PIC32价格

参考价格:¥893.5707

型号:PIC32-MAXI-WEB 品牌:Olimex 备注:这里有PIC32多少钱,2026年最近7天走势,今日出价,今日竞价,PIC32批发/采购报价,PIC32行情走势销售排行榜,PIC32报价。
型号 功能描述 生产厂家 企业 LOGO 操作
PIC32

PIC32 Microcontroller Families With USB, CAN and Ethernet

文件:1.13035 Mbytes Page:6 Pages

MICROCHIP

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PIC32

PIC32 Microcontroller Families With USB, CAN and Ethernet

MICROCHIP

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PIC32

USB Starter Kit III User’s Guide

文件:531.14 Kbytes Page:33 Pages

MICROCHIP

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Ultra-Low Power, Secure and Enhanced Touch MCU

Operating Conditions • 1.62V - 3.63V, -40ºC to +125ºC, DC to 40 MHz (PIC32CM LE00/LS00) • 1.62V - 3.63V, -40ºC to +85ºC, DC to 48 MHz (PIC32CM LE00/LS00) • 2.0V - 3.63V, -40ºC to +85ºC, DC to 48 MHz (PIC32CM LS60) Core • Arm® Cortex®-M23 CPU running at up to 48 MHz: – 2.64 CoreMark/MHz and 1

MICROCHIP

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Ultra-Low Power, Secure and Enhanced Touch MCU

Operating Conditions • 1.62V - 3.63V, -40ºC to +125ºC, DC to 40 MHz (PIC32CM LE00/LS00) • 1.62V - 3.63V, -40ºC to +85ºC, DC to 48 MHz (PIC32CM LE00/LS00) • 2.0V - 3.63V, -40ºC to +85ºC, DC to 48 MHz (PIC32CM LS60) Core • Arm® Cortex®-M23 CPU running at up to 48 MHz: – 2.64 CoreMark/MHz and 1

MICROCHIP

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Ultra-Low Power, Secure and Enhanced Touch MCU

Operating Conditions • 1.62V - 3.63V, -40ºC to +125ºC, DC to 40 MHz (PIC32CM LE00/LS00) • 1.62V - 3.63V, -40ºC to +85ºC, DC to 48 MHz (PIC32CM LE00/LS00) • 2.0V - 3.63V, -40ºC to +85ºC, DC to 48 MHz (PIC32CM LS60) Core • Arm® Cortex®-M23 CPU running at up to 48 MHz: – 2.64 CoreMark/MHz and 1

MICROCHIP

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Ultra-Low Power, Secure and Enhanced Touch MCU

Operating Conditions • 1.62V - 3.63V, -40ºC to +125ºC, DC to 40 MHz (PIC32CM LE00/LS00) • 1.62V - 3.63V, -40ºC to +85ºC, DC to 48 MHz (PIC32CM LE00/LS00) • 2.0V - 3.63V, -40ºC to +85ºC, DC to 48 MHz (PIC32CM LS60) Core • Arm® Cortex®-M23 CPU running at up to 48 MHz: – 2.64 CoreMark/MHz and 1

MICROCHIP

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Ultra-Low Power, Secure and Enhanced Touch MCU

Operating Conditions • 1.62V - 3.63V, -40ºC to +125ºC, DC to 40 MHz (PIC32CM LE00/LS00) • 1.62V - 3.63V, -40ºC to +85ºC, DC to 48 MHz (PIC32CM LE00/LS00) • 2.0V - 3.63V, -40ºC to +85ºC, DC to 48 MHz (PIC32CM LS60) Core • Arm® Cortex®-M23 CPU running at up to 48 MHz: – 2.64 CoreMark/MHz and 1

MICROCHIP

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Ultra-Low Power, Secure and Enhanced Touch MCU

