| 型号 | 功能描述 | 生产厂家 企业 | LOGO | 操作 |
|---|---|---|---|---|
SP001 | 包装:散装 描述:SPEAKER WALL/CEILING MOUNT 计算机设备 配件 | ETC 知名厂家 | ETC | |
SP001 | 包装:散装 描述:SPEAKER WALL/CEILING MOUNT 计算机设备 配件 | ETC 知名厂家 | ETC | |
System-Supply for Safety-Relevant Applications Pre-/post-regulator concept: boost & buck / LDOs & trackers for – μC (main, ADC/reference, StBy) – Transceivers – Sensors Integration of functional safety (features supporting ASIL-D) – UV/OV-monitoring – Flexible watchdogs – Error-monitoring – Safe state controller with 2 outputs | Infineon 英飞凌 | |||
System-Supply for Safety-Relevant Applications Pre-/post-regulator concept: boost & buck / LDOs & trackers for – μC (main, ADC/reference, StBy) – Transceivers – Sensors Integration of functional safety (features supporting ASIL-D) – UV/OV-monitoring – Flexible watchdogs – Error-monitoring – Safe state controller with 2 outputs | Infineon 英飞凌 | |||
HybridPACKª Light Module Electrical Features • Increased blocking voltage capability to 705V • Low Switching Losses • Tvj op = 150°C • Trench IGBT 3 • VCEsat with positive Temperature Coefficient Mechanical Features • 2.5 kV AC 1min Insulation • Al2O3 Substrate with Low Thermal Resistance • High mechanical robu | Infineon 英飞凌 | |||
TLx5012B 2go Evaluation Kit 1 General description The TLx5012B 2go is a budget-priced evaluation kit to evaluate several derivatives of the Infineon TLx5012B GMR angle sensor: • TLx5012B E1000: industrial version with IIF interface • TLx5012B E1000: automotive version with IIF interface • TLx5012B E5000: automotive vers | Infineon 英飞凌 | |||
TLx5012B 2go Evaluation Kit 1 General description The TLx5012B 2go is a budget-priced evaluation kit to evaluate several derivatives of the Infineon TLx5012B GMR angle sensor: • TLx5012B E1000: industrial version with IIF interface • TLx5012B E1000: automotive version with IIF interface • TLx5012B E5000: automotive vers | Infineon 英飞凌 | |||
TLx5012B 2go Evaluation Kit 1 General description The TLx5012B 2go is a budget-priced evaluation kit to evaluate several derivatives of the Infineon TLx5012B GMR angle sensor: • TLx5012B E1000: industrial version with IIF interface • TLx5012B E1000: automotive version with IIF interface • TLx5012B E5000: automotive vers | Infineon 英飞凌 | |||
TLx5012B 2go Evaluation Kit 1 General description The TLx5012B 2go is a budget-priced evaluation kit to evaluate several derivatives of the Infineon TLx5012B GMR angle sensor: • TLx5012B E1000: industrial version with IIF interface • TLx5012B E1000: automotive version with IIF interface • TLx5012B E5000: automotive vers | Infineon 英飞凌 | |||
TLx5012B 2go Evaluation Kit 1 General description The TLx5012B 2go is a budget-priced evaluation kit to evaluate several derivatives of the Infineon TLx5012B GMR angle sensor: • TLx5012B E1000: industrial version with IIF interface • TLx5012B E1000: automotive version with IIF interface • TLx5012B E5000: automotive vers | Infineon 英飞凌 | |||
Analog AMR/GMR Angle Sensors Features • Single and dual die sensor with AMR or GMR technology • Separate supply pins for top and bottom sensor • Low current consumption and quick start up • 180°(AMR) and 360°(GMR) contactless angle measurement • Output amplitude optimized for circuits with 3.3 V or 5 V supply voltage • | Infineon 英飞凌 | |||
Analog AMR/GMR Angle Sensors Features • Single and dual die sensor with AMR or GMR technology • Separate supply pins for top and bottom sensor • Low current consumption and quick start up • 180°(AMR) and 360°(GMR) contactless angle measurement • Output amplitude optimized for circuits with 3.3 V or 5 V supply voltage • | Infineon 英飞凌 | |||
Analog AMR/GMR Angle Sensors Features • Single and dual die sensor with AMR or GMR technology • Separate supply pins for top and bottom sensor • Low current consumption and quick start up • 180°(AMR) and 360°(GMR) contactless angle measurement • Output amplitude optimized for circuits with 3.3 V or 5 V supply voltage • | Infineon 英飞凌 | |||
