High Power Density

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Power Chip Thick Film on Alumina Substrate

Power Chip® Thick Film on Alumina Substrate Ohmite’s original Power Chip resistors feature our thick film on alumina substrate technology. These planar packages yield space saving, 10W/in2 power densities that require over 50 less board space than other radial packages. Convection cooling is maxi

Power Chip Thick Film on Alumina Substrate

Power Chip® Thick Film on Alumina Substrate Ohmite’s original Power Chip resistors feature our thick film on alumina substrate technology. These planar packages yield space saving, 10W/in2 power densities that require over 50 less board space than other radial packages. Convection cooling is maxi

Power Chip Thick Film on Alumina Substrate

Power Chip® Thick Film on Alumina Substrate Ohmite’s original Power Chip resistors feature our thick film on alumina substrate technology. These planar packages yield space saving, 10W/in2 power densities that require over 50 less board space than other radial packages. Convection cooling is maxi

封装/外壳：径向 包装：卷带（TR） 描述：RES 1.5 OHM 5% 10W POWERCHIP 电阻器 通孔式电阻器

插件电阻

efficient and cost-effective solution to wear problems on the shaft.

� DESCRIPTION The BECA 810 profile is a standard stainless steel sleeve. � APPLICATIONS Hubs Pinions Differentials Gear boxes Crankshafts � DESCRIPTION The BECA 811 profile is a premium stainless steel sleeve with a hard chrome treatment. � APPLICATIONS Hubs Pinions Different

Cartridge Fuse Holders Enclosed Fuseholders > Circuit Board Mounted

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FUSE HOLDER SELECTION GUIDE

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PC Mount, Shocksafe 5x20mm / 6.3x32mm Fuses

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High-volume Vertical Display Mounting Applications

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