High Power Density

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Power Chip Thick Film on Alumina Substrate

Power Chip® Thick Film on Alumina Substrate Ohmite’s original Power Chip resistors feature our thick film on alumina substrate technology. These planar packages yield space saving, 10W/in2 power densities that require over 50 less board space than other radial packages. Convection cooling is maxi

Power Chip Thick Film on Alumina Substrate

Power Chip® Thick Film on Alumina Substrate Ohmite’s original Power Chip resistors feature our thick film on alumina substrate technology. These planar packages yield space saving, 10W/in2 power densities that require over 50 less board space than other radial packages. Convection cooling is maxi

Power Chip Thick Film on Alumina Substrate

Power Chip® Thick Film on Alumina Substrate Ohmite’s original Power Chip resistors feature our thick film on alumina substrate technology. These planar packages yield space saving, 10W/in2 power densities that require over 50 less board space than other radial packages. Convection cooling is maxi

SHAFT SEALS WITH PTFE LIPS

DESCRIPTION The BECA 805 profile is a shaft seal composed of a filled PTFE double primary sealing lip, a rubber counter-seal and a metal cage. APPLICATIONS Engines Crankshafts Food & Beverage

TO-5 Series Accelerometer

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Low Power Microprocessor Supervisory

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Low Power Microprocessor Supervisory with Battery Switch-Over

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Low Power Microprocessor Supervisory with Battery Switch-Over

文件：411.97 Kbytes Page：16 Pages