System-Supply for Safety-Relevant Applications Pre-/post-regulator concept: boost & buck / LDOs & trackers for – μC (main, ADC/reference, StBy) – Transceivers – Sensors Integration of functional safety (features supporting ASIL-D) – UV/OV-monitoring – Flexible watchdogs – Error-monitoring – Safe state controller with 2 outputs | Infineon 英飞凌 | |||
System-Supply for Safety-Relevant Applications Pre-/post-regulator concept: boost & buck / LDOs & trackers for – μC (main, ADC/reference, StBy) – Transceivers – Sensors Integration of functional safety (features supporting ASIL-D) – UV/OV-monitoring – Flexible watchdogs – Error-monitoring – Safe state controller with 2 outputs | Infineon 英飞凌 | |||
Analog AMR/GMR Angle Sensors Features • Single and dual die sensor with AMR or GMR technology • Separate supply pins for top and bottom sensor • Low current consumption and quick start up • 180°(AMR) and 360°(GMR) contactless angle measurement • Output amplitude optimized for circuits with 3.3 V or 5 V supply voltage • | Infineon 英飞凌 | |||
Analog AMR/GMR Angle Sensors Features • Single and dual die sensor with AMR or GMR technology • Separate supply pins for top and bottom sensor • Low current consumption and quick start up • 180°(AMR) and 360°(GMR) contactless angle measurement • Output amplitude optimized for circuits with 3.3 V or 5 V supply voltage • | Infineon 英飞凌 | |||
HybridPACK™ 1 Module Electrical Features • Increased blocking voltage capability to 705V • VCEsat with positive Temperature Coefficient • Low VCEsat • Low Switching Losses • Tvj op = 150°C • Short-time extended Operation Temperature Tvj op = 175°C Mechanical Features • 2.5kV AC 1min Insulation • Al2O3 Subs | Infineon 英飞凌 | |||
Analog AMR/GMR Angle Sensors Features • Single and dual die sensor with AMR or GMR technology • Separate supply pins for top and bottom sensor • Low current consumption and quick start up • 180°(AMR) and 360°(GMR) contactless angle measurement • Output amplitude optimized for circuits with 3.3 V or 5 V supply voltage • | Infineon 英飞凌 | |||
Analog AMR/GMR Angle Sensors Features • Single and dual die sensor with AMR or GMR technology • Separate supply pins for top and bottom sensor • Low current consumption and quick start up • 180°(AMR) and 360°(GMR) contactless angle measurement • Output amplitude optimized for circuits with 3.3 V or 5 V supply voltage • | Infineon 英飞凌 | |||
Analog AMR/GMR Angle Sensors Features • Single and dual die sensor with AMR or GMR technology • Separate supply pins for top and bottom sensor • Low current consumption and quick start up • 180°(AMR) and 360°(GMR) contactless angle measurement • Output amplitude optimized for circuits with 3.3 V or 5 V supply voltage • | Infineon 英飞凌 | |||
Analog AMR/GMR Angle Sensors Features • Single and dual die sensor with AMR or GMR technology • Separate supply pins for top and bottom sensor • Low current consumption and quick start up • 180°(AMR) and 360°(GMR) contactless angle measurement • Output amplitude optimized for circuits with 3.3 V or 5 V supply voltage • | Infineon 英飞凌 | |||
Analog AMR/GMR Angle Sensors Features • Single and dual die sensor with AMR or GMR technology • Separate supply pins for top and bottom sensor • Low current consumption and quick start up • 180°(AMR) and 360°(GMR) contactless angle measurement • Output amplitude optimized for circuits with 3.3 V or 5 V supply voltage • | Infineon 英飞凌 | |||
Analog AMR/GMR Angle Sensors Features • Single and dual die sensor with AMR or GMR technology • Separate supply pins for top and bottom sensor • Low current consumption and quick start up • 180°(AMR) and 360°(GMR) contactless angle measurement • Output amplitude optimized for circuits with 3.3 V or 5 V supply voltage • | Infineon 英飞凌 | |||