Operating Conditions • 1.62V - 3.63V, -40ºC to +125ºC, DC to 40 MHz (PIC32CM LE00/LS00) • 1.62V - 3.63V, -40ºC to +85ºC, DC to 48 MHz (PIC32CM LE00/LS00) • 2.0V - 3.63V, -40ºC to +85ºC, DC to 48 MHz (PIC32CM LS60) Core • Arm® Cortex®-M23 CPU running at up to 48 MHz: – 2.64 CoreMark/MHz and 1

MICROCHIP

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Ultra-Low Power, Secure and Enhanced Touch MCU

Operating Conditions • 1.62V - 3.63V, -40ºC to +125ºC, DC to 40 MHz (PIC32CM LE00/LS00) • 1.62V - 3.63V, -40ºC to +85ºC, DC to 48 MHz (PIC32CM LE00/LS00) • 2.0V - 3.63V, -40ºC to +85ºC, DC to 48 MHz (PIC32CM LS60) Core • Arm® Cortex®-M23 CPU running at up to 48 MHz: – 2.64 CoreMark/MHz and 1

MICROCHIP

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Ultra-Low Power, Secure and Enhanced Touch MCU

Operating Conditions • 1.62V - 3.63V, -40ºC to +125ºC, DC to 40 MHz (PIC32CM LE00/LS00) • 1.62V - 3.63V, -40ºC to +85ºC, DC to 48 MHz (PIC32CM LE00/LS00) • 2.0V - 3.63V, -40ºC to +85ºC, DC to 48 MHz (PIC32CM LS60) Core • Arm® Cortex®-M23 CPU running at up to 48 MHz: – 2.64 CoreMark/MHz and 1

MICROCHIP

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Ultra-Low Power, Secure and Enhanced Touch MCU

Operating Conditions • 1.62V - 3.63V, -40ºC to +125ºC, DC to 40 MHz (PIC32CM LE00/LS00) • 1.62V - 3.63V, -40ºC to +85ºC, DC to 48 MHz (PIC32CM LE00/LS00) • 2.0V - 3.63V, -40ºC to +85ºC, DC to 48 MHz (PIC32CM LS60) Core • Arm® Cortex®-M23 CPU running at up to 48 MHz: – 2.64 CoreMark/MHz and 1

MICROCHIP

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Ultra-Low Power, Secure and Enhanced Touch MCU

Operating Conditions • 1.62V - 3.63V, -40ºC to +125ºC, DC to 40 MHz (PIC32CM LE00/LS00) • 1.62V - 3.63V, -40ºC to +85ºC, DC to 48 MHz (PIC32CM LE00/LS00) • 2.0V - 3.63V, -40ºC to +85ºC, DC to 48 MHz (PIC32CM LS60) Core • Arm® Cortex®-M23 CPU running at up to 48 MHz: – 2.64 CoreMark/MHz and 1

MICROCHIP

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Ultra-Low Power, Secure and Enhanced Touch MCU

Operating Conditions • 1.62V - 3.63V, -40ºC to +125ºC, DC to 40 MHz (PIC32CM LE00/LS00) • 1.62V - 3.63V, -40ºC to +85ºC, DC to 48 MHz (PIC32CM LE00/LS00) • 2.0V - 3.63V, -40ºC to +85ºC, DC to 48 MHz (PIC32CM LS60) Core • Arm® Cortex®-M23 CPU running at up to 48 MHz: – 2.64 CoreMark/MHz and 1

MICROCHIP

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Ultra-Low Power, Secure and Enhanced Touch MCU

Operating Conditions • 1.62V - 3.63V, -40ºC to +125ºC, DC to 40 MHz (PIC32CM LE00/LS00) • 1.62V - 3.63V, -40ºC to +85ºC, DC to 48 MHz (PIC32CM LE00/LS00) • 2.0V - 3.63V, -40ºC to +85ºC, DC to 48 MHz (PIC32CM LS60) Core • Arm® Cortex®-M23 CPU running at up to 48 MHz: – 2.64 CoreMark/MHz and 1

