
原装进口正品