HybridPACK™ Drive Module Electrical Features •Blocking voltage 750V •Low VCEsat •Low Switching Losses •Low Qg and Crss •Low Inductive Design •Tvj op = 150°C •Short-time extended Operation Temperature Tvj op = 175°C Mechanical Features •4.2kV DC 1sec Insulation •High Creepage and Clearance Distances •Compact | Infineon 英飞凌 | |||
HybridPACK™ Drive Module 1 Features / Description HybridPACK™ Drive module with EDT2 IGBT and Diode Electrical Features •Blocking voltage 750V •Low VCEsat •Low Switching Losses •Low Qg and Crss •Low Inductive Design •Tvj op = 150°C •Short-time extended Operation Temperature Tvj op = 175°C Mechanical Feature | Infineon 英飞凌 | |||
HybridPACK™ Drive Module Electrical Features •Blocking voltage 750V •Low VCEsat •Low Switching Losses •Low Qg and Crss •Low Inductive Design •Tvj op = 150°C •Short-time extended Operation Temperature Tvj op = 175°C Mechanical Features •4.2kV DC 1sec Insulation •High Creepage and Clearance Distances •Compact | Infineon 英飞凌 | |||
Double Side Cooled Module Electrical Features • Integrated Current Sensor • Integrated Temperature Sensor • Low Inductive Design • Blocking voltage 750V • Low Switching Losses • Short-time extended Operation Temperature Tvj op = 175°C Mechanical Features • 2.5kV AC 1min Insulation • Double sided cooling • Comp | Infineon 英飞凌 | |||
HybridPACK™ Drive Module Electrical Features •Blocking voltage 750V •Low VCEsat •Low Switching Losses •Low Qg and Crss •Low Inductive Design •Tvj op = 150°C •Short-time extended Operation Temperature Tvj op = 175°C Mechanical Features •4.2kV DC 1sec Insulation •High Creepage and Clearance Distances •Compact | Infineon 英飞凌 | |||
HybridPACK™ Drive Module Electrical Features •Blocking voltage 1200V •Low VCEsat •Low Switching Losses •Low Qg and Crss •Low Inductive Design •Tvj op = 150°C Mechanical Features •4.2kV DC 1sec Insulation •High Creepage and Clearance Distances •High Power Density •High Performance Si3N4 Ceramic •Direct Cooled | Infineon 英飞凌 | |||
Double Side Cooled Module Electrical Features • Increased Blocking Voltage Capability to 700V • Integrated Current Sensor • Low Inductive Design • Tvj op = 150°C Mechanical Features • 2.5kV AC 1min Insulation • Double sided cooling • Compact design • RoHS compliant • Integrated NTC temperature sensor | Infineon 英飞凌 | |||
Double Side Cooled Module Electrical Features • Increased Blocking Voltage Capability to 700V • Integrated Current Sensor • Integrated Temperature Sensor • Low Inductive Design • Low Switching Losses • Tvj op = 150°C • Short-time extended Operation Temperature Tvj op = 175°C Mechanical Features • 2.5kV AC 1min | Infineon 英飞凌 | |||
TLE4929C Crankshaft Sensor Fully Programmable Crankshaft Sensor Features • Measures speed and position of tooth/pole wheels • Switching point in middle of the tooth enables backward compatibility • Magnetic stray-field robustness due to differential sensing principle • Digital output signal with programmable output-protocol including diagnosis interface | Infineon 英飞凌 | |||
TLE4929C Crankshaft Sensor Fully Programmable Crankshaft Sensor Features • Measures speed and position of tooth/pole wheels • Switching point in middle of the tooth enables backward compatibility • Magnetic stray-field robustness due to differential sensing principle • Digital output signal with programmable output-protocol including diagnosis interface | Infineon 英飞凌 | |||
Low Power 3D Hall Sensor with I2C Interface Features • 3D magnetic flux density sensing of ±160 mT. • Programmable flux resolution down to 65 μT (typ.). • X-Y angular measurement mode • Power down mode with 7 nA (typ) power consumption • 12-bit data resolution for each measurement direction plus 10-bit temperature sensor • Variable up | Infineon 英飞凌 | |||