MICROCHIP

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Ultra-Low Power, Secure and Enhanced Touch MCU

Operating Conditions • 1.62V - 3.63V, -40ºC to +125ºC, DC to 40 MHz (PIC32CM LE00/LS00) • 1.62V - 3.63V, -40ºC to +85ºC, DC to 48 MHz (PIC32CM LE00/LS00) • 2.0V - 3.63V, -40ºC to +85ºC, DC to 48 MHz (PIC32CM LS60) Core • Arm® Cortex®-M23 CPU running at up to 48 MHz: – 2.64 CoreMark/MHz and 1

MICROCHIP

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Ultra-Low Power, Secure and Enhanced Touch MCU

Operating Conditions • 1.62V - 3.63V, -40ºC to +125ºC, DC to 40 MHz (PIC32CM LE00/LS00) • 1.62V - 3.63V, -40ºC to +85ºC, DC to 48 MHz (PIC32CM LE00/LS00) • 2.0V - 3.63V, -40ºC to +85ºC, DC to 48 MHz (PIC32CM LS60) Core • Arm® Cortex®-M23 CPU running at up to 48 MHz: – 2.64 CoreMark/MHz and 1

MICROCHIP

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Ultra-Low Power, Secure and Enhanced Touch MCU

Operating Conditions • 1.62V - 3.63V, -40ºC to +125ºC, DC to 40 MHz (PIC32CM LE00/LS00) • 1.62V - 3.63V, -40ºC to +85ºC, DC to 48 MHz (PIC32CM LE00/LS00) • 2.0V - 3.63V, -40ºC to +85ºC, DC to 48 MHz (PIC32CM LS60) Core • Arm® Cortex®-M23 CPU running at up to 48 MHz: – 2.64 CoreMark/MHz and 1

MICROCHIP

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Ultra-Low Power, Secure and Enhanced Touch MCU

Operating Conditions • 1.62V - 3.63V, -40ºC to +125ºC, DC to 40 MHz (PIC32CM LE00/LS00) • 1.62V - 3.63V, -40ºC to +85ºC, DC to 48 MHz (PIC32CM LE00/LS00) • 2.0V - 3.63V, -40ºC to +85ºC, DC to 48 MHz (PIC32CM LS60) Core • Arm® Cortex®-M23 CPU running at up to 48 MHz: – 2.64 CoreMark/MHz and 1

MICROCHIP

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Ultra-Low Power, Secure and Enhanced Touch MCU

Operating Conditions • 1.62V - 3.63V, -40ºC to +125ºC, DC to 40 MHz (PIC32CM LE00/LS00) • 1.62V - 3.63V, -40ºC to +85ºC, DC to 48 MHz (PIC32CM LE00/LS00) • 2.0V - 3.63V, -40ºC to +85ºC, DC to 48 MHz (PIC32CM LS60) Core • Arm® Cortex®-M23 CPU running at up to 48 MHz: – 2.64 CoreMark/MHz and 1

MICROCHIP

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Ultra-Low Power, Secure and Enhanced Touch MCU

Operating Conditions • 1.62V - 3.63V, -40ºC to +125ºC, DC to 40 MHz (PIC32CM LE00/LS00) • 1.62V - 3.63V, -40ºC to +85ºC, DC to 48 MHz (PIC32CM LE00/LS00) • 2.0V - 3.63V, -40ºC to +85ºC, DC to 48 MHz (PIC32CM LS60) Core • Arm® Cortex®-M23 CPU running at up to 48 MHz: – 2.64 CoreMark/MHz and 1

MICROCHIP

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Ultra-Low Power, Secure and Enhanced Touch MCU

