No alignment required in production

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No alignment required in production

封装/外壳：16-TSSOP（0.173"，4.40mm 宽） 包装：托盘 描述：RF RX FSK 868MHZ/915MHZ 16TSSOP RF/IF，射频/中频和 RFID 射频接收器

封装/外壳：16-TSSOP（0.173"，4.40mm 宽） 包装：托盘 描述：IC RF/IF，射频/中频和 RFID 射频接收器

N-Channel 30-V (D-S) MOSFET with Schottky Diode

N-Channel 30-V (D-S) MOSFET with Schottky Diode

文件：134.71 Kbytes Page：7 Pages

4mW, 180MHz, 2000V/Us High Speed Buffer

GENERAL DESCRIPTION The CLM4122 family are low power, high speed unity gain buffers that slew at 2000V/µs, having a small signal bandwidth of 180MHz, delivers 60mA, yet draws only 800µA supply current. FEATURES • High Slew Rate. . . . . . . . . . . . . . . . . . . . . . . . . . 2000V/µs • Wide

4mW, 180MHz, 2000V/Us High Speed Buffer

GENERAL DESCRIPTION The CLM4122 family are low power, high speed unity gain buffers that slew at 2000V/µs, having a small signal bandwidth of 180MHz, delivers 60mA, yet draws only 800µA supply current. FEATURES • High Slew Rate. . . . . . . . . . . . . . . . . . . . . . . . . . 2000V/µs • Wide

Single/Dual/Quad, Low-Cost, SOT23, Low-Power, Rail-to-Rail I/O Op Amps

General Description The MAX4322/MAX4323/MAX4326/MAX4327/MAX4329 family of operational amplifiers combines wide bandwidth and excellent DC accuracy with Rail-to-Rail® operation at the inputs and outputs. These devices consume only 650µA per amplifier and operate from either a single supply (2.4V t

Single/Dual/Quad, Low-Cost, SOT23, Low-Power, Rail-to-Rail I/O Op Amps

General Description The MAX4322/MAX4323/MAX4326/MAX4327/MAX4329 family of operational amplifiers combines wide bandwidth and excellent DC accuracy with Rail-to-Rail® operation at the inputs and outputs. These devices consume only 650µA per amplifier and operate from either a single supply (2.4V t

Silicon NPN(PNP) epitaxial planer transistor

Silicon NPN epitaxial planer transistor (Tr1) Silicon PNP epitaxial planer transistor (Tr2) For switching/digital circuits ■ Features ● Two elements incorporated into one package. (Transistors with built-in resistor) ● Reduction of the mounting area and assembly cost by one half.