High Power Density

文件：333.97 Kbytes Page：2 Pages

Power Chip Thick Film on Alumina Substrate

Power Chip® Thick Film on Alumina Substrate Ohmite’s original Power Chip resistors feature our thick film on alumina substrate technology. These planar packages yield space saving, 10W/in2 power densities that require over 50 less board space than other radial packages. Convection cooling is maxi

Power Chip Thick Film on Alumina Substrate

Power Chip® Thick Film on Alumina Substrate Ohmite’s original Power Chip resistors feature our thick film on alumina substrate technology. These planar packages yield space saving, 10W/in2 power densities that require over 50 less board space than other radial packages. Convection cooling is maxi

Power Chip Thick Film on Alumina Substrate

Power Chip® Thick Film on Alumina Substrate Ohmite’s original Power Chip resistors feature our thick film on alumina substrate technology. These planar packages yield space saving, 10W/in2 power densities that require over 50 less board space than other radial packages. Convection cooling is maxi

Card Edge Connectors 0.156” (3.96mm) Pitch

Features: • 0.156” (3.96mm) contact spacing by 0.200” (5.08mm) row spacing • Accepts 0.062” (1.57mm) nominal thickness P.C. board • Low profile insulator body, 0.473” (12.01mm) • Contact termination options include P.C. tail, wire hole, wire wrap, 90° and extender board bends • Single or dual

Commercial miniature 6 mm cermet trimmer potentiometer

文件：241.34 Kbytes Page：2 Pages

Test insulation to 400M廓

文件：134.71 Kbytes Page：1 Pages

Label format - Old format order code cross reference

文件：3.00256 Mbytes Page：48 Pages

Label format - Old format order code cross reference

文件：3.00256 Mbytes Page：48 Pages