Operating Conditions • 1.62V - 3.63V, -40ºC to +125ºC, DC to 40 MHz (PIC32CM LE00/LS00) • 1.62V - 3.63V, -40ºC to +85ºC, DC to 48 MHz (PIC32CM LE00/LS00) • 2.0V - 3.63V, -40ºC to +85ºC, DC to 48 MHz (PIC32CM LS60) Core • Arm® Cortex®-M23 CPU running at up to 48 MHz: – 2.64 CoreMark/MHz and 1

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Advanced Security and Features Set MCU

Operating Conditions (PIC32CX SG41) • 1.71V - 3.63V, -40°C to +85°C, DC to 120 MHz • 1.71V - 3.63V, -40°C to +125°C, DC to 100 MHz Operating Conditions (PIC32CX SG60/SG61) • 2.7V - 3.63V, -40°C to +85°C, DC to 120 MHz • 2.7V - 3.63V, -40°C to +125°C, DC to 100 MHz Core: • Arm® Cortex®-M4F C

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RNBD451 Bluetooth® Low Energy Module Data Sheet

Features • Fully-certified Bluetooth Low Energy Module • Compact Form Factor • On-board Bluetooth 5.2 Low Energy Stack • ASCII Command Interface API over UART • ASCII Commands are Backward Compatible with RN487x Family of Modules • Definable Beacon Feature to Make Various Beacons, such as iB

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RNBD451 Bluetooth® Low Energy Module Data Sheet

Features • Fully-certified Bluetooth Low Energy Module • Compact Form Factor • On-board Bluetooth 5.2 Low Energy Stack • ASCII Command Interface API over UART • ASCII Commands are Backward Compatible with RN487x Family of Modules • Definable Beacon Feature to Make Various Beacons, such as iB

MICROCHIP

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Advanced Security and Features Set MCU

Operating Conditions (PIC32CX SG41) • 1.71V - 3.63V, -40°C to +85°C, DC to 120 MHz • 1.71V - 3.63V, -40°C to +125°C, DC to 100 MHz Operating Conditions (PIC32CX SG60/SG61) • 2.7V - 3.63V, -40°C to +85°C, DC to 120 MHz • 2.7V - 3.63V, -40°C to +125°C, DC to 100 MHz Core: • Arm® Cortex®-M4F C

MICROCHIP

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32-bit Connectivity MCU with Integrated Security

Operating Conditions • VDDREG - 1.75V - 1.85V, -40°C to +85°C, DC to 300 MHz • VDDIO/AVDD - 1.75V – 3.63V, -40°C to +85°C, DC to 300 MHz Communication Interfaces • Up to 10 Serial Communication Interfaces (SERCOM), USART, I2C, SPI : – 16 byte transmit receive buffers – Baud Rate generator (B

MICROCHIP

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32-bit Connectivity MCU with Integrated Security

Operating Conditions • VDDREG - 1.75V - 1.85V, -40°C to +85°C, DC to 300 MHz • VDDIO/AVDD - 1.75V – 3.63V, -40°C to +85°C, DC to 300 MHz Communication Interfaces • Up to 10 Serial Communication Interfaces (SERCOM), USART, I2C, SPI : – 16 byte transmit receive buffers – Baud Rate generator (B

MICROCHIP

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32-bit Connectivity MCU with Integrated Security

Operating Conditions • VDDREG - 1.75V - 1.85V, -40°C to +85°C, DC to 300 MHz • VDDIO/AVDD - 1.75V – 3.63V, -40°C to +85°C, DC to 300 MHz Communication Interfaces • Up to 10 Serial Communication Interfaces (SERCOM), USART, I2C, SPI : – 16 byte transmit receive buffers – Baud Rate generator (B

MICROCHIP

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32-bit Connectivity MCU with Integrated Security

Operating Conditions • VDDREG - 1.75V - 1.85V, -40°C to +85°C, DC to 300 MHz • VDDIO/AVDD - 1.75V – 3.63V, -40°C to +85°C, DC to 300 MHz Communication Interfaces • Up to 10 Serial Communication Interfaces (SERCOM), USART, I2C, SPI : – 16 byte transmit receive buffers – Baud Rate generator (B

