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PIC32价格
参考价格:¥893.5707
型号:PIC32-MAXI-WEB 品牌:Olimex 备注:这里有PIC32多少钱,2026年最近7天走势,今日出价,今日竞价,PIC32批发/采购报价,PIC32行情走势销售排行榜,PIC32报价。| 型号 | 功能描述 | 生产厂家 企业 | LOGO | 操作 |
|---|---|---|---|---|
PIC32 | PIC32 Microcontroller Families With USB, CAN and Ethernet 文件:1.13035 Mbytes Page:6 Pages | MICROCHIP 微芯科技 | ||
PIC32 | PIC32 Microcontroller Families With USB, CAN and Ethernet | MICROCHIP 微芯科技 | ||
PIC32 | USB Starter Kit III User’s Guide 文件:531.14 Kbytes Page:33 Pages | MICROCHIP 微芯科技 | ||
Ultra-Low Power, Secure and Enhanced Touch MCU Operating Conditions • 1.62V - 3.63V, -40ºC to +125ºC, DC to 40 MHz (PIC32CM LE00/LS00) • 1.62V - 3.63V, -40ºC to +85ºC, DC to 48 MHz (PIC32CM LE00/LS00) • 2.0V - 3.63V, -40ºC to +85ºC, DC to 48 MHz (PIC32CM LS60) Core • Arm® Cortex®-M23 CPU running at up to 48 MHz: – 2.64 CoreMark/MHz and 1 | MICROCHIP 微芯科技 | |||
Ultra-Low Power, Secure and Enhanced Touch MCU Operating Conditions • 1.62V - 3.63V, -40ºC to +125ºC, DC to 40 MHz (PIC32CM LE00/LS00) • 1.62V - 3.63V, -40ºC to +85ºC, DC to 48 MHz (PIC32CM LE00/LS00) • 2.0V - 3.63V, -40ºC to +85ºC, DC to 48 MHz (PIC32CM LS60) Core • Arm® Cortex®-M23 CPU running at up to 48 MHz: – 2.64 CoreMark/MHz and 1 | MICROCHIP 微芯科技 | |||
Ultra-Low Power, Secure and Enhanced Touch MCU Operating Conditions • 1.62V - 3.63V, -40ºC to +125ºC, DC to 40 MHz (PIC32CM LE00/LS00) • 1.62V - 3.63V, -40ºC to +85ºC, DC to 48 MHz (PIC32CM LE00/LS00) • 2.0V - 3.63V, -40ºC to +85ºC, DC to 48 MHz (PIC32CM LS60) Core • Arm® Cortex®-M23 CPU running at up to 48 MHz: – 2.64 CoreMark/MHz and 1 | MICROCHIP 微芯科技 | |||
Ultra-Low Power, Secure and Enhanced Touch MCU Operating Conditions • 1.62V - 3.63V, -40ºC to +125ºC, DC to 40 MHz (PIC32CM LE00/LS00) • 1.62V - 3.63V, -40ºC to +85ºC, DC to 48 MHz (PIC32CM LE00/LS00) • 2.0V - 3.63V, -40ºC to +85ºC, DC to 48 MHz (PIC32CM LS60) Core • Arm® Cortex®-M23 CPU running at up to 48 MHz: – 2.64 CoreMark/MHz and 1 | MICROCHIP 微芯科技 | |||
Ultra-Low Power, Secure and Enhanced Touch MCU Operating Conditions • 1.62V - 3.63V, -40ºC to +125ºC, DC to 40 MHz (PIC32CM LE00/LS00) • 1.62V - 3.63V, -40ºC to +85ºC, DC to 48 MHz (PIC32CM LE00/LS00) • 2.0V - 3.63V, -40ºC to +85ºC, DC to 48 MHz (PIC32CM LS60) Core • Arm® Cortex®-M23 CPU running at up to 48 MHz: – 2.64 CoreMark/MHz and 1 | MICROCHIP 微芯科技 | |||
Ultra-Low Power, Secure and Enhanced Touch MCU Operating Conditions • 1.62V - 3.63V, -40ºC to +125ºC, DC to 40 MHz (PIC32CM LE00/LS00) • 1.62V - 3.63V, -40ºC to +85ºC, DC to 48 MHz (PIC32CM LE00/LS00) • 2.0V - 3.63V, -40ºC to +85ºC, DC to 48 MHz (PIC32CM LS60) Core • Arm® Cortex®-M23 CPU running at up to 48 MHz: – 2.64 CoreMark/MHz and 1 | MICROCHIP 微芯科技 | |||
