TUSB217A USB 2.0 High-Speed Signal Conditioner With DCP and CDP Controllers

文件：4.32538 Mbytes Page：31 Pages

封装/外壳：12-XFQFN 包装：托盘 描述：IC INTERFACE 集成电路（IC） 专用

封装/外壳：12-XFQFN 包装：卷带（TR）剪切带（CT）Digi-Reel® 得捷定制卷带 描述：IC INTERFACE 集成电路（IC） 信号缓冲器、中继器、分离器

TUSB217A-Q1 USB 2.0 High-Speed Signal Conditioner With DCP and CDP Controllers

文件：3.5234 Mbytes Page：33 Pages

BOARD LEVEL POWER SEMICONDUCTOR HEAT SINKS

• No interface material is needed • Copper with matte tin plating for improved solderability and assembly • Both the component and the heat sink are installed on the PC-board utilizing standard SMT assembly equipment for ”Tape & Reel” and “Tube” formats • EIA standards and ESD protection are s

Mini 7/8 Female 4 Pin Field Attachable

文件：168.22 Kbytes Page：2 Pages

5횞20mm fast-acting glass body cartridge fuse designed to IEC specification

文件：995.95 Kbytes Page：4 Pages

Direct replacement for E27 (European Standard)

文件：284.97 Kbytes Page：5 Pages

1.5A Three Terminal Adj. Voltage Regulator

文件：365.04 Kbytes Page：9 Pages