MICROCHIP

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32-bit Connectivity MCU with Integrated Security

Operating Conditions • VDDREG - 1.75V - 1.85V, -40°C to +85°C, DC to 300 MHz • VDDIO/AVDD - 1.75V – 3.63V, -40°C to +85°C, DC to 300 MHz Communication Interfaces • Up to 10 Serial Communication Interfaces (SERCOM), USART, I2C, SPI : – 16 byte transmit receive buffers – Baud Rate generator (B

MICROCHIP

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32-bit Connectivity MCU with Integrated Security

Operating Conditions • VDDREG - 1.75V - 1.85V, -40°C to +85°C, DC to 300 MHz • VDDIO/AVDD - 1.75V – 3.63V, -40°C to +85°C, DC to 300 MHz Communication Interfaces • Up to 10 Serial Communication Interfaces (SERCOM), USART, I2C, SPI : – 16 byte transmit receive buffers – Baud Rate generator (B

MICROCHIP

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32-bit Connectivity MCU with Integrated Security

Operating Conditions • VDDREG - 1.75V - 1.85V, -40°C to +85°C, DC to 300 MHz • VDDIO/AVDD - 1.75V – 3.63V, -40°C to +85°C, DC to 300 MHz Communication Interfaces • Up to 10 Serial Communication Interfaces (SERCOM), USART, I2C, SPI : – 16 byte transmit receive buffers – Baud Rate generator (B

MICROCHIP

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32-bit Connectivity MCU with Integrated Security

Operating Conditions • VDDREG - 1.75V - 1.85V, -40°C to +85°C, DC to 300 MHz • VDDIO/AVDD - 1.75V – 3.63V, -40°C to +85°C, DC to 300 MHz Communication Interfaces • Up to 10 Serial Communication Interfaces (SERCOM), USART, I2C, SPI : – 16 byte transmit receive buffers – Baud Rate generator (B

MICROCHIP

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32-bit Connectivity MCU with Integrated Security

Operating Conditions • VDDREG - 1.75V - 1.85V, -40°C to +85°C, DC to 300 MHz • VDDIO/AVDD - 1.75V – 3.63V, -40°C to +85°C, DC to 300 MHz Communication Interfaces • Up to 10 Serial Communication Interfaces (SERCOM), USART, I2C, SPI : – 16 byte transmit receive buffers – Baud Rate generator (B

MICROCHIP

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32-bit Connectivity MCU with Integrated Security

Operating Conditions • VDDREG - 1.75V - 1.85V, -40°C to +85°C, DC to 300 MHz • VDDIO/AVDD - 1.75V – 3.63V, -40°C to +85°C, DC to 300 MHz Communication Interfaces • Up to 10 Serial Communication Interfaces (SERCOM), USART, I2C, SPI : – 16 byte transmit receive buffers – Baud Rate generator (B

MICROCHIP

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32-bit Connectivity MCU with Integrated Security

Operating Conditions • VDDREG - 1.75V - 1.85V, -40°C to +85°C, DC to 300 MHz • VDDIO/AVDD - 1.75V – 3.63V, -40°C to +85°C, DC to 300 MHz Communication Interfaces • Up to 10 Serial Communication Interfaces (SERCOM), USART, I2C, SPI : – 16 byte transmit receive buffers – Baud Rate generator (B

MICROCHIP

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32-bit Connectivity MCU with Integrated Security

Operating Conditions • VDDREG - 1.75V - 1.85V, -40°C to +85°C, DC to 300 MHz • VDDIO/AVDD - 1.75V – 3.63V, -40°C to +85°C, DC to 300 MHz Communication Interfaces • Up to 10 Serial Communication Interfaces (SERCOM), USART, I2C, SPI : – 16 byte transmit receive buffers – Baud Rate generator (B

