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R5F2126价格
参考价格：￥18.4555
型号：R5F21264SNFP#V2 品牌：Renesas 备注：这里有R5F2126多少钱，2025年最近7天走势，今日出价，今日竞价，R5F2126批发/采购报价，R5F2126行情走势销售排行榜，R5F2126报价。| 型号 | 功能描述 | 生产厂家 企业 | LOGO | 操作 |
|---|---|---|---|---|
SINGLE-CHIP 16-BIT CMOS MCU Overview These MCUs are fabricated using a high-performance silicon gate CMOS process, embedding the R8C CPU core, and are packaged in a 32-pin molded-plastic LQFP. It implements sophisticated instructions for a high level of instruction efficiency. With 1 Mbyte of address space, they are capab | RENESAS 瑞萨 |   | ||
RENESAS 16-BIT SINGLE-CHIP MCU R8C FAMILY / R8C/2x SERIES Overview These MCUs are fabricated using a high-performance silicon gate CMOS process, embedding the R8C CPU core, and are packaged in a 32-pin molded-plastic LQFP. It implements sophisticated instructions for a high level of instruction efficiency. With 1 Mbyte of address space, they are capab | RENESAS 瑞萨 | | ||
SINGLE-CHIP 16-BIT CMOS MCU Overview These MCUs are fabricated using a high-performance silicon gate CMOS process, embedding the R8C CPU core, and are packaged in a 32-pin molded-plastic LQFP. It implements sophisticated instructions for a high level of instruction efficiency. With 1 Mbyte of address space, they are capab | RENESAS 瑞萨 | | ||
RENESAS 16-BIT SINGLE-CHIP MCU R8C FAMILY / R8C/2x SERIES Overview These MCUs are fabricated using a high-performance silicon gate CMOS process, embedding the R8C CPU core, and are packaged in a 32-pin molded-plastic LQFP. It implements sophisticated instructions for a high level of instruction efficiency. With 1 Mbyte of address space, they are capab | RENESAS 瑞萨 | | ||
RENESAS 16-BIT SINGLE-CHIP MCU R8C FAMILY / R8C/2x SERIES Overview These MCUs are fabricated using a high-performance silicon gate CMOS process, embedding the R8C CPU core, and are packaged in a 32-pin molded-plastic LQFP. It implements sophisticated instructions for a high level of instruction efficiency. With 1 Mbyte of address space, they are capab | RENESAS 瑞萨 | | ||
SINGLE-CHIP 16-BIT CMOS MCU Overview These MCUs are fabricated using a high-performance silicon gate CMOS process, embedding the R8C CPU core, and are packaged in a 32-pin molded-plastic LQFP. It implements sophisticated instructions for a high level of instruction efficiency. With 1 Mbyte of address space, they are capab | RENESAS 瑞萨 | | ||
SINGLE-CHIP 16-BIT CMOS MCU Overview These MCUs are fabricated using a high-performance silicon gate CMOS process, embedding the R8C CPU core, and are packaged in a 32-pin molded-plastic LQFP. It implements sophisticated instructions for a high level of instruction efficiency. With 1 Mbyte of address space, they are capab | RENESAS 瑞萨 | | ||
RENESAS 16-BIT SINGLE-CHIP MCU R8C FAMILY / R8C/2x SERIES Overview These MCUs are fabricated using a high-performance silicon gate CMOS process, embedding the R8C CPU core, and are packaged in a 32-pin molded-plastic LQFP. It implements sophisticated instructions for a high level of instruction efficiency. With 1 Mbyte of address space, they are capab | RENESAS 瑞萨 | | ||
