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R5F2127价格
参考价格：￥14.3255
型号：R5F21274SNFP#V2 品牌：Renesas 备注：这里有R5F2127多少钱，2025年最近7天走势，今日出价，今日竞价，R5F2127批发/采购报价，R5F2127行情走势销售排行榜，R5F2127报价。| 型号 | 功能描述 | 生产厂家 企业 | LOGO | 操作 |
|---|---|---|---|---|
R5F2127 | RENESAS 16-BIT SINGLE-CHIP MCU R8C FAMILY / R8C/2x SERIES Overview These MCUs are fabricated using a high-performance silicon gate CMOS process, embedding the R8C CPU core, and are packaged in a 32-pin molded-plastic LQFP. It implements sophisticated instructions for a high level of instruction efficiency. With 1 Mbyte of address space, they are capab | RENESAS 瑞萨 |   | |
R5F2127 | SINGLE-CHIP 16-BIT CMOS MCU Overview These MCUs are fabricated using a high-performance silicon gate CMOS process, embedding the R8C CPU core, and are packaged in a 32-pin molded-plastic LQFP. It implements sophisticated instructions for a high level of instruction efficiency. With 1 Mbyte of address space, they are capab | RENESAS 瑞萨 | | |
R5F2127 | RENESAS MCU 文件：589.36 Kbytes Page：58 Pages | RENESAS 瑞萨 | | |
RENESAS 16-BIT SINGLE-CHIP MCU R8C FAMILY / R8C/2x SERIES Overview These MCUs are fabricated using a high-performance silicon gate CMOS process, embedding the R8C CPU core, and are packaged in a 32-pin molded-plastic LQFP. It implements sophisticated instructions for a high level of instruction efficiency. With 1 Mbyte of address space, they are capab | RENESAS 瑞萨 | | ||
SINGLE-CHIP 16-BIT CMOS MCU Overview These MCUs are fabricated using a high-performance silicon gate CMOS process, embedding the R8C CPU core, and are packaged in a 32-pin molded-plastic LQFP. It implements sophisticated instructions for a high level of instruction efficiency. With 1 Mbyte of address space, they are capab | RENESAS 瑞萨 | | ||
SINGLE-CHIP 16-BIT CMOS MCU Overview These MCUs are fabricated using a high-performance silicon gate CMOS process, embedding the R8C CPU core, and are packaged in a 32-pin molded-plastic LQFP. It implements sophisticated instructions for a high level of instruction efficiency. With 1 Mbyte of address space, they are capab | RENESAS 瑞萨 | | ||
RENESAS 16-BIT SINGLE-CHIP MCU R8C FAMILY / R8C/2x SERIES Overview These MCUs are fabricated using a high-performance silicon gate CMOS process, embedding the R8C CPU core, and are packaged in a 32-pin molded-plastic LQFP. It implements sophisticated instructions for a high level of instruction efficiency. With 1 Mbyte of address space, they are capab | RENESAS 瑞萨 | | ||
RENESAS 16-BIT SINGLE-CHIP MCU R8C FAMILY / R8C/2x SERIES Overview These MCUs are fabricated using a high-performance silicon gate CMOS process, embedding the R8C CPU core, and are packaged in a 32-pin molded-plastic LQFP. It implements sophisticated instructions for a high level of instruction efficiency. With 1 Mbyte of address space, they are capab | RENESAS 瑞萨 | | ||
SINGLE-CHIP 16-BIT CMOS MCU Overview These MCUs are fabricated using a high-performance silicon gate CMOS process, embedding the R8C CPU core, and are packaged in a 32-pin molded-plastic LQFP. It implements sophisticated instructions for a high level of instruction efficiency. With 1 Mbyte of address space, they are capab | RENESAS 瑞萨 | | ||
