4 Channel High Speed Synch/Asynch Serial Interface

Application Information The TAMC863 is a standard single Mid-Size/Full-Size AMC.1 compliant module with four high speed serial data communication channels. The serial communication controller is implemented in FPGA logic, along with a bus master capable PCI interface, guaranteeing long term avai

MTCA.4 Rear-I/O μRTM for TAMC220

Application Information The TAMC002-TM is a standard Mid-Size/Full-Size MTCA.4 compliant Micro Rear Transition Module compatible to the TAMC220. Two AirmaxVS connectors provide access to all IP I/O lines of the TAMC220. The I/O lines are routed to three VHD68 SCSI-V connectors in the front panel

AMC Carrier for 3 IndustryPacks®

Application Information The TAMC200 is a standard double Mid-Size/Full-Size AMC.1 (PCI-Express) compliant carrier for up to three single-size or one double-size and one single-size IndustryPack (IP) modules used to build modular, flexible and cost effective I/O solutions for all kinds of applicat

PMC-Carrier for AMC

Application Information The TAMC260 is a standard Mid-Size/Full-Size AMC module that provides one slot for a single-width PMC module used to build modular, flexible and cost effective I/O solutions for applications in process control, medical systems, telecommunication and traffic control. 32 bi

Cable Kit for Modules with VHD68 / SCSI-V Connector

Power Chip Resistors Thick Film on Alumina Substrate

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High Power Density

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Power Chip짰 Thick Film on Alumina Substrate

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Power Chip Thick Film on Alumina Substrate

Power Chip® Thick Film on Alumina Substrate Ohmite’s original Power Chip resistors feature our thick film on alumina substrate technology. These planar packages yield space saving, 10W/in2 power densities that require over 50 less board space than other radial packages. Convection cooling is maxi

Power Chip Thick Film on Alumina Substrate

Power Chip® Thick Film on Alumina Substrate Ohmite’s original Power Chip resistors feature our thick film on alumina substrate technology. These planar packages yield space saving, 10W/in2 power densities that require over 50 less board space than other radial packages. Convection cooling is maxi

Power Chip Thick Film on Alumina Substrate

Power Chip® Thick Film on Alumina Substrate Ohmite’s original Power Chip resistors feature our thick film on alumina substrate technology. These planar packages yield space saving, 10W/in2 power densities that require over 50 less board space than other radial packages. Convection cooling is maxi

High Power Density

文件：333.97 Kbytes Page：2 Pages

Card Edge Connectors 0.156” (3.96mm) Pitch

Features: • 0.156” (3.96mm) contact spacing by 0.200” (5.08mm) row spacing • Accepts 0.062” (1.57mm) nominal thickness P.C. board • Low profile insulator body, 0.473” (12.01mm) • Contact termination options include P.C. tail, wire hole, wire wrap, 90° and extender board bends • Single or dual

Commercial miniature 6 mm cermet trimmer potentiometer

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Test insulation to 400M廓

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Label format - Old format order code cross reference

文件：3.00256 Mbytes Page：48 Pages

Label format - Old format order code cross reference

文件：3.00256 Mbytes Page：48 Pages