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STGB30H60DLFB中文资料

厂家型号

STGB30H60DLFB

文件大小

1744.76Kbytes

页面数量

20

功能描述

Trench gate field-stop IGBT, HB series 600 V, 30 A high speed

数据手册

下载地址一下载地址二到原厂下载

生产厂商

STMICROELECTRONICS

STGB30H60DLFB数据手册规格书PDF详情

Description

These devices are IGBTs developed using an

advanced proprietary trench gate and field stop

structure. The device is part of the new HB

series of IGBTs, which represent an optimum

compromise between conduction and switching

losses to maximize the efficiency of any

frequency converter. Furthermore, a slightly

positive VCE(sat) temperature coefficient and very

tight parameter distribution result in safer

paralleling operation.

Features

• Designed for soft commutation only

• Maximum junction temperature: TJ = 175 °C

• High speed switching series

• Minimized tail current

• VCE(sat) = 1.55 V (typ.) @ IC = 30 A

• Low VF soft recovery co-packaged diode

• Tight parameters distribution

• Safe paralleling

• Low thermal resistance

• Lead free package

Applications

• Microwave oven

• Resonant converters

更新时间:2025-10-5 8:11:00
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ST(意法半导体)
24+
TO-263-3
1612
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TO-263
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N
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N/A
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22+
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