MICROCHIP

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32-bit Connectivity MCU with Integrated Security

Operating Conditions • VDDREG - 1.75V - 1.85V, -40°C to +85°C, DC to 300 MHz • VDDIO/AVDD - 1.75V – 3.63V, -40°C to +85°C, DC to 300 MHz Communication Interfaces • Up to 10 Serial Communication Interfaces (SERCOM), USART, I2C, SPI : – 16 byte transmit receive buffers – Baud Rate generator (B

MICROCHIP

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32-bit Connectivity MCU with Integrated Security

Operating Conditions • VDDREG - 1.75V - 1.85V, -40°C to +85°C, DC to 300 MHz • VDDIO/AVDD - 1.75V – 3.63V, -40°C to +85°C, DC to 300 MHz Communication Interfaces • Up to 10 Serial Communication Interfaces (SERCOM), USART, I2C, SPI : – 16 byte transmit receive buffers – Baud Rate generator (B

MICROCHIP

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32-bit Connectivity MCU with Integrated Security

Operating Conditions • VDDREG - 1.75V - 1.85V, -40°C to +85°C, DC to 300 MHz • VDDIO/AVDD - 1.75V – 3.63V, -40°C to +85°C, DC to 300 MHz Communication Interfaces • Up to 10 Serial Communication Interfaces (SERCOM), USART, I2C, SPI : – 16 byte transmit receive buffers – Baud Rate generator (B

MICROCHIP

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32-bit Connectivity MCU with Integrated Security

Operating Conditions • VDDREG - 1.75V - 1.85V, -40°C to +85°C, DC to 300 MHz • VDDIO/AVDD - 1.75V – 3.63V, -40°C to +85°C, DC to 300 MHz Communication Interfaces • Up to 10 Serial Communication Interfaces (SERCOM), USART, I2C, SPI : – 16 byte transmit receive buffers – Baud Rate generator (B

MICROCHIP

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32-bit Connectivity MCU with Integrated Security

Operating Conditions • VDDREG - 1.75V - 1.85V, -40°C to +85°C, DC to 300 MHz • VDDIO/AVDD - 1.75V – 3.63V, -40°C to +85°C, DC to 300 MHz Communication Interfaces • Up to 10 Serial Communication Interfaces (SERCOM), USART, I2C, SPI : – 16 byte transmit receive buffers – Baud Rate generator (B

MICROCHIP

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32-bit Connectivity MCU with Integrated Security

Operating Conditions • VDDREG - 1.75V - 1.85V, -40°C to +85°C, DC to 300 MHz • VDDIO/AVDD - 1.75V – 3.63V, -40°C to +85°C, DC to 300 MHz Communication Interfaces • Up to 10 Serial Communication Interfaces (SERCOM), USART, I2C, SPI : – 16 byte transmit receive buffers – Baud Rate generator (B

MICROCHIP

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32-bit Connectivity MCU with Integrated Security

Operating Conditions • VDDREG - 1.75V - 1.85V, -40°C to +85°C, DC to 300 MHz • VDDIO/AVDD - 1.75V – 3.63V, -40°C to +85°C, DC to 300 MHz Communication Interfaces • Up to 10 Serial Communication Interfaces (SERCOM), USART, I2C, SPI : – 16 byte transmit receive buffers – Baud Rate generator (B

MICROCHIP

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32-bit Connectivity MCU with Integrated Security

Operating Conditions • VDDREG - 1.75V - 1.85V, -40°C to +85°C, DC to 300 MHz • VDDIO/AVDD - 1.75V – 3.63V, -40°C to +85°C, DC to 300 MHz Communication Interfaces • Up to 10 Serial Communication Interfaces (SERCOM), USART, I2C, SPI : – 16 byte transmit receive buffers – Baud Rate generator (B

