GMR-Based Dual Die Angle Sensor

文件：674.09 Kbytes Page：17 Pages

XENSIV ™ - TLE5012BD E9200 磁角度传感器，带双向 SSC 接口

SPI/IIF, GMR, Dual SMD

封装/外壳：16-TSSOP（0.154"，3.90mm 宽） 包装：管件 描述：SPEED SENSORS 16TDSO 传感器，变送器 位置传感器 - 角度、线性位置测量

SPI/SPC, GMR, Dual SMD

封装/外壳：16-TSSOP（0.154"，3.90mm 宽） 包装：管件 描述：SPEED SENSORS 16TDSO 传感器，变送器 位置传感器 - 角度、线性位置测量

AN-1713 LM5116-12 Evaluation Board

Introduction The LM5116-12 evaluation board is designed to provide the design engineer with a fully functional power converter based on Emulated Current Mode Control to evaluate the LM5116 controller IC. The evaluation board provides a 12V output with a 5A current capability. The operating inpu

THM TEST POINTS

(THM)THRU HOLE MOUNT TEST POINTS-COLOR KEYED •Color keyed for visibility and quick identification •Economical choice for PC test point terminations •Snap-fit mounting provides positive retention for wave soldering •Wire form loop for safe, non-sliptesting •Space saving, ultra low

2-A to 6-A Integrated Power Solution

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TPS84250EVM-001 2.5-A, Integrated Power Solution

文件：606.19 Kbytes Page：19 Pages

Customer Specification

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