SINGLE-CHIP 16-BIT CMOS MCU Overview These MCUs are fabricated using a high-performance silicon gate CMOS process, embedding the R8C CPU core, and are packaged in a 32-pin molded-plastic LQFP. It implements sophisticated instructions for a high level of instruction efficiency. With 1 Mbyte of address space, they are capab | RENESAS 瑞萨 | | ||
RENESAS 16-BIT SINGLE-CHIP MCU R8C FAMILY / R8C/2x SERIES Overview These MCUs are fabricated using a high-performance silicon gate CMOS process, embedding the R8C CPU core, and are packaged in a 32-pin molded-plastic LQFP. It implements sophisticated instructions for a high level of instruction efficiency. With 1 Mbyte of address space, they are capab | RENESAS 瑞萨 | | ||
SINGLE-CHIP 16-BIT CMOS MCU Overview These MCUs are fabricated using a high-performance silicon gate CMOS process, embedding the R8C CPU core, and are packaged in a 32-pin molded-plastic LQFP. It implements sophisticated instructions for a high level of instruction efficiency. With 1 Mbyte of address space, they are capab | RENESAS 瑞萨 | | ||
RENESAS 16-BIT SINGLE-CHIP MCU R8C FAMILY / R8C/2x SERIES Overview These MCUs are fabricated using a high-performance silicon gate CMOS process, embedding the R8C CPU core, and are packaged in a 32-pin molded-plastic LQFP. It implements sophisticated instructions for a high level of instruction efficiency. With 1 Mbyte of address space, they are capab | RENESAS 瑞萨 | | ||
RENESAS 16-BIT SINGLE-CHIP MCU R8C FAMILY / R8C/2x SERIES Overview These MCUs are fabricated using a high-performance silicon gate CMOS process, embedding the R8C CPU core, and are packaged in a 32-pin molded-plastic LQFP. It implements sophisticated instructions for a high level of instruction efficiency. With 1 Mbyte of address space, they are capab | RENESAS 瑞萨 | | ||
SINGLE-CHIP 16-BIT CMOS MCU Overview These MCUs are fabricated using a high-performance silicon gate CMOS process, embedding the R8C CPU core, and are packaged in a 32-pin molded-plastic LQFP. It implements sophisticated instructions for a high level of instruction efficiency. With 1 Mbyte of address space, they are capab | RENESAS 瑞萨 | | ||
SINGLE-CHIP 16-BIT CMOS MCU Overview These MCUs are fabricated using a high-performance silicon gate CMOS process, embedding the R8C CPU core, and are packaged in a 32-pin molded-plastic LQFP. It implements sophisticated instructions for a high level of instruction efficiency. With 1 Mbyte of address space, they are capab | RENESAS 瑞萨 | | ||
RENESAS 16-BIT SINGLE-CHIP MCU R8C FAMILY / R8C/2x SERIES Overview These MCUs are fabricated using a high-performance silicon gate CMOS process, embedding the R8C CPU core, and are packaged in a 32-pin molded-plastic LQFP. It implements sophisticated instructions for a high level of instruction efficiency. With 1 Mbyte of address space, they are capab | RENESAS 瑞萨 | | ||
RENESAS 16-BIT SINGLE-CHIP MCU R8C FAMILY / R8C/2x SERIES Overview These MCUs are fabricated using a high-performance silicon gate CMOS process, embedding the R8C CPU core, and are packaged in a 32-pin molded-plastic LQFP. It implements sophisticated instructions for a high level of instruction efficiency. With 1 Mbyte of address space, they are capab | RENESAS 瑞萨 | | ||
SINGLE-CHIP 16-BIT CMOS MCU Overview These MCUs are fabricated using a high-performance silicon gate CMOS process, embedding the R8C CPU core, and are packaged in a 32-pin molded-plastic LQFP. It implements sophisticated instructions for a high level of instruction efficiency. With 1 Mbyte of address space, they are capab | RENESAS 瑞萨 | | ||
