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CC2564CRVM数据手册规格书PDF详情
1.1 Features 1
• TI's Single-Chip Bluetooth® Solution With
Bluetooth Basic Rate (BR), Enhanced Data Rate
(EDR), and Low Energy (LE) Support
• Bluetooth 5.1 Delaration ID D049226
• Highly Optimized for Size-Constrained and Low-
Cost Designs:
– Single-Ended 50-Ω RF Interface
– VQFNP-MR Package Family, RVM Footprint: 76
Terminals, 0.6-mm Pitch, 8-mm × 8-mm
• BR and EDR Features Include:
– Up to Seven Active Devices
– Scatternet: Up to Three Piconets
Simultaneously, One as Master and Two as
Slaves
– Up to Two Synchronous Connection Oriented
(SCO) Links on the Same Piconet
– Support for All Voice Air-Coding—Continuously
Variable Slope Delta (CVSD), A-Law, μ-Law,
Modified Subband Coding (mSBC), and
Transparent (Uncoded)
– Provide an Assisted Mode for HFP 1.6
Wideband Speech (WBS) Profile or A2DP
Profile to Reduce Host Processing and Power
– Support of Multiple Bluetooth Profiles With
Enhanced QoS
• Low Energy Features Include:
– Multiple Sniff Instances Tightly Coupled to
Achieve Minimum Power Consumption
– Independent Buffering for Low Energy Allows
Large Numbers of Multiple Connections Without
Affecting BR or EDR Performance
– Built-In Coexistence and Prioritization Handling
for BR, EDR, and Low Energy
– Capabilities of Link Layer Topology
Scatternet—Can Act Concurrently as Peripheral
and Central
– Network Support for up to 10 Devices
– Time Line Optimization Algorithms to Achieve
Maximum Channel Utliization
• Best-in-Class Bluetooth (RF) Performance (TX
Power, RX Sensitivity, Blocking)
– Class 1 TX Power up to +12 dBm
– Internal Temperature Detection and
Compensation to Ensure Minimal Variation in
RF Performance Over Temperature, No
External Calibration Required
– Improved Adaptive Frequency Hopping (AFH)
Algorithm With Minimum Adaptation Time
– Longer Range, Including Twice the Range of
Other Low-Energy-Only Solutions
• Advanced Power Management for Extended
Battery Life and Ease of Design
– On-Chip Power Management, Including Direct
Connection to Battery
– Low Power Consumption for Active, Standby,
and Scan Bluetooth Modes
– Shutdown and Sleep Modes to Minimize Power
Consumption
• Physical Interfaces:
– UART Interface With Support for Maximum
Bluetooth Data Rates
– UART Transport Layer (H4) With Maximum
Rate of 4 Mbps
– Three-Wire UART Transport Layer (H5) With
Maximum Rate of 4 Mbps
– Fully Programmable Digital Pulse-Code
Modulation (PCM)–I2S Codec Interface
• Flexibility for Easy Stack Integration and Validation
Into MCUs and MPUs
• HCI Tester Tool to Evaluate RF Performance of
the Device and Configure Service Pack
1.2 Applications
• Wireless Audio Solutions
• mPOS
• Medical Devices
• Set-Top Boxes (STBs)
• Wearable Devices
• Sensor Hub, Sensor Gateway
– Home and Factory Automation
1.3 Description
The CC2564C device from Texas Instruments™ is a complete Bluetooth® BR/EDR, and low energy HCI
level solution, providing high performance and robust Bluetooth solution. Based on TI’s seventhgeneration
Bluetooth core, the CC2564C device provides a product-proven solution that is Bluetooth 5.1-
compliant, adding LE security and enhancing support for complex topologies (dual mode and link layer
topologies). This HCI device offers best-in-class RF performance with about twice the throughput of other
Bluetooth low-energy solutions, and includes a royalty-free software stack compatible with several host
MCUs and MPUs, for a complete Bluetooth solution. Furthermore, TI’s power-management hardware and
software algorithms provide significant power savings in all commonly used Bluetooth BR, EDR, and low
energy modes of operation.
The TI dual-mode Bluetooth stack software is certified and provided royalty free for MCUs and MPUs. The
iPod® (MFi) protocol is supported by add-on software packages. For more information, see TI Dual-Mode
Bluetooth Stack. Multiple profiles and sample applications, including the following, are supported:
Serial port profile (SPP)
Advanced audio distribution profile (A2DP)
Audio/video remote control profile (AVRCP)
Hands-free profile (HFP)
Human interface device (HID)
Generic attribute profile (GATT)
Several Bluetooth low energy profiles and services
供应商 | 型号 | 品牌 | 批号 | 封装 | 库存 | 备注 | 价格 |
---|---|---|---|---|---|---|---|
TI/德州仪器 |
2023+ |
VQFN76 |
30011 |
专注AI智能、军工、汽车、医疗、工业等方案配套一站式 |
|||
TI/德州仪器 |
25+ |
VQFNP76 |
32000 |
TI/德州仪器全新特价CC2564CRVMR即刻询购立享优惠#长期有货 |
|||
TI |
23+ |
76-VQFN |
25000 |
TI现货商!原装正品! |
|||
TI |
21+ |
VFQFN76 |
10000 |
勤思达只做原装 现货库存 支持支持实单 |
|||
TI/德州仪器 |
2216+ |
CQFNP76 |
8000 |
原装正品现货假一罚十 |
|||
TI/主营CC系列 |
24+ |
QFN76 |
2500 |
原厂授权代理 价格绝对优势 |
|||
TI |
25+ |
SMD |
918000 |
明嘉莱只做原装正品现货 |
|||
TI(德州仪器) |
24+ |
VQFNP76 |
12058 |
原厂可订货,技术支持,直接渠道。可签保供合同 |
|||
TI(德州仪器) |
24+ |
VFQFNDualRows-76 |
8200 |
只做原装现货假一罚十!价格最低!只卖原装现货 |
|||
TI |
24+ |
VQFNP76 |
98671 |
专业代理蓝牙芯片原装现货 |
CC2564CRVM 资料下载更多...
CC2564CRVM相关电子新闻
CC2564CRVMR
CC2564CRVMR
2023-4-17
CC2564CRVM 芯片相关型号
- 14232SLASH2SLASHSP
- 5574
- 64110
- 896-072-522-208
- 896-072-522-212
- ATS-FPX035035010-55-C1
- ATS-FPX035035010-55-C2
- ATS-FPX035035010-85-C1
- ATS-FPX035035015-56-C2
- ATS-FPX035035015-86-C1
- ATS-FPX035035020-57-C1
- ATS-FPX035035020-87-C3
- ATS-FPX035035025-58-C2
- ATS-FPX035035025-88-C2
- ATS-FPX035035030-59-C2
- ATS-FPX035035030-89-C2
- ATS-FPX035035035-60-C1
- ATS-FPX035035035-90-C2
- CC2564C
- M5TS-86-M
- M5TS-86-R
- M5TS-86-RSLASHBL
- M5TS-86-RSLASHBN
- M5TS-86-RSLASHK
- M5TS-86-RSLASHQ
- P6KE8.2CA
- SN74LVT162245AGQLR
- SN74LVT162245AGRDR
- TPS3836E18-Q1
- TPS3836E18QDBVRQ1
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