SINGLE-CHIP 16-BIT CMOS MCU Overview These MCUs are fabricated using a high-performance silicon gate CMOS process, embedding the R8C CPU core, and are packaged in a 32-pin molded-plastic LQFP. It implements sophisticated instructions for a high level of instruction efficiency. With 1 Mbyte of address space, they are capab | RENESAS 瑞萨 | | ||
RENESAS 16-BIT SINGLE-CHIP MCU R8C FAMILY / R8C/2x SERIES Overview These MCUs are fabricated using a high-performance silicon gate CMOS process, embedding the R8C CPU core, and are packaged in a 32-pin molded-plastic LQFP. It implements sophisticated instructions for a high level of instruction efficiency. With 1 Mbyte of address space, they are capab | RENESAS 瑞萨 | | ||
RENESAS 16-BIT SINGLE-CHIP MCU R8C FAMILY / R8C/2x SERIES Overview These MCUs are fabricated using a high-performance silicon gate CMOS process, embedding the R8C CPU core, and are packaged in a 32-pin molded-plastic LQFP. It implements sophisticated instructions for a high level of instruction efficiency. With 1 Mbyte of address space, they are capab | RENESAS 瑞萨 | | ||
SINGLE-CHIP 16-BIT CMOS MCU Overview These MCUs are fabricated using a high-performance silicon gate CMOS process, embedding the R8C CPU core, and are packaged in a 32-pin molded-plastic LQFP. It implements sophisticated instructions for a high level of instruction efficiency. With 1 Mbyte of address space, they are capab | RENESAS 瑞萨 | | ||
SINGLE-CHIP 16-BIT CMOS MCU Overview These MCUs are fabricated using a high-performance silicon gate CMOS process, embedding the R8C CPU core, and are packaged in a 32-pin molded-plastic LQFP. It implements sophisticated instructions for a high level of instruction efficiency. With 1 Mbyte of address space, they are capab | RENESAS 瑞萨 | | ||
RENESAS 16-BIT SINGLE-CHIP MCU R8C FAMILY / R8C/2x SERIES Overview These MCUs are fabricated using a high-performance silicon gate CMOS process, embedding the R8C CPU core, and are packaged in a 32-pin molded-plastic LQFP. It implements sophisticated instructions for a high level of instruction efficiency. With 1 Mbyte of address space, they are capab | RENESAS 瑞萨 | | ||
SINGLE-CHIP 16-BIT CMOS MCU Overview These MCUs are fabricated using a high-performance silicon gate CMOS process, embedding the R8C CPU core, and are packaged in a 32-pin molded-plastic LQFP. It implements sophisticated instructions for a high level of instruction efficiency. With 1 Mbyte of address space, they are capab | RENESAS 瑞萨 | | ||
RENESAS 16-BIT SINGLE-CHIP MCU R8C FAMILY / R8C/2x SERIES Overview These MCUs are fabricated using a high-performance silicon gate CMOS process, embedding the R8C CPU core, and are packaged in a 32-pin molded-plastic LQFP. It implements sophisticated instructions for a high level of instruction efficiency. With 1 Mbyte of address space, they are capab | RENESAS 瑞萨 | | ||
SINGLE-CHIP 16-BIT CMOS MCU Overview These MCUs are fabricated using a high-performance silicon gate CMOS process, embedding the R8C CPU core, and are packaged in a 32-pin molded-plastic LQFP. It implements sophisticated instructions for a high level of instruction efficiency. With 1 Mbyte of address space, they are capab | RENESAS 瑞萨 | | ||
RENESAS 16-BIT SINGLE-CHIP MCU R8C FAMILY / R8C/2x SERIES Overview These MCUs are fabricated using a high-performance silicon gate CMOS process, embedding the R8C CPU core, and are packaged in a 32-pin molded-plastic LQFP. It implements sophisticated instructions for a high level of instruction efficiency. With 1 Mbyte of address space, they are capab | RENESAS 瑞萨 | | ||