XENSIV™ magnetic position sensors – world’s first fully ISO 26262 compliant linear Hall sensor for high precision applications Key features ››Fully ISO 26262 compliant, supports ASIL-D systems ›› | Infineon 英飞凌 | |||
HybridPACK™ Drive Module Electrical Features •Blocking voltage 750V •Low VCEsat •Low Switching Losses •Low Qg and Crss •Low Inductive Design •Tvj op = 150°C •Short-time extended Operation Temperature Tvj op = 175°C Mechanical Features •4.2kV DC 1sec Insulation •High Creepage and Clearance Distances •Compact | Infineon 英飞凌 | |||
HybridPACK™ Drive Module Electrical Features •Blocking voltage 750V •Low VCEsat •Low Switching Losses •Low Qg and Crss •Low Inductive Design •Tvj op = 150°C •Short-time extended Operation Temperature Tvj op = 175°C Mechanical Features •4.2kV DC 1sec Insulation •High Creepage and Clearance Distances •Compact | Infineon 英飞凌 | |||
Quickstart Manual for EVAL KIT HPD G1 SiC The evaluation kit EVAL KIT HPD G1 SiC is a partial inverter system including B6 bridge power module, gate driver board, DC-link capacitor and cooler. The evaluation kit supports the customers in their first steps in designing applications with the HybridPACK™ Drive CoolSiC™. | Infineon 英飞凌 | |||
HybridPACK™ Drive Module Electrical Features •Blocking voltage 750V •Low VCEsat •Low Switching Losses •Low Qg and Crss •Low Inductive Design •Tvj op = 150°C •Short-time extended Operation Temperature Tvj op = 175°C Mechanical Features •4.2kV DC 1sec Insulation •High Creepage and Clearance Distances •Compact | Infineon 英飞凌 | |||
650V/8A Silicon Carbide Schottky Diode in D2PAK (Real 2 Pins) CoolSiC™ Automotive Schottky Diode 650V G5 Features Revolutionary semiconductor material - Silicon Carbide Benchmark switching behavior No reverse recovery/ No forward recovery Temperature independent switching behavior High surge current capability Pb-free lead plating; RoHS compliant Junction Temperature range from - | Infineon 英飞凌 | |||
650V/10A Silicon Carbide Schottky Diode in D2PAK (Real 2 Pins) CoolSiC™ Automotive Schottky Diode 650V G5 Features Revolutionary semiconductor material - Silicon Carbide Benchmark switching behavior No reverse recovery/ No forward recovery Temperature independent switching behavior High surge current capability Pb-free lead plating; RoHS compliant Junction Temperature range from - | Infineon 英飞凌 | |||
650V/10A Silicon Carbide Schottky Diode in TO247-3 CoolSiC™ Automotive Schottky Diode 650V G5 Features Revolutionary semiconductor material - Silicon Carbide Benchmark switching behavior No reverse recovery/ No forward recovery Temperature independent switching behavior High surge current capability Pb-free lead plating; RoHS compliant Junction Temperature range from - | Infineon 英飞凌 | |||
650V/16A Silicon Carbide Schottky Diode in TO247-3 CoolSiC™ Automotive Schottky Diode 650V G5 Features Revolutionary semiconductor material - Silicon Carbide Benchmark switching behavior No reverse recovery/ No forward recovery Temperature independent switching behavior High surge current capability Pb-free lead plating; RoHS compliant Junction Temperature range from - | Infineon 英飞凌 | |||
650V/12A Silicon Carbide Schottky Diode in TO247-3 CoolSiC™ Automotive Schottky Diode 650V G5 Features Revolutionary semiconductor material - Silicon Carbide Benchmark switching behavior No reverse recovery/ No forward recovery Temperature independent switching behavior High surge current capability Pb-free lead plating; RoHS compliant Junction Temperature range from - | Infineon 英飞凌 | |||
650V/16A Silicon Carbide Schottky Diode in D2PAK (Real 2 Pins) CoolSiC™ Automotive Schottky Diode 650V G5 Features • Revolutionary semiconductor material - Silicon Carbide • Benchmark switching behavior • No reverse recovery/No forward recovery • Temperature independent switching behavior • High surge current capability • Pb-free lead plating; RoHS compliant • Junction Temperature range | Infineon 英飞凌 | |||
