High Power Surface Mount Chip Resistors

Ceramic Singlelayer DC Disc Capacitors for General Purpose

FEATURES • High capacitance with small size • High stability • Crimp and straight lead styles • Material categorization: for definitions of compliance please see www.vishay.com/doc?99912 APPLICATIONS • Temperature compensation • Coupling and decoupling • Bypassing

Ceramic Singlelayer DC Disc Capacitors for General Purpose

FEATURES • High capacitance with small size • High stability • Crimp and straight lead styles • Material categorization: for definitions of compliance please see www.vishay.com/doc?99912 APPLICATIONS • Temperature compensation • Coupling and decoupling • Bypassing

Ceramic Singlelayer DC Disc Capacitors for General Purpose

FEATURES • High capacitance with small size • High stability • Crimp and straight lead styles • Material categorization: for definitions of compliance please see www.vishay.com/doc?99912 APPLICATIONS • Temperature compensation • Coupling and decoupling • Bypassing

Ceramic Singlelayer DC Disc Capacitors for General Purpose

FEATURES • High capacitance with small size • High stability • Crimp and straight lead styles • Material categorization: for definitions of compliance please see www.vishay.com/doc?99912 APPLICATIONS • Temperature compensation • Coupling and decoupling • Bypassing

Ceramic Singlelayer DC Disc Capacitors for General Purpose

FEATURES • High capacitance with small size • High stability • Crimp and straight lead styles • Material categorization: for definitions of compliance please see www.vishay.com/doc?99912 APPLICATIONS • Temperature compensation • Coupling and decoupling • Bypassing

Ceramic Singlelayer DC Disc Capacitors for General Purpose

FEATURES • High capacitance with small size • High stability • Crimp and straight lead styles • Material categorization: for definitions of compliance please see www.vishay.com/doc?99912 APPLICATIONS • Temperature compensation • Coupling and decoupling • Bypassing

Dual 1 Form A/B, C Solid State Relay

Dual 1 Form A/B, C Solid State Relay DESCRIPTION The LH1512 relays contain normally open and normally closed switches that can be used independently as a 1 form A and 1 form B relay, or when used together, as a 1 form C relay. The relays are constructed as a mult.-chip hybrid device. Act

NorthenLite??G.lite BiCMOS Analog Front-End Circuit

GENERAL DESCRIPTION The STLC1512 G.lite line driver chip contains the line driver as well as part of the receive path required in a central office G.lite modem. It provides an interface between the AFE chip (STLC1511) and the telephone line. The line driver chip has been designed with low power c

TURBOSWITCH E ULTRA-FAST HIGH VOLTAGE DIODE

DESCRIPTION TURBOSWITCH 1200V drastically cuts losses in all high voltage operations which require extremely fast, soft and noise-free power diodes. Due to thei optimized switching performances they also highly decrease power losses in any associated switching IGBT or MOSFET in all freewheel mode

TURBOSWITCH E ULTRA-FAST HIGH VOLTAGE DIODE

DESCRIPTION TURBOSWITCH 1200V drastically cuts losses in all high voltage operations which require extremely fast, soft and noise-free power diodes. Due to thei optimized switching performances they also highly decrease power losses in any associated switching IGBT or MOSFET in all freewheel mode

TURBOSWITCH E ULTRA-FAST HIGH VOLTAGE DIODE

DESCRIPTION TURBOSWITCH 1200V drastically cuts losses in all high voltage operations which require extremely fast, soft and noise-free power diodes. Due to thei optimized switching performances they also highly decrease power losses in any associated switching IGBT or MOSFET in all freewheel mode