RENESAS 16-BIT SINGLE-CHIP MCU R8C FAMILY / R8C/2x SERIES Overview These MCUs are fabricated using a high-performance silicon gate CMOS process, embedding the R8C CPU core, and are packaged in a 32-pin molded-plastic LQFP. It implements sophisticated instructions for a high level of instruction efficiency. With 1 Mbyte of address space, they are capab | RENESAS 瑞萨 | | ||
SINGLE-CHIP 16-BIT CMOS MCU Overview These MCUs are fabricated using a high-performance silicon gate CMOS process, embedding the R8C CPU core, and are packaged in a 32-pin molded-plastic LQFP. It implements sophisticated instructions for a high level of instruction efficiency. With 1 Mbyte of address space, they are capab | RENESAS 瑞萨 | | ||
SINGLE-CHIP 16-BIT CMOS MCU Overview These MCUs are fabricated using a high-performance silicon gate CMOS process, embedding the R8C CPU core, and are packaged in a 32-pin molded-plastic LQFP. It implements sophisticated instructions for a high level of instruction efficiency. With 1 Mbyte of address space, they are capab | RENESAS 瑞萨 | | ||
RENESAS 16-BIT SINGLE-CHIP MCU R8C FAMILY / R8C/2x SERIES Overview These MCUs are fabricated using a high-performance silicon gate CMOS process, embedding the R8C CPU core, and are packaged in a 32-pin molded-plastic LQFP. It implements sophisticated instructions for a high level of instruction efficiency. With 1 Mbyte of address space, they are capab | RENESAS 瑞萨 | | ||
RENESAS 16-BIT SINGLE-CHIP MCU R8C FAMILY / R8C/2x SERIES Overview These MCUs are fabricated using a high-performance silicon gate CMOS process, embedding the R8C CPU core, and are packaged in a 32-pin molded-plastic LQFP. It implements sophisticated instructions for a high level of instruction efficiency. With 1 Mbyte of address space, they are capab | RENESAS 瑞萨 | | ||
SINGLE-CHIP 16-BIT CMOS MCU Overview These MCUs are fabricated using a high-performance silicon gate CMOS process, embedding the R8C CPU core, and are packaged in a 32-pin molded-plastic LQFP. It implements sophisticated instructions for a high level of instruction efficiency. With 1 Mbyte of address space, they are capab | RENESAS 瑞萨 | | ||
RENESAS 16-BIT SINGLE-CHIP MCU R8C FAMILY / R8C/2x SERIES Overview These MCUs are fabricated using a high-performance silicon gate CMOS process, embedding the R8C CPU core, and are packaged in a 32-pin molded-plastic LQFP. It implements sophisticated instructions for a high level of instruction efficiency. With 1 Mbyte of address space, they are capab | RENESAS 瑞萨 | | ||
SINGLE-CHIP 16-BIT CMOS MCU Overview These MCUs are fabricated using a high-performance silicon gate CMOS process, embedding the R8C CPU core, and are packaged in a 32-pin molded-plastic LQFP. It implements sophisticated instructions for a high level of instruction efficiency. With 1 Mbyte of address space, they are capab | RENESAS 瑞萨 | | ||
SINGLE-CHIP 16-BIT CMOS MCU Overview These MCUs are fabricated using a high-performance silicon gate CMOS process, embedding the R8C CPU core, and are packaged in a 32-pin molded-plastic LQFP. It implements sophisticated instructions for a high level of instruction efficiency. With 1 Mbyte of address space, they are capab | RENESAS 瑞萨 | | ||
