650 V, 10 A SiC Schottky diode in DPAK R2P for automotive applications

General description Nexperia introduces leading edge Silicon Carbide (SiC) Schottky diode for ultra high performance, low loss, high efficiency power conversion applications. The SiC Schottky diode encapsulated in a Real-2-Pin R2P (TO-252-2) Surface-Mounted Device (SMD) power plastic package of

650 V, 10 A SiC Schottky diode in DPAK R2P for automotive applications

Customer Specification

Construction Diameters (In) 1) Component 1 5 X 1 COND a) Conductor 16 (19/.0117) AWG Tinned Copper 0.059 b) Insulation 0.032 Wall, Nom. PVC 0.123 (1) Color Code Alpha Wire Color Code F Cond Color Cond Color Cond Color 1 BLACK 3 RED 5 ORANGE 2 WHITE 4 GREEN 2) Cable Assembly 5 Components C

Customer Specification

Construction Diameters (In) 1) Component 1 5 X 1 COND a) Conductor 16 (19/.0117) AWG Tinned Copper 0.059 b) Insulation 0.032 Wall, Nom. PVC 0.123 (1) Color Code Alpha Wire Color Code F Cond Color Cond Color Cond Color 1 BLACK 3 RED 5 ORANGE 2 WHITE 4 GREEN 2) Cable Assembly 5 Components C

Heyco® Liquid Tight Strain Relief Bushings

The Ultimate in Snap-In Strain Relief Protection Snap-in, Low Profile Design allows for Pre-assembled Cables • These low profile co-molded nylon and elastomer parts function as a Liquid Tight Strain Relief with a cable. • cULus approved under UL 514B. • Low profile design: height above pan

IEC Appliance Inlet C18 with Fuseholder 1-pole

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IEC Appliance Inlet C18 with Fuseholder 1-pole

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