SINGLE-CHIP 16-BIT CMOS MCU Overview These MCUs are fabricated using a high-performance silicon gate CMOS process, embedding the R8C CPU core, and are packaged in a 32-pin molded-plastic LQFP. It implements sophisticated instructions for a high level of instruction efficiency. With 1 Mbyte of address space, they are capab | RENESAS 瑞萨 | | ||
RENESAS 16-BIT SINGLE-CHIP MCU R8C FAMILY / R8C/2x SERIES Overview These MCUs are fabricated using a high-performance silicon gate CMOS process, embedding the R8C CPU core, and are packaged in a 32-pin molded-plastic LQFP. It implements sophisticated instructions for a high level of instruction efficiency. With 1 Mbyte of address space, they are capab | RENESAS 瑞萨 | | ||
RENESAS 16-BIT SINGLE-CHIP MCU R8C FAMILY / R8C/2x SERIES Overview These MCUs are fabricated using a high-performance silicon gate CMOS process, embedding the R8C CPU core, and are packaged in a 32-pin molded-plastic LQFP. It implements sophisticated instructions for a high level of instruction efficiency. With 1 Mbyte of address space, they are capab | RENESAS 瑞萨 | | ||
SINGLE-CHIP 16-BIT CMOS MCU Overview These MCUs are fabricated using a high-performance silicon gate CMOS process, embedding the R8C CPU core, and are packaged in a 32-pin molded-plastic LQFP. It implements sophisticated instructions for a high level of instruction efficiency. With 1 Mbyte of address space, they are capab | RENESAS 瑞萨 | | ||
SINGLE-CHIP 16-BIT CMOS MCU Overview These MCUs are fabricated using a high-performance silicon gate CMOS process, embedding the R8C CPU core, and are packaged in a 32-pin molded-plastic LQFP. It implements sophisticated instructions for a high level of instruction efficiency. With 1 Mbyte of address space, they are capab | RENESAS 瑞萨 | | ||
RENESAS 16-BIT SINGLE-CHIP MCU R8C FAMILY / R8C/2x SERIES Overview These MCUs are fabricated using a high-performance silicon gate CMOS process, embedding the R8C CPU core, and are packaged in a 32-pin molded-plastic LQFP. It implements sophisticated instructions for a high level of instruction efficiency. With 1 Mbyte of address space, they are capab | RENESAS 瑞萨 | | ||
RENESAS 16-BIT SINGLE-CHIP MCU R8C FAMILY / R8C/2x SERIES Overview These MCUs are fabricated using a high-performance silicon gate CMOS process, embedding the R8C CPU core, and are packaged in a 32-pin molded-plastic LQFP. It implements sophisticated instructions for a high level of instruction efficiency. With 1 Mbyte of address space, they are capab | RENESAS 瑞萨 | | ||
SINGLE-CHIP 16-BIT CMOS MCU Overview These MCUs are fabricated using a high-performance silicon gate CMOS process, embedding the R8C CPU core, and are packaged in a 32-pin molded-plastic LQFP. It implements sophisticated instructions for a high level of instruction efficiency. With 1 Mbyte of address space, they are capab | RENESAS 瑞萨 | | ||
RENESAS 16-BIT SINGLE-CHIP MCU R8C FAMILY / R8C/2x SERIES Overview These MCUs are fabricated using a high-performance silicon gate CMOS process, embedding the R8C CPU core, and are packaged in a 32-pin molded-plastic LQFP. It implements sophisticated instructions for a high level of instruction efficiency. With 1 Mbyte of address space, they are capab | RENESAS 瑞萨 | | ||
