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SP001

包装:散装 描述:SPEAKER WALL/CEILING MOUNT 计算机设备 配件

ETC

知名厂家

SP001

包装:散装 描述:SPEAKER WALL/CEILING MOUNT 计算机设备 配件

ETC

知名厂家

System-Supply for Safety-Relevant Applications

„ Pre-/post-regulator concept: boost & buck / LDOs & trackers for – μC (main, ADC/reference, StBy) – Transceivers – Sensors „ Integration of functional safety (features supporting ASIL-D) – UV/OV-monitoring – Flexible watchdogs – Error-monitoring – Safe state controller with 2 outputs

Infineon

英飞凌

System-Supply for Safety-Relevant Applications

„ Pre-/post-regulator concept: boost & buck / LDOs & trackers for – μC (main, ADC/reference, StBy) – Transceivers – Sensors „ Integration of functional safety (features supporting ASIL-D) – UV/OV-monitoring – Flexible watchdogs – Error-monitoring – Safe state controller with 2 outputs

Infineon

英飞凌

HybridPACKª Light Module

Electrical Features • Increased blocking voltage capability to 705V • Low Switching Losses • Tvj op = 150°C • Trench IGBT 3 • VCEsat with positive Temperature Coefficient Mechanical Features • 2.5 kV AC 1min Insulation • Al2O3 Substrate with Low Thermal Resistance • High mechanical robu

Infineon

英飞凌

TLx5012B 2go Evaluation Kit

1 General description The TLx5012B 2go is a budget-priced evaluation kit to evaluate several derivatives of the Infineon TLx5012B GMR angle sensor: • TLx5012B E1000: industrial version with IIF interface • TLx5012B E1000: automotive version with IIF interface • TLx5012B E5000: automotive vers

Infineon

英飞凌

TLx5012B 2go Evaluation Kit

1 General description The TLx5012B 2go is a budget-priced evaluation kit to evaluate several derivatives of the Infineon TLx5012B GMR angle sensor: • TLx5012B E1000: industrial version with IIF interface • TLx5012B E1000: automotive version with IIF interface • TLx5012B E5000: automotive vers

Infineon

英飞凌

TLx5012B 2go Evaluation Kit

1 General description The TLx5012B 2go is a budget-priced evaluation kit to evaluate several derivatives of the Infineon TLx5012B GMR angle sensor: • TLx5012B E1000: industrial version with IIF interface • TLx5012B E1000: automotive version with IIF interface • TLx5012B E5000: automotive vers

Infineon

英飞凌

TLx5012B 2go Evaluation Kit

1 General description The TLx5012B 2go is a budget-priced evaluation kit to evaluate several derivatives of the Infineon TLx5012B GMR angle sensor: • TLx5012B E1000: industrial version with IIF interface • TLx5012B E1000: automotive version with IIF interface • TLx5012B E5000: automotive vers

Infineon

英飞凌

TLx5012B 2go Evaluation Kit

1 General description The TLx5012B 2go is a budget-priced evaluation kit to evaluate several derivatives of the Infineon TLx5012B GMR angle sensor: • TLx5012B E1000: industrial version with IIF interface • TLx5012B E1000: automotive version with IIF interface • TLx5012B E5000: automotive vers

Infineon

英飞凌

Analog AMR/GMR Angle Sensors

Features • Single and dual die sensor with AMR or GMR technology • Separate supply pins for top and bottom sensor • Low current consumption and quick start up • 180°(AMR) and 360°(GMR) contactless angle measurement • Output amplitude optimized for circuits with 3.3 V or 5 V supply voltage •

Infineon

英飞凌

Analog AMR/GMR Angle Sensors

Features • Single and dual die sensor with AMR or GMR technology • Separate supply pins for top and bottom sensor • Low current consumption and quick start up • 180°(AMR) and 360°(GMR) contactless angle measurement • Output amplitude optimized for circuits with 3.3 V or 5 V supply voltage •