RENESAS 16-BIT SINGLE-CHIP MCU R8C FAMILY / R8C/2x SERIES Overview These MCUs are fabricated using a high-performance silicon gate CMOS process, embedding the R8C CPU core, and are packaged in a 32-pin molded-plastic LQFP. It implements sophisticated instructions for a high level of instruction efficiency. With 1 Mbyte of address space, they are capab | RENESAS 瑞萨 | | ||
SINGLE-CHIP 16-BIT CMOS MCU Overview These MCUs are fabricated using a high-performance silicon gate CMOS process, embedding the R8C CPU core, and are packaged in a 32-pin molded-plastic LQFP. It implements sophisticated instructions for a high level of instruction efficiency. With 1 Mbyte of address space, they are capab | RENESAS 瑞萨 | | ||
RENESAS 16-BIT SINGLE-CHIP MCU R8C FAMILY / R8C/2x SERIES Overview These MCUs are fabricated using a high-performance silicon gate CMOS process, embedding the R8C CPU core, and are packaged in a 32-pin molded-plastic LQFP. It implements sophisticated instructions for a high level of instruction efficiency. With 1 Mbyte of address space, they are capab | RENESAS 瑞萨 | | ||
RENESAS 16-BIT SINGLE-CHIP MCU R8C FAMILY / R8C/2x SERIES Overview These MCUs are fabricated using a high-performance silicon gate CMOS process, embedding the R8C CPU core, and are packaged in a 32-pin molded-plastic LQFP. It implements sophisticated instructions for a high level of instruction efficiency. With 1 Mbyte of address space, they are capab | RENESAS 瑞萨 | | ||
SINGLE-CHIP 16-BIT CMOS MCU Overview These MCUs are fabricated using a high-performance silicon gate CMOS process, embedding the R8C CPU core, and are packaged in a 32-pin molded-plastic LQFP. It implements sophisticated instructions for a high level of instruction efficiency. With 1 Mbyte of address space, they are capab | RENESAS 瑞萨 | | ||
SINGLE-CHIP 16-BIT CMOS MCU Overview These MCUs are fabricated using a high-performance silicon gate CMOS process, embedding the R8C CPU core, and are packaged in a 32-pin molded-plastic LQFP. It implements sophisticated instructions for a high level of instruction efficiency. With 1 Mbyte of address space, they are capab | RENESAS 瑞萨 | | ||
RENESAS 16-BIT SINGLE-CHIP MCU R8C FAMILY / R8C/2x SERIES Overview These MCUs are fabricated using a high-performance silicon gate CMOS process, embedding the R8C CPU core, and are packaged in a 32-pin molded-plastic LQFP. It implements sophisticated instructions for a high level of instruction efficiency. With 1 Mbyte of address space, they are capab | RENESAS 瑞萨 | | ||
SINGLE-CHIP 16-BIT CMOS MCU Overview These MCUs are fabricated using a high-performance silicon gate CMOS process, embedding the R8C CPU core, and are packaged in a 32-pin molded-plastic LQFP. It implements sophisticated instructions for a high level of instruction efficiency. With 1 Mbyte of address space, they are capab | RENESAS 瑞萨 | | ||
RENESAS 16-BIT SINGLE-CHIP MCU R8C FAMILY / R8C/2x SERIES Overview These MCUs are fabricated using a high-performance silicon gate CMOS process, embedding the R8C CPU core, and are packaged in a 32-pin molded-plastic LQFP. It implements sophisticated instructions for a high level of instruction efficiency. With 1 Mbyte of address space, they are capab | RENESAS 瑞萨 | | ||