SINGLE-CHIP 16-BIT CMOS MCU Overview These MCUs are fabricated using a high-performance silicon gate CMOS process, embedding the R8C CPU core, and are packaged in a 32-pin molded-plastic LQFP. It implements sophisticated instructions for a high level of instruction efficiency. With 1 Mbyte of address space, they are capab | RENESAS 瑞萨 | | ||
SINGLE-CHIP 16-BIT CMOS MCU Overview These MCUs are fabricated using a high-performance silicon gate CMOS process, embedding the R8C CPU core, and are packaged in a 32-pin molded-plastic LQFP. It implements sophisticated instructions for a high level of instruction efficiency. With 1 Mbyte of address space, they are capab | RENESAS 瑞萨 | | ||
RENESAS 16-BIT SINGLE-CHIP MCU R8C FAMILY / R8C/2x SERIES Overview These MCUs are fabricated using a high-performance silicon gate CMOS process, embedding the R8C CPU core, and are packaged in a 32-pin molded-plastic LQFP. It implements sophisticated instructions for a high level of instruction efficiency. With 1 Mbyte of address space, they are capab | RENESAS 瑞萨 | | ||
SINGLE-CHIP 16-BIT CMOS MCU Overview These MCUs are fabricated using a high-performance silicon gate CMOS process, embedding the R8C CPU core, and are packaged in a 32-pin molded-plastic LQFP. It implements sophisticated instructions for a high level of instruction efficiency. With 1 Mbyte of address space, they are capab | RENESAS 瑞萨 | | ||
RENESAS 16-BIT SINGLE-CHIP MCU R8C FAMILY / R8C/2x SERIES Overview These MCUs are fabricated using a high-performance silicon gate CMOS process, embedding the R8C CPU core, and are packaged in a 32-pin molded-plastic LQFP. It implements sophisticated instructions for a high level of instruction efficiency. With 1 Mbyte of address space, they are capab | RENESAS 瑞萨 | | ||
SINGLE-CHIP 16-BIT CMOS MCU Overview These MCUs are fabricated using a high-performance silicon gate CMOS process, embedding the R8C CPU core, and are packaged in a 32-pin molded-plastic LQFP. It implements sophisticated instructions for a high level of instruction efficiency. With 1 Mbyte of address space, they are capab | RENESAS 瑞萨 | | ||
RENESAS 16-BIT SINGLE-CHIP MCU R8C FAMILY / R8C/2x SERIES Overview These MCUs are fabricated using a high-performance silicon gate CMOS process, embedding the R8C CPU core, and are packaged in a 32-pin molded-plastic LQFP. It implements sophisticated instructions for a high level of instruction efficiency. With 1 Mbyte of address space, they are capab | RENESAS 瑞萨 | | ||
SINGLE-CHIP 16-BIT CMOS MCU Overview These MCUs are fabricated using a high-performance silicon gate CMOS process, embedding the R8C CPU core, and are packaged in a 32-pin molded-plastic LQFP. It implements sophisticated instructions for a high level of instruction efficiency. With 1 Mbyte of address space, they are capab | RENESAS 瑞萨 | | ||
RENESAS 16-BIT SINGLE-CHIP MCU R8C FAMILY / R8C/2x SERIES Overview These MCUs are fabricated using a high-performance silicon gate CMOS process, embedding the R8C CPU core, and are packaged in a 32-pin molded-plastic LQFP. It implements sophisticated instructions for a high level of instruction efficiency. With 1 Mbyte of address space, they are capab | RENESAS 瑞萨 | | ||
RENESAS 16-BIT SINGLE-CHIP MCU R8C FAMILY / R8C/2x SERIES Overview These MCUs are fabricated using a high-performance silicon gate CMOS process, embedding the R8C CPU core, and are packaged in a 32-pin molded-plastic LQFP. It implements sophisticated instructions for a high level of instruction efficiency. With 1 Mbyte of address space, they are capab | RENESAS 瑞萨 | | ||