Infineon

英飞凌

Analog AMR/GMR Angle Sensors

Features • Single and dual die sensor with AMR or GMR technology • Separate supply pins for top and bottom sensor • Low current consumption and quick start up • 180°(AMR) and 360°(GMR) contactless angle measurement • Output amplitude optimized for circuits with 3.3 V or 5 V supply voltage •

Infineon

英飞凌

System-Supply for Safety-Relevant Applications

„ Pre-/post-regulator concept: boost & buck / LDOs & trackers for – μC (main, ADC/reference, StBy) – Transceivers – Sensors „ Integration of functional safety (features supporting ASIL-D) – UV/OV-monitoring – Flexible watchdogs – Error-monitoring – Safe state controller with 2 outputs

Infineon

英飞凌

System-Supply for Safety-Relevant Applications

„ Pre-/post-regulator concept: boost & buck / LDOs & trackers for – μC (main, ADC/reference, StBy) – Transceivers – Sensors „ Integration of functional safety (features supporting ASIL-D) – UV/OV-monitoring – Flexible watchdogs – Error-monitoring – Safe state controller with 2 outputs

Infineon

英飞凌

Analog AMR/GMR Angle Sensors

Features • Single and dual die sensor with AMR or GMR technology • Separate supply pins for top and bottom sensor • Low current consumption and quick start up • 180°(AMR) and 360°(GMR) contactless angle measurement • Output amplitude optimized for circuits with 3.3 V or 5 V supply voltage •

Infineon

英飞凌

Analog AMR/GMR Angle Sensors

Features • Single and dual die sensor with AMR or GMR technology • Separate supply pins for top and bottom sensor • Low current consumption and quick start up • 180°(AMR) and 360°(GMR) contactless angle measurement • Output amplitude optimized for circuits with 3.3 V or 5 V supply voltage •

Infineon

英飞凌

HybridPACK™ 1 Module

Electrical Features • Increased blocking voltage capability to 705V • VCEsat with positive Temperature Coefficient • Low VCEsat • Low Switching Losses • Tvj op = 150°C • Short-time extended Operation Temperature Tvj op = 175°C Mechanical Features • 2.5kV AC 1min Insulation • Al2O3 Subs

Infineon

英飞凌

Analog AMR/GMR Angle Sensors

Features • Single and dual die sensor with AMR or GMR technology • Separate supply pins for top and bottom sensor • Low current consumption and quick start up • 180°(AMR) and 360°(GMR) contactless angle measurement • Output amplitude optimized for circuits with 3.3 V or 5 V supply voltage •

Infineon

英飞凌

Analog AMR/GMR Angle Sensors

Features • Single and dual die sensor with AMR or GMR technology • Separate supply pins for top and bottom sensor • Low current consumption and quick start up • 180°(AMR) and 360°(GMR) contactless angle measurement • Output amplitude optimized for circuits with 3.3 V or 5 V supply voltage •

Infineon

英飞凌

Analog AMR/GMR Angle Sensors

Features • Single and dual die sensor with AMR or GMR technology • Separate supply pins for top and bottom sensor • Low current consumption and quick start up • 180°(AMR) and 360°(GMR) contactless angle measurement • Output amplitude optimized for circuits with 3.3 V or 5 V supply voltage •

Infineon

英飞凌

Analog AMR/GMR Angle Sensors

Features • Single and dual die sensor with AMR or GMR technology • Separate supply pins for top and bottom sensor • Low current consumption and quick start up • 180°(AMR) and 360°(GMR) contactless angle measurement • Output amplitude optimized for circuits with 3.3 V or 5 V supply voltage •

Infineon

英飞凌

Analog AMR/GMR Angle Sensors

Features • Single and dual die sensor with AMR or GMR technology • Separate supply pins for top and bottom sensor • Low current consumption and quick start up • 180°(AMR) and 360°(GMR) contactless angle measurement • Output amplitude optimized for circuits with 3.3 V or 5 V supply voltage •

Infineon

英飞凌

Analog AMR/GMR Angle Sensors

Features • Single and dual die sensor with AMR or GMR technology • Separate supply pins for top and bottom sensor • Low current consumption and quick start up • 180°(AMR) and 360°(GMR) contactless angle measurement • Output amplitude optimized for circuits with 3.3 V or 5 V supply voltage •

