Silver Wirebonding

KEY FEATURES Ag-Alloy wire is softer than Cu wire resulting in lower Al-Splash and lower risk of bond pad damage Ag-Alloy wire has a wide process window that improves manufacturability for devices with fragile bond pad structures

Shrink Small Outline, Quarter-Size Small-Outline Packages

文件：433.21 Kbytes Page：2 Pages

24-LEAD SHRINK SMALL OUTLINE PACKAGE

24-LEAD SHRINK SMALL OUTLINE PACKAGE(PACKING INFORMATION)

Surface mounted, 28 pin package

Package information - SSOP28 Surface mounted, 28 pin package

LSI Assembly

LSI Assembly • SSOP-A20 H=2.01Max.

LSI Assembly

LSI Assembly • SSOP-A32 H=2.01Max.

LSI Assembly

LSI Assembly • SSOP-A44 H=1.9Max.

SSOP-A54

LSI Assembly

LSI Assembly

LSI Assembly

LSI Assembly

LSI Assembly • SSOP-B24 H=1.35Max.

LSI Assembly

LSI Assembly • SSOP-B28 H=1.35Max.

LSI Assembly

LSI Assembly • SSOP-B40 H=2.0Max.

LSI Assembly

LSI Assembly • SSOP-B8 H=1.35Max.

SSOP (Shrink Small-Outline Package) and QSOP (Quarter-Size Small Outline Package) are leadframe based, plastic encapsulated packages

FEATURES Cu wire interconnect for low cost Standard JEDEC package outlines Multi-die production capability Turnkey test services, including strip test options Green materials are standard – Pb-free and RoHS compliant Stealth dicing (narrow saw streets) Larger/Higher density leadframe

4 MHz、7 nV/√Hz、低失调和漂移、高精度放大器

4 MHz、7 nV/√Hz、低失调和漂移、高精度放大器

4 MHz、7 nV/√Hz、低失调和漂移、高精度放大器

16-Lead SSOP Plastic Package

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Package Outline

文件：121.56 Kbytes Page：1 Pages

Package Outline

文件：122.93 Kbytes Page：1 Pages

Package Outline

文件：122.38 Kbytes Page：1 Pages

Package Outline

文件：121.48 Kbytes Page：1 Pages

Package Outline

文件：122.64 Kbytes Page：1 Pages

Package Outline

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Package Outline

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A : MIN 1.35 MAX 1.75 A1 : MIN 0.10 MAX 0.25

文件：69.07 Kbytes Page：1 Pages

Package Outline

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Carrier Width (W) 16.0-0.1 mm Pitch (P) 4.0-0.1 mm

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Preliminary

文件：587.79 Kbytes Page：81 Pages

Package Outline

文件：125.81 Kbytes Page：1 Pages

Package Outline

文件：127.46 Kbytes Page：1 Pages

Package Outline

文件：126.99 Kbytes Page：1 Pages

SSOP5

文件：35.44 Kbytes Page：2 Pages

LSI Assembly

文件：35.77 Kbytes Page：2 Pages

SSOP-A16

文件：38.04 Kbytes Page：2 Pages

LSI Assembly

文件：37.04 Kbytes Page：2 Pages

LSI Assembly

文件：36.69 Kbytes Page：2 Pages

LSI Assembly

文件：36.64 Kbytes Page：2 Pages

3.0V to 5.5V RS-232 Driver/Receiver Pair

文件：478.5 Kbytes Page：21 Pages

3.0V to 5.5V RS-232 Driver/Receiver Pair

文件：478.5 Kbytes Page：21 Pages

3.0V to 5.5V RS-232 Driver/Receiver Pair

文件：478.5 Kbytes Page：21 Pages

3.0V to 5.5V RS-232 Driver/Receiver Pair

文件：478.5 Kbytes Page：21 Pages

3.0V to 5.5V RS-232 Driver/Receiver Pair

文件：478.5 Kbytes Page：21 Pages

3.0V to 5.5V RS-232 Driver/Receiver Pair

文件：478.5 Kbytes Page：21 Pages