15.6 Self-Service Kiosk with Intel® Smart Display Module (SDM) CPU Card, Direct Bonding PCAP, 2D Barcode Scanner, Thermal Printer, and NFC

Features ● 15.6 optical bonding LCD with wide viewing angle and 400 nits of brightness ● Supports Intel® Smart Display Module Small (Intel® SDM-S) and Intel® Smart Display Module Large (Intel® SDM-L) ● Push button design for easy maintenance ● Supports floor stand and counter-top stand ● Du

15.6 Self-Service Kiosk with Intel® Smart Display Module (SDM) CPU Card, Direct Bonding PCAP, 2D Barcode Scanner, Thermal Printer, and NFC

Features ● 15.6 optical bonding LCD with wide viewing angle and 400 nits of brightness ● Supports Intel® Smart Display Module Small (Intel® SDM-S) and Intel® Smart Display Module Large (Intel® SDM-L) ● Push button design for easy maintenance ● Supports floor stand and counter-top stand ● Du

15.6 Self-Service Kiosk with Intel® Smart Display Module (SDM) CPU Card, Direct Bonding PCAP, 2D Barcode Scanner, Thermal Printer, and NFC

Features ● 15.6 optical bonding LCD with wide viewing angle and 400 nits of brightness ● Supports Intel® Smart Display Module Small (Intel® SDM-S) and Intel® Smart Display Module Large (Intel® SDM-L) ● Push button design for easy maintenance ● Supports floor stand and counter-top stand ● Du

15.6 Self-Service Kiosk with Intel® Smart Display Module (SDM) CPU Card, Direct Bonding PCAP, 2D Barcode Scanner, Thermal Printer, and NFC

Features ● 15.6 optical bonding LCD with wide viewing angle and 400 nits of brightness ● Supports Intel® Smart Display Module Small (Intel® SDM-S) and Intel® Smart Display Module Large (Intel® SDM-L) ● Push button design for easy maintenance ● Supports floor stand and counter-top stand ● Du

15.6 Self-Service Kiosk with Intel® Smart Display Module (SDM) CPU Card, Direct Bonding PCAP, 2D Barcode Scanner, Thermal Printer, and NFC

Features ● 15.6 optical bonding LCD with wide viewing angle and 400 nits of brightness ● Supports Intel® Smart Display Module Small (Intel® SDM-S) and Intel® Smart Display Module Large (Intel® SDM-L) ● Push button design for easy maintenance ● Supports floor stand and counter-top stand ● Du

Card Edge Connectors 0.156” (3.96mm) Pitch

Features: • 0.156” (3.96mm) contact spacing x 0.140” (3.56mm) row spacing • Accepts 0.062” (1.57mm) nominal thickness P.C. board • Low profile insulator body, 0.470” (11.94mm) • Contact termination options include P.C. tail, wire hole, extender board bends • Dual row configuration • Large va

ROD SEALS

DESCRIPTION The BECA 315 profile is a single acting buffer rod seal composed of a profiled polyurethane triple lip seal and a POM back-up ring on the back. APPLICATIONS Agriculture Mobile machinery Injection presses Hydraulic cylinders

310, 315 All-Welded “Mini” Diaphragm Seal

FEATURES No gaskets or bolts Available with 1⁄8 NPT flushing connection Designed for use with transducers and 31/2˝ or smaller gauges

IEC60309 PIN & SLEEVE DEVICES • LIGHT & STAGE DEVICES

文件：401.49 Kbytes Page：2 Pages

IEC60309 PIN & SLEEVE DEVICES • LIGHT & STAGE DEVICES

文件：401.49 Kbytes Page：2 Pages