Infineon

英飞凌

HybridPACK™ Drive Module

Electrical Features •Blocking voltage 750V •Low VCEsat •Low Switching Losses •Low Qg and Crss •Low Inductive Design •Tvj op = 150°C •Short-time extended Operation Temperature Tvj op = 175°C Mechanical Features •4.2kV DC 1sec Insulation •High Creepage and Clearance Distances •Compact

Infineon

英飞凌

HybridPACK™ Drive Module

1 Features / Description HybridPACK™ Drive module with EDT2 IGBT and Diode Electrical Features •Blocking voltage 750V •Low VCEsat •Low Switching Losses •Low Qg and Crss •Low Inductive Design •Tvj op = 150°C •Short-time extended Operation Temperature Tvj op = 175°C Mechanical Feature

Infineon

英飞凌

HybridPACK™ Drive Module

Electrical Features •Blocking voltage 750V •Low VCEsat •Low Switching Losses •Low Qg and Crss •Low Inductive Design •Tvj op = 150°C •Short-time extended Operation Temperature Tvj op = 175°C Mechanical Features •4.2kV DC 1sec Insulation •High Creepage and Clearance Distances •Compact

Infineon

英飞凌

Double Side Cooled Module

Electrical Features • Integrated Current Sensor • Integrated Temperature Sensor • Low Inductive Design • Blocking voltage 750V • Low Switching Losses • Short-time extended Operation Temperature Tvj op = 175°C Mechanical Features • 2.5kV AC 1min Insulation • Double sided cooling • Comp

Infineon

英飞凌

HybridPACK™ Drive Module

Electrical Features •Blocking voltage 750V •Low VCEsat •Low Switching Losses •Low Qg and Crss •Low Inductive Design •Tvj op = 150°C •Short-time extended Operation Temperature Tvj op = 175°C Mechanical Features •4.2kV DC 1sec Insulation •High Creepage and Clearance Distances •Compact

Infineon

英飞凌

HybridPACK™ Drive Module

Electrical Features •Blocking voltage 1200V •Low VCEsat •Low Switching Losses •Low Qg and Crss •Low Inductive Design •Tvj op = 150°C Mechanical Features •4.2kV DC 1sec Insulation •High Creepage and Clearance Distances •High Power Density •High Performance Si3N4 Ceramic •Direct Cooled

Infineon

英飞凌

Double Side Cooled Module

Electrical Features • Increased Blocking Voltage Capability to 700V • Integrated Current Sensor • Low Inductive Design • Tvj op = 150°C Mechanical Features • 2.5kV AC 1min Insulation • Double sided cooling • Compact design • RoHS compliant • Integrated NTC temperature sensor

Infineon

英飞凌

Double Side Cooled Module

Electrical Features • Increased Blocking Voltage Capability to 700V • Integrated Current Sensor • Integrated Temperature Sensor • Low Inductive Design • Low Switching Losses • Tvj op = 150°C • Short-time extended Operation Temperature Tvj op = 175°C Mechanical Features • 2.5kV AC 1min

Infineon

英飞凌

TLE4929C Crankshaft Sensor Fully Programmable Crankshaft Sensor

Features • Measures speed and position of tooth/pole wheels • Switching point in middle of the tooth enables backward compatibility • Magnetic stray-field robustness due to differential sensing principle • Digital output signal with programmable output-protocol including diagnosis interface

Infineon

英飞凌

TLE4929C Crankshaft Sensor Fully Programmable Crankshaft Sensor

Features • Measures speed and position of tooth/pole wheels • Switching point in middle of the tooth enables backward compatibility • Magnetic stray-field robustness due to differential sensing principle • Digital output signal with programmable output-protocol including diagnosis interface

Infineon

英飞凌

Low Power 3D Hall Sensor with I2C Interface

Features • 3D magnetic flux density sensing of ±160 mT. • Programmable flux resolution down to 65 μT (typ.). • X-Y angular measurement mode • Power down mode with 7 nA (typ) power consumption • 12-bit data resolution for each measurement direction plus 10-bit temperature sensor • Variable up

