SINGLEP-CHANNELENHANCEMENT-MODEMOSFETS

LowrDS(on)...0.09WTypatVGS=–10V 3VCompatible RequiresNoExternalVCC TTLandCMOSCompatibleInputs VGS(th)=–1.5VMax AvailableinUltrathinTSSOPPackage(PW) ESDProtectionUpto2kVper MIL-STD-883C,Method3015 description TheTPS1101isasingle,low-rDS(on),P-c

CustomerSpecification

Construction Diameters(In) 1)Component13X1COND a)Conductor32(7/40)AWGTinnedCopper0.009 b)Insulation0.010Wall,Nom.PVC0.029 (1)ColorCodeAlphaWireColorCodeD CondColorCondColorCondColor 1BLACK2RED3WHITE 2)CableAssembly3ComponentsCabled a)Twists:36.0

CustomerSpecification

Construction Diameters(In) 1)Component13X1COND a)Conductor32(7/40)AWGTinnedCopper0.009 b)Insulation0.010Wall,Nom.PVC0.029 (1)ColorCodeAlphaWireColorCodeD CondColorCondColorCondColor 1BLACK2RED3WHITE 2)CableAssembly3ComponentsCabled a)Twists:36.0

TypeEXThermocouple,1Pr#16Sol,PVCInsPur,Red,OS,PurplePVCJkt,300VPLTCITCCMG

ProductDescription TypeEXThermocouple,1Pair16AWG(Solid)Chromel+Constantan,PVCInsulationPur,RedColorCode,OverallBeldfoil®Shield,PurplePVCOuterJacket, PLTCITCCMGAWM2464SUNRES

SingleColorRightAngleType(3.0X2.0mm)

Features Productfeatures •OuterDimension3.0x2.0x1.0mm(LxWxH) •Temperaturerange StorageTemperature:-40℃～100℃ OperatingTemperature:-30℃～85℃ •Lead–freesolderingcompatible •RoHScompliant

PRITRANSFORMERSReinforcedInsulation

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