位置:STGB30H60DLLFBAG > STGB30H60DLLFBAG详情

STGB30H60DLLFBAG中文资料

厂家型号

STGB30H60DLLFBAG

文件大小

1009.49Kbytes

页面数量

17

功能描述

Automotive-grade trench gate field-stop IGBT, HB series 600 V, 30 A high speed

数据手册

下载地址一下载地址二到原厂下载

生产厂商

STMICROELECTRONICS

STGB30H60DLLFBAG数据手册规格书PDF详情

Features

 AEC-Q101 qualified

 Maximum junction temperature: TJ = 175 °C

 Logic level gate drive

 High speed switching series

 Minimized tail current

 VCE(sat) = 1.7 V (typ.) @ IC = 30 A

 Low VF soft recovery co-packaged diode

 Tight parameters distribution

 Safer paralleling

 Low thermal resistance

Description

This device is an IGBT developed using an

advanced proprietary trench gate field-stop

structure. The device is part of the new HB series

of IGBTs, which represents an optimum

compromise between conduction and switching

loss to maximize the efficiency of any frequency

converter. Furthermore, the slightly positive

VCE(sat) temperature coefficient and very tight

parameter distribution result in safer paralleling

operation.

Applications

 Ignition

更新时间:2025-9-30 15:49:00
供应商 型号 品牌 批号 封装 库存 备注 价格
STMicroelectronics
25+
TO-263-3 D?Pak(2 引线 + 接片
9350
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STMicroelectronics
24+
NA
3000
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ST/意法半导体
24+
D2PAK-3
20000
现货
ST
24+
D2PAK
16900
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ST/意法半导体
24+
D2PAK-3
16900
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ST
25+
D2PAK
16900
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ST/意法半导体
25+
原厂封装
10280
原厂授权代理,专注军工、汽车、医疗、工业、新能源!
ST/意法半导体
25+
原厂封装
9999
ST/意法半导体
24+
D2PAK-3
10000
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ST/意法半导体
24+
D2PAK-3
16960
原装正品现货支持实单