SINGLE-CHIP 16-BIT CMOS MCU Overview These MCUs are fabricated using a high-performance silicon gate CMOS process, embedding the R8C CPU core, and are packaged in a 32-pin molded-plastic LQFP. It implements sophisticated instructions for a high level of instruction efficiency. With 1 Mbyte of address space, they are capab | RENESAS 瑞萨 | | ||
RENESAS 16-BIT SINGLE-CHIP MCU R8C FAMILY / R8C/2x SERIES Overview These MCUs are fabricated using a high-performance silicon gate CMOS process, embedding the R8C CPU core, and are packaged in a 32-pin molded-plastic LQFP. It implements sophisticated instructions for a high level of instruction efficiency. With 1 Mbyte of address space, they are capab | RENESAS 瑞萨 | | ||
RENESAS 16-BIT SINGLE-CHIP MCU R8C FAMILY / R8C/2x SERIES Overview These MCUs are fabricated using a high-performance silicon gate CMOS process, embedding the R8C CPU core, and are packaged in a 32-pin molded-plastic LQFP. It implements sophisticated instructions for a high level of instruction efficiency. With 1 Mbyte of address space, they are capab | RENESAS 瑞萨 | | ||
SINGLE-CHIP 16-BIT CMOS MCU Overview These MCUs are fabricated using a high-performance silicon gate CMOS process, embedding the R8C CPU core, and are packaged in a 32-pin molded-plastic LQFP. It implements sophisticated instructions for a high level of instruction efficiency. With 1 Mbyte of address space, they are capab | RENESAS 瑞萨 | | ||
RENESAS 16-BIT SINGLE-CHIP MCU R8C FAMILY / R8C/2x SERIES Overview These MCUs are fabricated using a high-performance silicon gate CMOS process, embedding the R8C CPU core, and are packaged in a 32-pin molded-plastic LQFP. It implements sophisticated instructions for a high level of instruction efficiency. With 1 Mbyte of address space, they are capab | RENESAS 瑞萨 | | ||
SINGLE-CHIP 16-BIT CMOS MCU Overview These MCUs are fabricated using a high-performance silicon gate CMOS process, embedding the R8C CPU core, and are packaged in a 32-pin molded-plastic LQFP. It implements sophisticated instructions for a high level of instruction efficiency. With 1 Mbyte of address space, they are capab | RENESAS 瑞萨 | | ||
RENESAS 16-BIT SINGLE-CHIP MCU R8C FAMILY / R8C/2x SERIES Overview These MCUs are fabricated using a high-performance silicon gate CMOS process, embedding the R8C CPU core, and are packaged in a 32-pin molded-plastic LQFP. It implements sophisticated instructions for a high level of instruction efficiency. With 1 Mbyte of address space, they are capab | RENESAS 瑞萨 | | ||
SINGLE-CHIP 16-BIT CMOS MCU Overview These MCUs are fabricated using a high-performance silicon gate CMOS process, embedding the R8C CPU core, and are packaged in a 32-pin molded-plastic LQFP. It implements sophisticated instructions for a high level of instruction efficiency. With 1 Mbyte of address space, they are capab | RENESAS 瑞萨 | | ||
SINGLE-CHIP 16-BIT CMOS MCU Overview These MCUs are fabricated using a high-performance silicon gate CMOS process, embedding the R8C CPU core, and are packaged in a 32-pin molded-plastic LQFP. It implements sophisticated instructions for a high level of instruction efficiency. With 1 Mbyte of address space, they are capab | RENESAS 瑞萨 | | ||