Infineon

英飞凌

XENSIV™ magnetic position sensors – world’s first fully ISO 26262 compliant linear Hall sensor for high precision applications

Key features ››Fully ISO 26262 compliant, supports ASIL-D systems ››

Infineon

英飞凌

HybridPACK™ Drive Module

Electrical Features •Blocking voltage 750V •Low VCEsat •Low Switching Losses •Low Qg and Crss •Low Inductive Design •Tvj op = 150°C •Short-time extended Operation Temperature Tvj op = 175°C Mechanical Features •4.2kV DC 1sec Insulation •High Creepage and Clearance Distances •Compact

Infineon

英飞凌

HybridPACK™ Drive Module

Electrical Features •Blocking voltage 750V •Low VCEsat •Low Switching Losses •Low Qg and Crss •Low Inductive Design •Tvj op = 150°C •Short-time extended Operation Temperature Tvj op = 175°C Mechanical Features •4.2kV DC 1sec Insulation •High Creepage and Clearance Distances •Compact

Infineon

英飞凌

Quickstart Manual for EVAL KIT HPD G1 SiC

The evaluation kit EVAL KIT HPD G1 SiC is a partial inverter system including B6 bridge power module, gate driver board, DC-link capacitor and cooler. The evaluation kit supports the customers in their first steps in designing applications with the HybridPACK™ Drive CoolSiC™.

Infineon

英飞凌

HybridPACK™ Drive Module

Electrical Features •Blocking voltage 750V •Low VCEsat •Low Switching Losses •Low Qg and Crss •Low Inductive Design •Tvj op = 150°C •Short-time extended Operation Temperature Tvj op = 175°C Mechanical Features •4.2kV DC 1sec Insulation •High Creepage and Clearance Distances •Compact

Infineon

英飞凌

650V/8A Silicon Carbide Schottky Diode in D2PAK (Real 2 Pins) CoolSiC™ Automotive Schottky Diode 650V G5

Features  Revolutionary semiconductor material - Silicon Carbide  Benchmark switching behavior  No reverse recovery/ No forward recovery  Temperature independent switching behavior  High surge current capability  Pb-free lead plating; RoHS compliant  Junction Temperature range from -

Infineon

英飞凌

650V/10A Silicon Carbide Schottky Diode in D2PAK (Real 2 Pins) CoolSiC™ Automotive Schottky Diode 650V G5

Features  Revolutionary semiconductor material - Silicon Carbide  Benchmark switching behavior  No reverse recovery/ No forward recovery  Temperature independent switching behavior  High surge current capability  Pb-free lead plating; RoHS compliant  Junction Temperature range from -

Infineon

英飞凌

650V/10A Silicon Carbide Schottky Diode in TO247-3 CoolSiC™ Automotive Schottky Diode 650V G5

Features  Revolutionary semiconductor material - Silicon Carbide  Benchmark switching behavior  No reverse recovery/ No forward recovery  Temperature independent switching behavior  High surge current capability  Pb-free lead plating; RoHS compliant  Junction Temperature range from -

Infineon

英飞凌

650V/16A Silicon Carbide Schottky Diode in TO247-3 CoolSiC™ Automotive Schottky Diode 650V G5

Features  Revolutionary semiconductor material - Silicon Carbide  Benchmark switching behavior  No reverse recovery/ No forward recovery  Temperature independent switching behavior  High surge current capability  Pb-free lead plating; RoHS compliant  Junction Temperature range from -

Infineon

英飞凌

650V/12A Silicon Carbide Schottky Diode in TO247-3 CoolSiC™ Automotive Schottky Diode 650V G5

Features  Revolutionary semiconductor material - Silicon Carbide  Benchmark switching behavior  No reverse recovery/ No forward recovery  Temperature independent switching behavior  High surge current capability  Pb-free lead plating; RoHS compliant  Junction Temperature range from -