650V/12A Silicon Carbide Schottky Diode in D2PAK (Real 2 Pins) CoolSiC™ Automotive Schottky Diode 650V G5 Features Revolutionary semiconductor material - Silicon Carbide Benchmark switching behavior No reverse recovery/ No forward recovery Temperature independent switching behavior High surge current capability Pb-free lead plating; RoHS compliant Junction Temperature range from - | Infineon 英飞凌 | |||
HybridPACK™ Drive Module Electrical Features •Blocking voltage 750V •Low VCEsat •Low Switching Losses •Low Qg and Crss •Low Inductive Design •Tvj op = 150°C •Short-time extended Operation Temperature Tvj op = 175°C Mechanical Features •4.2kV DC 1sec Insulation •High Creepage and Clearance Distances •Compact | Infineon 英飞凌 | |||
Differential Hall Effect Transmission Speed Sensors 1.1 Target Application The differential Hall Effect sensor TLE4953 is designed to provide information about rotational speed and direction of rotation to modern transmission and ABS systems. The output has been designed as a two wire current interface based on a Pulse Width Modulation principle | Infineon 英飞凌 | |||
Cylinder Ram Head for TEMCo TH0037 Hydraulic Knockout Punch Driver | TEMCO | |||
Analog Absolute Pressure Sensor 文件:1.58367 Mbytes Page:25 Pages | Infineon 英飞凌 | |||
Single IGBT Driver IC SP001054670 文件:857.87 Kbytes Page:31 Pages | Infineon 英飞凌 | |||
Most integrated and sophisticated Time-of-Flight (ToF) imager available on the market. 文件:379.14 Kbytes Page:2 Pages | Infineon 英飞凌 | |||
Most integrated and sophisticated Time-of-Flight (ToF) imager available on the market. | Infineon 英飞凌 | |||
Most integrated and sophisticated Time-of-Flight (ToF) imager available on the market. 文件:379.14 Kbytes Page:2 Pages | Infineon 英飞凌 | |||
Galvanic Isolated 8 Channel High-Side Switch 文件:2.25791 Mbytes Page:82 Pages | Infineon 英飞凌 | |||
Galvanic Isolated 8 Channel High-Side Switch | Infineon 英飞凌 | |||
Giant Magneto Resistance (GMR)-based principle 文件:1.35531 Mbytes Page:45 Pages | Infineon 英飞凌 | |||
Giant Magneto Resistance (GMR)-based principle 文件:1.35531 Mbytes Page:45 Pages | Infineon 英飞凌 | |||
Giant Magneto Resistance (GMR)-based principle 文件:1.35531 Mbytes Page:45 Pages | Infineon 英飞凌 |
| IC供应商 | 芯片型号 | 品牌 | 批号 | 封装 | 库存 | 备注 | 价格 |
|---|---|---|---|---|---|---|---|
SILON |
24+ |
NA/ |
60 |
优势代理渠道,原装正品,可全系列订货开增值税票 |
|||
infineon |
1715 |
D2PAK |
50 |
一级代理,专注军工、汽车、医疗、工业、新能源、电力 |
|||
INFINEON |
23+ |
NA |
352 |
专做原装正品,假一罚百! |
|||
Infine |
25+ |
25000 |
原厂原包 深圳现货 主打品牌 假一赔百 可开票! |
||||
INF |
23+ |
15000 |
11200 |
原厂授权一级代理、全球订货优势渠道、可提供一站式BO |
|||
Infineon(英飞凌) |
24+ |
TO-220 |
7793 |
支持大陆交货,美金交易。原装现货库存。 |
|||
INFINEON/英飞凌 |
24+ |
37279 |
郑重承诺只做原装进口现货 |
||||
LITEON/光宝 |
2450+ |
DIP8 |
6540 |
只做原厂原装正品现货或订货!终端工厂可以申请样品! |
|||
24+ |
DIP-24P |
187 |
现货 |
||||
INFINEON/英飞凌 |
2447 |
NA |
100500 |
一级代理专营品牌!原装正品,优势现货,长期排单到货 |
SP001芯片相关品牌
SP001规格书下载地址
SP001参数引脚图相关
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- SOT-Z
- SOTYXXD
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- SOT96-1
- SOT953
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- SOT89-3
- SOT-89
- SOT89
- SOT78
- SOT753
- SOT-723
SP001数据表相关新闻
SP0503BAHTG原包原标,现货
SP0503BAHTG原包原标,现货
2024-7-31SP1002-02JTG
SP1002-02JTG
2023-2-22SP1003-01DTG
SP1003-01DTG
2021-6-22Socionext下一代汽车定制芯片将采用台积电5nm工艺
Socionext下一代汽车定制芯片将采用台积电5nm工艺
2021-2-5Socionext携纵行科技、Techsor共同开发新一代ZETA通信芯片-最新研发,独一无二
SoC 设计与应用技术领导厂商Socionext Inc.(以下“Socionext”)联合LPWA(低功耗广域网)的ZETA标准创始公司纵行科技和ZETA日本联盟的代表理事公司Techsor宣布,共同开发基于“Advanced M-FSK调制方法”的新一代ZETA通信芯片。
2020-10-29SOT23-5SGM2300SGM2300-5.0YN5G/TR线性稳压器芯片原装正
SOT23-5 SGM2300 SGM2300-5.0YN5G/TR 线性稳压器芯片 原装正
2019-7-25
DdatasheetPDF页码索引
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