Ultra-Low Power, Secure and Enhanced Touch MCU Operating Conditions • 1.62V - 3.63V, -40ºC to +125ºC, DC to 40 MHz (PIC32CM LE00/LS00) • 1.62V - 3.63V, -40ºC to +85ºC, DC to 48 MHz (PIC32CM LE00/LS00) • 2.0V - 3.63V, -40ºC to +85ºC, DC to 48 MHz (PIC32CM LS60) Core • Arm® Cortex®-M23 CPU running at up to 48 MHz: – 2.64 CoreMark/MHz and 1 | MICROCHIP 微芯科技 | |||
Ultra-Low Power, Secure and Enhanced Touch MCU Operating Conditions • 1.62V - 3.63V, -40ºC to +125ºC, DC to 40 MHz (PIC32CM LE00/LS00) • 1.62V - 3.63V, -40ºC to +85ºC, DC to 48 MHz (PIC32CM LE00/LS00) • 2.0V - 3.63V, -40ºC to +85ºC, DC to 48 MHz (PIC32CM LS60) Core • Arm® Cortex®-M23 CPU running at up to 48 MHz: – 2.64 CoreMark/MHz and 1 | MICROCHIP 微芯科技 | |||
Ultra-Low Power, Secure and Enhanced Touch MCU Operating Conditions • 1.62V - 3.63V, -40ºC to +125ºC, DC to 40 MHz (PIC32CM LE00/LS00) • 1.62V - 3.63V, -40ºC to +85ºC, DC to 48 MHz (PIC32CM LE00/LS00) • 2.0V - 3.63V, -40ºC to +85ºC, DC to 48 MHz (PIC32CM LS60) Core • Arm® Cortex®-M23 CPU running at up to 48 MHz: – 2.64 CoreMark/MHz and 1 | MICROCHIP 微芯科技 | |||
Ultra-Low Power, Secure and Enhanced Touch MCU Operating Conditions • 1.62V - 3.63V, -40ºC to +125ºC, DC to 40 MHz (PIC32CM LE00/LS00) • 1.62V - 3.63V, -40ºC to +85ºC, DC to 48 MHz (PIC32CM LE00/LS00) • 2.0V - 3.63V, -40ºC to +85ºC, DC to 48 MHz (PIC32CM LS60) Core • Arm® Cortex®-M23 CPU running at up to 48 MHz: – 2.64 CoreMark/MHz and 1 | MICROCHIP 微芯科技 | |||
Ultra-Low Power, Secure and Enhanced Touch MCU Operating Conditions • 1.62V - 3.63V, -40ºC to +125ºC, DC to 40 MHz (PIC32CM LE00/LS00) • 1.62V - 3.63V, -40ºC to +85ºC, DC to 48 MHz (PIC32CM LE00/LS00) • 2.0V - 3.63V, -40ºC to +85ºC, DC to 48 MHz (PIC32CM LS60) Core • Arm® Cortex®-M23 CPU running at up to 48 MHz: – 2.64 CoreMark/MHz and 1 | MICROCHIP 微芯科技 | |||
Ultra-Low Power, Secure and Enhanced Touch MCU Operating Conditions • 1.62V - 3.63V, -40ºC to +125ºC, DC to 40 MHz (PIC32CM LE00/LS00) • 1.62V - 3.63V, -40ºC to +85ºC, DC to 48 MHz (PIC32CM LE00/LS00) • 2.0V - 3.63V, -40ºC to +85ºC, DC to 48 MHz (PIC32CM LS60) Core • Arm® Cortex®-M23 CPU running at up to 48 MHz: – 2.64 CoreMark/MHz and 1 | MICROCHIP 微芯科技 | |||
Ultra-Low Power, Secure and Enhanced Touch MCU Operating Conditions • 1.62V - 3.63V, -40ºC to +125ºC, DC to 40 MHz (PIC32CM LE00/LS00) • 1.62V - 3.63V, -40ºC to +85ºC, DC to 48 MHz (PIC32CM LE00/LS00) • 2.0V - 3.63V, -40ºC to +85ºC, DC to 48 MHz (PIC32CM LS60) Core • Arm® Cortex®-M23 CPU running at up to 48 MHz: – 2.64 CoreMark/MHz and 1 | MICROCHIP 微芯科技 | |||
