TUSB217A USB 2.0 High-Speed Signal Conditioner With DCP and CDP Controllers

文件：4.32538 Mbytes Page：31 Pages

TUSB217A-Q1 USB 2.0 High-Speed Signal Conditioner With DCP and CDP Controllers

文件：3.5234 Mbytes Page：33 Pages

具有 DCP 和 CDP 控制器的 USB 2.0 高速信号调节器

TUSB217A USB 2.0 High-Speed Signal Conditioner With DCP and CDP Controllers

文件：4.32538 Mbytes Page：31 Pages

TUSB217A USB 2.0 High-Speed Signal Conditioner With DCP and CDP Controllers

文件：4.32538 Mbytes Page：31 Pages

封装/外壳：12-XFQFN 包装：卷带（TR）剪切带（CT）Digi-Reel® 得捷定制卷带 描述：USB 2.0 HIGH-SPEED SIGNAL CONDIT 集成电路（IC） 专用

封装/外壳：12-XFQFN 包装：托盘 描述：IC INTERFACE 集成电路（IC） 专用

TUSB217A USB 2.0 High-Speed Signal Conditioner With DCP and CDP Controllers

文件：4.32538 Mbytes Page：31 Pages

TUSB217A-Q1 USB 2.0 High-Speed Signal Conditioner With DCP and CDP Controllers

文件：3.5234 Mbytes Page：33 Pages

具有 DCP 和 CDP 控制器的 USB 2.0 高速信号调节器

TUSB217A USB 2.0 High-Speed Signal Conditioner With DCP and CDP Controllers

文件：4.32538 Mbytes Page：31 Pages

TUSB217A-Q1 USB 2.0 High-Speed Signal Conditioner With DCP and CDP Controllers

文件：3.5234 Mbytes Page：33 Pages

TUSB217A USB 2.0 High-Speed Signal Conditioner With DCP and CDP Controllers

文件：4.32538 Mbytes Page：31 Pages

TUSB217A-Q1 USB 2.0 High-Speed Signal Conditioner With DCP and CDP Controllers

文件：3.5234 Mbytes Page：33 Pages

BOARD LEVEL POWER SEMICONDUCTOR HEAT SINKS

• No interface material is needed • Copper with matte tin plating for improved solderability and assembly • Both the component and the heat sink are installed on the PC-board utilizing standard SMT assembly equipment for ”Tape & Reel” and “Tube” formats • EIA standards and ESD protection are s

Direct replacement for E27 (European Standard)

文件：284.97 Kbytes Page：5 Pages

Mini 7/8 Female 4 Pin Field Attachable

文件：168.22 Kbytes Page：2 Pages

5횞20mm fast-acting glass body cartridge fuse designed to IEC specification

文件：995.95 Kbytes Page：4 Pages

1.5A Three Terminal Adj. Voltage Regulator

文件：365.04 Kbytes Page：9 Pages