SINGLE-CHIP 16-BIT CMOS MCU Overview These MCUs are fabricated using a high-performance silicon gate CMOS process, embedding the R8C CPU core, and are packaged in a 32-pin molded-plastic LQFP. It implements sophisticated instructions for a high level of instruction efficiency. With 1 Mbyte of address space, they are capab | RENESAS 瑞萨 | | ||
RENESAS 16-BIT SINGLE-CHIP MCU R8C FAMILY / R8C/2x SERIES Overview These MCUs are fabricated using a high-performance silicon gate CMOS process, embedding the R8C CPU core, and are packaged in a 32-pin molded-plastic LQFP. It implements sophisticated instructions for a high level of instruction efficiency. With 1 Mbyte of address space, they are capab | RENESAS 瑞萨 | | ||
SINGLE-CHIP 16-BIT CMOS MCU Overview These MCUs are fabricated using a high-performance silicon gate CMOS process, embedding the R8C CPU core, and are packaged in a 32-pin molded-plastic LQFP. It implements sophisticated instructions for a high level of instruction efficiency. With 1 Mbyte of address space, they are capab | RENESAS 瑞萨 | | ||
RENESAS 16-BIT SINGLE-CHIP MCU R8C FAMILY / R8C/2x SERIES Overview These MCUs are fabricated using a high-performance silicon gate CMOS process, embedding the R8C CPU core, and are packaged in a 32-pin molded-plastic LQFP. It implements sophisticated instructions for a high level of instruction efficiency. With 1 Mbyte of address space, they are capab | RENESAS 瑞萨 | | ||
SINGLE-CHIP 16-BIT CMOS MCU Overview These MCUs are fabricated using a high-performance silicon gate CMOS process, embedding the R8C CPU core, and are packaged in a 32-pin molded-plastic LQFP. It implements sophisticated instructions for a high level of instruction efficiency. With 1 Mbyte of address space, they are capab | RENESAS 瑞萨 | | ||
RENESAS 16-BIT SINGLE-CHIP MCU R8C FAMILY / R8C/2x SERIES Overview These MCUs are fabricated using a high-performance silicon gate CMOS process, embedding the R8C CPU core, and are packaged in a 32-pin molded-plastic LQFP. It implements sophisticated instructions for a high level of instruction efficiency. With 1 Mbyte of address space, they are capab | RENESAS 瑞萨 | | ||
SINGLE-CHIP 16-BIT CMOS MCU Overview These MCUs are fabricated using a high-performance silicon gate CMOS process, embedding the R8C CPU core, and are packaged in a 32-pin molded-plastic LQFP. It implements sophisticated instructions for a high level of instruction efficiency. With 1 Mbyte of address space, they are capab | RENESAS 瑞萨 | | ||
RENESAS 16-BIT SINGLE-CHIP MCU R8C FAMILY / R8C/2x SERIES Overview These MCUs are fabricated using a high-performance silicon gate CMOS process, embedding the R8C CPU core, and are packaged in a 32-pin molded-plastic LQFP. It implements sophisticated instructions for a high level of instruction efficiency. With 1 Mbyte of address space, they are capab | RENESAS 瑞萨 | | ||
SINGLE-CHIP 16-BIT CMOS MCU Overview These MCUs are fabricated using a high-performance silicon gate CMOS process, embedding the R8C CPU core, and are packaged in a 32-pin molded-plastic LQFP. It implements sophisticated instructions for a high level of instruction efficiency. With 1 Mbyte of address space, they are capab | RENESAS 瑞萨 | | ||
