Surface Mount Package Polarity: Cathode Bar

SUGGESTED PAD LAYOUT

The SOD123-FL package is part of the FLAT series of compact surface mount packages which allow communication equipment to be miniaturized.

FEATURES Cu connector structure to reduce inductance and resistance Enhanced thermal properties Turnkey with test and packing services Green materials: Pb-free plating & halogen-free mold compound Applications The FLAT package series is suitable for small and medium size high‑efficienc

SILICON BIDIRECTIONAL TRIGGER DIODES

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Bare copper leadframe with no plating

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Silicon Bidirectional Trigger Diodes

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Customer Specification

Construction Diameters (In) 1) Component 1 8 X 1 COND a) Conductor 22 (26/36) AWG Bare Copper 0.027 b) Insulation 0.010 Wall, Nom. MPPE 0.047 (1) Color(s) Cond Color Cond Color Cond Color 1 WHITE 4 YELLOW 7 BLUE 2 BROWN 5 SLATE 8 RED 3 GREEN 6 PINK 2) Cable Assembly 8 Components Cabled

Customer SpecificationS

Construction Diameters (In) 1) Component 1 8 X 1 COND a) Conductor 22 (26/36) AWG Bare Copper 0.027 b) Insulation 0.010 Wall, Nom. MPPE 0.047 (1) Color(s) Cond Color Cond Color Cond Color 1 WHITE 4 YELLOW 7 BLUE 2 BROWN 5 SLATE 8 RED 3 GREEN 6 PINK 2) Cable Assembly 8 Components Cabled

M.2 Socket, H2.1 A Key 0.5 Pitch G/F, Black, Reel

Performance and Descriptions: The product is designed to meet the electrical, mechanical and environmental performance requirements specification. Unless otherwise specified, all tests are performed at ambient environmental conditions.

General Purpose Tweezers

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3.6V/400mAh

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