MICROCHIP

微芯科技

32-bit Connectivity MCU with Integrated Security

Operating Conditions • VDDREG - 1.75V - 1.85V, -40°C to +85°C, DC to 300 MHz • VDDIO/AVDD - 1.75V – 3.63V, -40°C to +85°C, DC to 300 MHz Communication Interfaces • Up to 10 Serial Communication Interfaces (SERCOM), USART, I2C, SPI : – 16 byte transmit receive buffers – Baud Rate generator (B

MICROCHIP

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32-bit Connectivity MCU with Integrated Security

Operating Conditions • VDDREG - 1.75V - 1.85V, -40°C to +85°C, DC to 300 MHz • VDDIO/AVDD - 1.75V – 3.63V, -40°C to +85°C, DC to 300 MHz Communication Interfaces • Up to 10 Serial Communication Interfaces (SERCOM), USART, I2C, SPI : – 16 byte transmit receive buffers – Baud Rate generator (B

MICROCHIP

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32-bit Connectivity MCU with Integrated Security

Operating Conditions • VDDREG - 1.75V - 1.85V, -40°C to +85°C, DC to 300 MHz • VDDIO/AVDD - 1.75V – 3.63V, -40°C to +85°C, DC to 300 MHz Communication Interfaces • Up to 10 Serial Communication Interfaces (SERCOM), USART, I2C, SPI : – 16 byte transmit receive buffers – Baud Rate generator (B

MICROCHIP

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32-bit Connectivity MCU with Integrated Security

Operating Conditions • VDDREG - 1.75V - 1.85V, -40°C to +85°C, DC to 300 MHz • VDDIO/AVDD - 1.75V – 3.63V, -40°C to +85°C, DC to 300 MHz Communication Interfaces • Up to 10 Serial Communication Interfaces (SERCOM), USART, I2C, SPI : – 16 byte transmit receive buffers – Baud Rate generator (B

MICROCHIP

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32-Bit Flash Microcontroller with MIPS32® microAptiv™ UC Core with Low Power and Low Pin Count

Microcontroller Features •Low Pin Count Packages, Ranging from 20 to 36 Pins, including UQFN as Small as 4x4 mm •Up to 64K Flash Memory: -20,000 erase/write cycle endurance -20 years minimum data retention -Self-programmable under software control •Up to 8K Data Memory •Pin-Compatible with

MICROCHIP

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32-Bit Flash Microcontroller with MIPS32® microAptiv™ UC Core with Low Power and Low Pin Count

Microcontroller Features •Low Pin Count Packages, Ranging from 20 to 36 Pins, including UQFN as Small as 4x4 mm •Up to 64K Flash Memory: -20,000 erase/write cycle endurance -20 years minimum data retention -Self-programmable under software control •Up to 8K Data Memory •Pin-Compatible with

MICROCHIP

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32-Bit Flash Microcontroller with MIPS32® microAptiv™ UC Core with Low Power and Low Pin Count

Microcontroller Features •Low Pin Count Packages, Ranging from 20 to 36 Pins, including UQFN as Small as 4x4 mm •Up to 64K Flash Memory: -20,000 erase/write cycle endurance -20 years minimum data retention -Self-programmable under software control •Up to 8K Data Memory •Pin-Compatible with

MICROCHIP

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32-Bit Flash Microcontroller with MIPS32® microAptiv™ UC Core with Low Power and Low Pin Count

Microcontroller Features •Low Pin Count Packages, Ranging from 20 to 36 Pins, including UQFN as Small as 4x4 mm •Up to 64K Flash Memory: -20,000 erase/write cycle endurance -20 years minimum data retention -Self-programmable under software control •Up to 8K Data Memory •Pin-Compatible with

MICROCHIP

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32-Bit Flash Microcontroller with MIPS32® microAptiv™ UC Core with Low Power and Low Pin Count

Microcontroller Features •Low Pin Count Packages, Ranging from 20 to 36 Pins, including UQFN as Small as 4x4 mm •Up to 64K Flash Memory: -20,000 erase/write cycle endurance -20 years minimum data retention -Self-programmable under software control •Up to 8K Data Memory •Pin-Compatible with