RENESAS 16-BIT SINGLE-CHIP MCU R8C FAMILY / R8C/2x SERIES Overview These MCUs are fabricated using a high-performance silicon gate CMOS process, embedding the R8C CPU core, and are packaged in a 32-pin molded-plastic LQFP. It implements sophisticated instructions for a high level of instruction efficiency. With 1 Mbyte of address space, they are capab | RENESAS 瑞萨 | | ||
SINGLE-CHIP 16-BIT CMOS MCU Overview These MCUs are fabricated using a high-performance silicon gate CMOS process, embedding the R8C CPU core, and are packaged in a 32-pin molded-plastic LQFP. It implements sophisticated instructions for a high level of instruction efficiency. With 1 Mbyte of address space, they are capab | RENESAS 瑞萨 | | ||
RENESAS 16-BIT SINGLE-CHIP MCU R8C FAMILY / R8C/2x SERIES Overview These MCUs are fabricated using a high-performance silicon gate CMOS process, embedding the R8C CPU core, and are packaged in a 32-pin molded-plastic LQFP. It implements sophisticated instructions for a high level of instruction efficiency. With 1 Mbyte of address space, they are capab | RENESAS 瑞萨 | | ||
SINGLE-CHIP 16-BIT CMOS MCU Overview These MCUs are fabricated using a high-performance silicon gate CMOS process, embedding the R8C CPU core, and are packaged in a 32-pin molded-plastic LQFP. It implements sophisticated instructions for a high level of instruction efficiency. With 1 Mbyte of address space, they are capab | RENESAS 瑞萨 | | ||
RENESAS 16-BIT SINGLE-CHIP MCU R8C FAMILY / R8C/2x SERIES Overview These MCUs are fabricated using a high-performance silicon gate CMOS process, embedding the R8C CPU core, and are packaged in a 32-pin molded-plastic LQFP. It implements sophisticated instructions for a high level of instruction efficiency. With 1 Mbyte of address space, they are capab | RENESAS 瑞萨 | | ||
Microcontrollers and Microprocessors | RENESAS 瑞萨 | | ||
Microcontrollers and Microprocessors | RENESAS 瑞萨 | | ||
Microcontrollers and Microprocessors | RENESAS 瑞萨 | |
R5F2127产品属性
- 类型
描述
- 型号
R5F2127
- 制造商
Renesas Electronics Corporation
| IC供应商 | 芯片型号 | 品牌 | 批号 | 封装 | 库存 | 备注 | 价格 |
|---|---|---|---|---|---|---|---|
Renesas(瑞萨) |
24+ |
标准封装 |
7602 |
支持大陆交货,美金交易。原装现货库存。 |
|||
RENESAS/瑞萨 |
25+ |
QFP32 |
32360 |
RENESAS/瑞萨全新特价R5F21276SYFP#X6即刻询购立享优惠#长期有货 |
|||
RENESAS |
23+ |
QFP32 |
750 |
正规渠道,只有原装! |
|||
RENESER |
23+ |
QFP |
2644 |
原厂原装正品 |
|||
RENESAS |
2024+ |
N/A |
70000 |
柒号只做原装 现货价秒杀全网 |
|||
RENESAS |
2年内 |
NA |
15000 |
英博尔原装优质现货订货渠道商 |
|||
Renesas(瑞萨) |
23+ |
原厂封装 |
32078 |
10年以上分销商,原装进口件,服务型企业 |
|||
RENESAS |
25+ |
3 |
公司现货库存 |
||||
RENESAS/瑞萨 |
NEW |
LQFP32 |
25000 |
全新原装正品,价格优势,长期供应,量大可订 |
|||
Renesas(瑞萨) |
24+ |
LQFP-32(7x7) |
7768 |
原厂可订货,技术支持,直接渠道。可签保供合同 |
R5F2127芯片相关品牌
R5F2127规格书下载地址
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R5F2127数据表相关新闻
R5F10TPJCJFB#12
进口代理
2025-8-8R5F2136CSNFP#50
品 牌： RENESAS(瑞萨)/IDT 厂家型号： R5F2136CSNFP#50 商品编号： C2056804 封装： LQFP-64(10x10) 数据手册： 下载文件 商品毛重： 0.001克(g) 包装方式： 编带
2021-9-26R5F10CLDJFB#V2 瑞智芯 只有原装
深圳市瑞智芯科技有限公司 联系人：彭先生 QQ：2851196982 直线：0755-82991809 手机：13787628849 邮箱：pc@szruizhixin.com 型号：R5F10CLDJFB#V2 类别 集成电路（IC） 嵌入式 - 微控制器 制造商 Renesas Electronics America Inc 包装：160
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https://hch01.114ic.com/
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2020-4-29
DdatasheetPDF页码索引
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