型号 功能描述 生产厂家&企业 LOGO 操作
TPSM82864A

TPSM8286xA2.4Vto5.5VInput,4A/6AStep-DownPowerModulewithIntegratedInductorinaThin,OvermoldedQFNandMagPack™Package

1Features •Upto96%efficiency •Excellentthermalperformance •1%outputvoltageaccuracy •DCS-Controltopologyforfasttransientresponse •DesignedforlowEMIrequirements –MagPacktechnologyshieldsinductorandIC –Nobondwirepackage –Simplifiedlayoutthroughopti

TI1Texas Instruments

德州仪器美国德州仪器公司

TI1
TPSM82864A

TPSM82864A/TPSM82866A2.4-Vto5.5-VInput,4-A/6-AStep-DownPowerModulewithanIntegratedInductorina3.5-mm횞4.0-mmThinOvermoldedQFNPackage

文件:3.09655 Mbytes Page:34 Pages

TITexas Instruments

德州仪器美国德州仪器公司

TI

TPSM8286xA2.4Vto5.5VInput,4A/6AStep-DownPowerModulewithIntegratedInductorinaThin,OvermoldedQFNandMagPack™Package

1Features •Upto96%efficiency •Excellentthermalperformance •1%outputvoltageaccuracy •DCS-Controltopologyforfasttransientresponse •DesignedforlowEMIrequirements –MagPacktechnologyshieldsinductorandIC –Nobondwirepackage –Simplifiedlayoutthroughopti

TI1Texas Instruments

德州仪器美国德州仪器公司

TI1

TPSM8286xA2.4Vto5.5VInput,4A/6AStep-DownPowerModulewithIntegratedInductorinaThin,OvermoldedQFNandMagPack™Package

1Features •Upto96%efficiency •Excellentthermalperformance •1%outputvoltageaccuracy •DCS-Controltopologyforfasttransientresponse •DesignedforlowEMIrequirements –MagPacktechnologyshieldsinductorandIC –Nobondwirepackage –Simplifiedlayoutthroughopti

TI1Texas Instruments

德州仪器美国德州仪器公司

TI1

TPSM8286xA2.4Vto5.5VInput,4A/6AStep-DownPowerModulewithIntegratedInductorinaThin,OvermoldedQFNandMagPack™Package

1Features •Upto96%efficiency •Excellentthermalperformance •1%outputvoltageaccuracy •DCS-Controltopologyforfasttransientresponse •DesignedforlowEMIrequirements –MagPacktechnologyshieldsinductorandIC –Nobondwirepackage –Simplifiedlayoutthroughopti

TI1Texas Instruments

德州仪器美国德州仪器公司

TI1

TPSM8286xA2.4Vto5.5VInput,4A/6AStep-DownPowerModulewithIntegratedInductorinaThin,OvermoldedQFNandMagPack™Package

1Features •Upto96%efficiency •Excellentthermalperformance •1%outputvoltageaccuracy •DCS-Controltopologyforfasttransientresponse •DesignedforlowEMIrequirements –MagPacktechnologyshieldsinductorandIC –Nobondwirepackage –Simplifiedlayoutthroughopti

TI1Texas Instruments

德州仪器美国德州仪器公司

TI1

TPSM82864A/TPSM82866A2.4-Vto5.5-VInput,4-A/6-AStep-DownPowerModulewithanIntegratedInductorina3.5-mm횞4.0-mmThinOvermoldedQFNPackage

文件:3.09655 Mbytes Page:34 Pages

TITexas Instruments

德州仪器美国德州仪器公司

TI

包装:盒 描述:EVAL BOARD FOR TPSM82864A 开发板,套件,编程器 评估板 - DC/DC 与 AC/DC(离线)SMPS

TI2Texas Instruments

德州仪器美国德州仪器公司

TI2

封装/外壳:23-PowerLFQFN 模块 包装:卷带(TR)剪切带(CT)Digi-Reel® 得捷定制卷带 描述:DC DC CONVERTER 0.6-5.5V 电源 - 板安装 直流转换器

TI2Texas Instruments

德州仪器美国德州仪器公司

TI2

TPSM82864A/TPSM82866A2.4-Vto5.5-VInput,4-A/6-AStep-DownPowerModulewithanIntegratedInductorina3.5-mm횞4.0-mmThinOvermoldedQFNPackage

文件:3.09655 Mbytes Page:34 Pages

TITexas Instruments

德州仪器美国德州仪器公司

TI

TPSM8286xx2.4Vto5.5VInput,4A/6A,Step-DownMagPack™PowerModuleWithIntegratedInductorandI2Cinterface

1Features •Upto96%efficiency •Excellentthermalperformance •I2C-compatibleinterfaceupto3.4Mbps •1%outputvoltageaccuracy •DCS-Controltopologyforfasttransientresponse •I2CProgrammable: –Outputvoltage •0.4–1.675Vin5mVsteps •0.8–3.35Vin10mVsteps

TI1Texas Instruments

德州仪器美国德州仪器公司

TI1
更新时间:2025-7-16 22:59:00
IC供应商 芯片型号 品牌 批号 封装 库存 备注 价格
TI(德州仪器)
24+
B0QFN-23
14548
原厂可订货,技术支持,直接渠道。可签保供合同
TI/德州仪器
24+
B0QFN23
880000
明嘉莱只做原装正品现货
TI
25+
B0QFN (RDJ)
6000
原厂原装,价格优势
TI(德州仪器)
2024+
N/A
500000
诚信服务,绝对原装原盘
TI
2024+
N/A
70000
柒号只做原装 现货价秒杀全网
TI/德州仪器
25+
B0QFN23
32000
TI/德州仪器全新特价TPSM82864AA0SRDJR即刻询购立享优惠#长期有货
TI/德州仪器
25+
原厂封装
10280
原厂授权代理,专注军工、汽车、医疗、工业、新能源!
TI(德州仪器)
23+
13650
公司只做原装正品,假一赔十
TI
24+
B0QFN|23
8230
免费送样原盒原包现货一手渠道联系
TI
2450+
QFN
6540
只做原厂原装正品终端客户免费申请样品

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