MICROCHIP

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32-Bit Flash Microcontroller with MIPS32® microAptiv™ UC Core with Low Power and Low Pin Count

Microcontroller Features •Low Pin Count Packages, Ranging from 20 to 36 Pins, including UQFN as Small as 4x4 mm •Up to 64K Flash Memory: -20,000 erase/write cycle endurance -20 years minimum data retention -Self-programmable under software control •Up to 8K Data Memory •Pin-Compatible with

MICROCHIP

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32-Bit Flash Microcontroller with MIPS32® microAptiv™ UC Core with Low Power and Low Pin Count

Microcontroller Features •Low Pin Count Packages, Ranging from 20 to 36 Pins, including UQFN as Small as 4x4 mm •Up to 64K Flash Memory: -20,000 erase/write cycle endurance -20 years minimum data retention -Self-programmable under software control •Up to 8K Data Memory •Pin-Compatible with

MICROCHIP

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32-Bit Flash Microcontroller with MIPS32® microAptiv™ UC Core with Low Power and Low Pin Count

Microcontroller Features •Low Pin Count Packages, Ranging from 20 to 36 Pins, including UQFN as Small as 4x4 mm •Up to 64K Flash Memory: -20,000 erase/write cycle endurance -20 years minimum data retention -Self-programmable under software control •Up to 8K Data Memory •Pin-Compatible with

MICROCHIP

微芯科技

32-Bit Flash Microcontroller with MIPS32® microAptiv™ UC Core with Low Power and Low Pin Count

Microcontroller Features •Low Pin Count Packages, Ranging from 20 to 36 Pins, including UQFN as Small as 4x4 mm •Up to 64K Flash Memory: -20,000 erase/write cycle endurance -20 years minimum data retention -Self-programmable under software control •Up to 8K Data Memory •Pin-Compatible with

MICROCHIP

微芯科技

32-Bit Flash Microcontroller with MIPS32® microAptiv™ UC Core with Low Power and Low Pin Count

Microcontroller Features •Low Pin Count Packages, Ranging from 20 to 36 Pins, including UQFN as Small as 4x4 mm •Up to 64K Flash Memory: -20,000 erase/write cycle endurance -20 years minimum data retention -Self-programmable under software control •Up to 8K Data Memory •Pin-Compatible with

MICROCHIP

微芯科技

PIC32产品属性

  • 类型

    描述

  • 型号

    PIC32

  • 制造商

    MICROCHIP

  • 制造商全称

    Microchip Technology

  • 功能描述

    PIC32 Microcontroller Families With USB, CAN and Ethernet

更新时间:2026-3-17 9:31:00
IC供应商 芯片型号 品牌 批号 封装 库存 备注 价格
MICROCHIP
23+
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10000
全新、原装
MICROCHIP
25+
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18000
原厂授权一级代理,专注军工、汽车、医疗、工业、新能源、电力!
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24+
TQFP-64
860000
明嘉莱只做原装正品现货
MICROCHIP/微芯
24+
VTLA-44
1200
AI芯片,车规MCU原装现货/为新能源汽车电子行业采购保驾护航
MICROCHIP/微芯
21+
TQFP144
3
只做自己库存,全新原装进口正品假一赔百,可开82%增
MICROCHIP/微芯
23+
TQFP100
5555
原装正品,有挂就有19926463211
MICROCHIP/微芯
25+
TQFP-100
32000
MICROCHIP/微芯全新特价PIC32MX575F512L-80I/PT即刻询购立享优惠#长期有
Microchip/微芯
2226
TQFP-64
30
星辰微电只做原装,终端可送样
MICROCHIP/微芯
2025+
NA
5000
原装进口,免费送样品!
MICROCHIP/微芯
2021
TQFP64
2450

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