Infineon

英飞凌

650V/16A Silicon Carbide Schottky Diode in D2PAK (Real 2 Pins) CoolSiC™ Automotive Schottky Diode 650V G5

Features • Revolutionary semiconductor material - Silicon Carbide • Benchmark switching behavior • No reverse recovery/No forward recovery • Temperature independent switching behavior • High surge current capability • Pb-free lead plating; RoHS compliant • Junction Temperature range

Infineon

英飞凌

650V/12A Silicon Carbide Schottky Diode in D2PAK (Real 2 Pins) CoolSiC™ Automotive Schottky Diode 650V G5

Features  Revolutionary semiconductor material - Silicon Carbide  Benchmark switching behavior  No reverse recovery/ No forward recovery  Temperature independent switching behavior  High surge current capability  Pb-free lead plating; RoHS compliant  Junction Temperature range from -

Infineon

英飞凌

HybridPACK™ Drive Module

Electrical Features •Blocking voltage 750V •Low VCEsat •Low Switching Losses •Low Qg and Crss •Low Inductive Design •Tvj op = 150°C •Short-time extended Operation Temperature Tvj op = 175°C Mechanical Features •4.2kV DC 1sec Insulation •High Creepage and Clearance Distances •Compact

Infineon

英飞凌

Differential Hall Effect Transmission Speed Sensors

1.1 Target Application The differential Hall Effect sensor TLE4953 is designed to provide information about rotational speed and direction of rotation to modern transmission and ABS systems. The output has been designed as a two wire current interface based on a Pulse Width Modulation principle

Infineon

英飞凌

Cylinder Ram Head for TEMCo TH0037 Hydraulic Knockout Punch Driver

TEMCO

Analog Absolute Pressure Sensor

文件:1.58367 Mbytes Page:25 Pages

Infineon

英飞凌

Single IGBT Driver IC SP001054670

文件:857.87 Kbytes Page:31 Pages

Infineon

英飞凌

Most integrated and sophisticated Time-of-Flight (ToF) imager available on the market.

文件:379.14 Kbytes Page:2 Pages

Infineon

英飞凌

Most integrated and sophisticated Time-of-Flight (ToF) imager available on the market.

Infineon

英飞凌

Most integrated and sophisticated Time-of-Flight (ToF) imager available on the market.

文件:379.14 Kbytes Page:2 Pages

Infineon

英飞凌

Galvanic Isolated 8 Channel High-Side Switch

文件:2.25791 Mbytes Page:82 Pages

Infineon

英飞凌

Galvanic Isolated 8 Channel High-Side Switch

Infineon

英飞凌

Giant Magneto Resistance (GMR)-based principle

文件:1.35531 Mbytes Page:45 Pages

Infineon

英飞凌

Giant Magneto Resistance (GMR)-based principle

文件:1.35531 Mbytes Page:45 Pages

Infineon

英飞凌

Giant Magneto Resistance (GMR)-based principle

文件:1.35531 Mbytes Page:45 Pages

Infineon

英飞凌

更新时间:2025-12-26 23:01:00
IC供应商 芯片型号 品牌 批号 封装 库存 备注 价格
SILON
24+
NA/
60
优势代理渠道,原装正品,可全系列订货开增值税票
infineon
1715
D2PAK
50
一级代理,专注军工、汽车、医疗、工业、新能源、电力
INFINEON
23+
NA
352
专做原装正品,假一罚百!
Infine
25+
25000
原厂原包 深圳现货 主打品牌 假一赔百 可开票!
INF
23+
15000
11200
原厂授权一级代理、全球订货优势渠道、可提供一站式BO
Infineon(英飞凌)
24+
TO-220
7793
支持大陆交货,美金交易。原装现货库存。
INFINEON/英飞凌
24+
37279
郑重承诺只做原装进口现货
LITEON/光宝
2450+
DIP8
6540
只做原厂原装正品现货或订货!终端工厂可以申请样品!
24+
DIP-24P
187
现货
INFINEON/英飞凌
2447
NA
100500
一级代理专营品牌!原装正品,优势现货,长期排单到货

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