RENESAS 16-BIT SINGLE-CHIP MCU R8C FAMILY / R8C/2x SERIES Overview These MCUs are fabricated using a high-performance silicon gate CMOS process, embedding the R8C CPU core, and are packaged in a 32-pin molded-plastic LQFP. It implements sophisticated instructions for a high level of instruction efficiency. With 1 Mbyte of address space, they are capab | RENESAS 瑞萨 | | ||
SINGLE-CHIP 16-BIT CMOS MCU Overview These MCUs are fabricated using a high-performance silicon gate CMOS process, embedding the R8C CPU core, and are packaged in a 32-pin molded-plastic LQFP. It implements sophisticated instructions for a high level of instruction efficiency. With 1 Mbyte of address space, they are capab | RENESAS 瑞萨 | | ||
RENESAS 16-BIT SINGLE-CHIP MCU R8C FAMILY / R8C/2x SERIES Overview These MCUs are fabricated using a high-performance silicon gate CMOS process, embedding the R8C CPU core, and are packaged in a 32-pin molded-plastic LQFP. It implements sophisticated instructions for a high level of instruction efficiency. With 1 Mbyte of address space, they are capab | RENESAS 瑞萨 | | ||
SINGLE-CHIP 16-BIT CMOS MCU 文件：635.19 Kbytes Page：75 Pages | RENESAS 瑞萨 | | ||
SINGLE-CHIP 16-BIT CMOS MCU | RENESAS 瑞萨 | | ||
SINGLE-CHIP 16-BIT CMOS MCU 文件：635.19 Kbytes Page：75 Pages | RENESAS 瑞萨 | | ||
SINGLE-CHIP 16-BIT CMOS MCU 文件：635.19 Kbytes Page：75 Pages | RENESAS 瑞萨 | | ||
Microcontrollers and Microprocessors | RENESAS 瑞萨 | | ||
Microcontrollers and Microprocessors | RENESAS 瑞萨 | | ||
SINGLE-CHIP 16-BIT CMOS MCU 文件：635.19 Kbytes Page：75 Pages | RENESAS 瑞萨 | | ||
SINGLE-CHIP 16-BIT CMOS MCU 文件：635.19 Kbytes Page：75 Pages | RENESAS 瑞萨 | | ||
SINGLE-CHIP 16-BIT CMOS MCU 文件：635.19 Kbytes Page：75 Pages | RENESAS 瑞萨 | | ||
SINGLE-CHIP 16-BIT CMOS MCU 文件：635.19 Kbytes Page：75 Pages | RENESAS 瑞萨 | | ||
SINGLE-CHIP 16-BIT CMOS MCU 文件：635.19 Kbytes Page：75 Pages | RENESAS 瑞萨 | | ||
SINGLE-CHIP 16-BIT CMOS MCU 文件：635.19 Kbytes Page：75 Pages | RENESAS 瑞萨 | |
R5F2126产品属性
- 类型
描述
- 型号
R5F2126
- 制造商
RENESAS
- 制造商全称
Renesas Technology Corp
- 功能描述
SINGLE-CHIP 16-BIT CMOS MCU
| IC供应商 | 芯片型号 | 品牌 | 批号 | 封装 | 库存 | 备注 | 价格 |
|---|---|---|---|---|---|---|---|
RENESAS/瑞萨 |
24+ |
QFP |
7671 |
原装正品.优势专营 |
|||
RENESAS/瑞萨 |
24+ |
QFP |
47186 |
郑重承诺只做原装进口现货 |
|||
RENESAS/瑞萨 |
24+ |
QFP-32 |
16900 |
原装正品现货支持实单 |
|||
RENESAS |
24+ |
QFP |
30000 |
一级代理原装现货假一罚十 |
|||
RENESAS |
1923+ |
BGAQFP |
1680 |
只做进口原装!假一罚十!绝对有货! |
|||
RENESAS |
11+ |
QFP32 |
26 |
一级代理,专注军工、汽车、医疗、工业、新能源、电力 |
|||
RENESAS |
QFP |
22+ |
6000 |
十年配单,只做原装 |
|||
RENESAS |
2023+ |
LQFP32 |
8800 |
正品渠道现货 终端可提供BOM表配单。 |
|||
RENESAS/瑞萨 |
22+ |
QFP-32 |
20000 |
公司只做原装 品质保障 |
|||
Renesas(瑞萨) |
24+ |
32000 |
全新原厂原装正品现货,低价出售,实单可谈 |
R5F2126芯片相关品牌
R5F2126规格书下载地址
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R5F2126数据表相关新闻
R5F10TPJCJFB#12
进口代理
2025-8-8R5F2136CSNFP#50
品 牌： RENESAS(瑞萨)/IDT 厂家型号： R5F2136CSNFP#50 商品编号： C2056804 封装： LQFP-64(10x10) 数据手册： 下载文件 商品毛重： 0.001克(g) 包装方式： 编带
2021-9-26R5F10CLDJFB#V2 瑞智芯 只有原装
深圳市瑞智芯科技有限公司 联系人：彭先生 QQ：2851196982 直线：0755-82991809 手机：13787628849 邮箱：pc@szruizhixin.com 型号：R5F10CLDJFB#V2 类别 集成电路（IC） 嵌入式 - 微控制器 制造商 Renesas Electronics America Inc 包装：160
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https://hch01.114ic.com/
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2020-4-29
DdatasheetPDF页码索引
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