Ultra-Low Power, Secure and Enhanced Touch MCU Operating Conditions • 1.62V - 3.63V, -40ºC to +125ºC, DC to 40 MHz (PIC32CM LE00/LS00) • 1.62V - 3.63V, -40ºC to +85ºC, DC to 48 MHz (PIC32CM LE00/LS00) • 2.0V - 3.63V, -40ºC to +85ºC, DC to 48 MHz (PIC32CM LS60) Core • Arm® Cortex®-M23 CPU running at up to 48 MHz: – 2.64 CoreMark/MHz and 1 | MICROCHIP 微芯科技 | |||
Ultra-Low Power, Secure and Enhanced Touch MCU Operating Conditions • 1.62V - 3.63V, -40ºC to +125ºC, DC to 40 MHz (PIC32CM LE00/LS00) • 1.62V - 3.63V, -40ºC to +85ºC, DC to 48 MHz (PIC32CM LE00/LS00) • 2.0V - 3.63V, -40ºC to +85ºC, DC to 48 MHz (PIC32CM LS60) Core • Arm® Cortex®-M23 CPU running at up to 48 MHz: – 2.64 CoreMark/MHz and 1 | MICROCHIP 微芯科技 | |||
Ultra-Low Power, Secure and Enhanced Touch MCU Operating Conditions • 1.62V - 3.63V, -40ºC to +125ºC, DC to 40 MHz (PIC32CM LE00/LS00) • 1.62V - 3.63V, -40ºC to +85ºC, DC to 48 MHz (PIC32CM LE00/LS00) • 2.0V - 3.63V, -40ºC to +85ºC, DC to 48 MHz (PIC32CM LS60) Core • Arm® Cortex®-M23 CPU running at up to 48 MHz: – 2.64 CoreMark/MHz and 1 | MICROCHIP 微芯科技 | |||
Ultra-Low Power, Secure and Enhanced Touch MCU Operating Conditions • 1.62V - 3.63V, -40ºC to +125ºC, DC to 40 MHz (PIC32CM LE00/LS00) • 1.62V - 3.63V, -40ºC to +85ºC, DC to 48 MHz (PIC32CM LE00/LS00) • 2.0V - 3.63V, -40ºC to +85ºC, DC to 48 MHz (PIC32CM LS60) Core • Arm® Cortex®-M23 CPU running at up to 48 MHz: – 2.64 CoreMark/MHz and 1 | MICROCHIP 微芯科技 | |||
Ultra-Low Power, Secure and Enhanced Touch MCU Operating Conditions • 1.62V - 3.63V, -40ºC to +125ºC, DC to 40 MHz (PIC32CM LE00/LS00) • 1.62V - 3.63V, -40ºC to +85ºC, DC to 48 MHz (PIC32CM LE00/LS00) • 2.0V - 3.63V, -40ºC to +85ºC, DC to 48 MHz (PIC32CM LS60) Core • Arm® Cortex®-M23 CPU running at up to 48 MHz: – 2.64 CoreMark/MHz and 1 | MICROCHIP 微芯科技 | |||
Ultra-Low Power, Secure and Enhanced Touch MCU Operating Conditions • 1.62V - 3.63V, -40ºC to +125ºC, DC to 40 MHz (PIC32CM LE00/LS00) • 1.62V - 3.63V, -40ºC to +85ºC, DC to 48 MHz (PIC32CM LE00/LS00) • 2.0V - 3.63V, -40ºC to +85ºC, DC to 48 MHz (PIC32CM LS60) Core • Arm® Cortex®-M23 CPU running at up to 48 MHz: – 2.64 CoreMark/MHz and 1 | MICROCHIP 微芯科技 | |||
Advanced Security and Features Set MCU Operating Conditions (PIC32CX SG41) • 1.71V - 3.63V, -40°C to +85°C, DC to 120 MHz • 1.71V - 3.63V, -40°C to +125°C, DC to 100 MHz Operating Conditions (PIC32CX SG60/SG61) • 2.7V - 3.63V, -40°C to +85°C, DC to 120 MHz • 2.7V - 3.63V, -40°C to +125°C, DC to 100 MHz Core: • Arm® Cortex®-M4F C | MICROCHIP 微芯科技 | |||
RNBD451 Bluetooth® Low Energy Module Data Sheet Features • Fully-certified Bluetooth Low Energy Module • Compact Form Factor • On-board Bluetooth 5.2 Low Energy Stack • ASCII Command Interface API over UART • ASCII Commands are Backward Compatible with RN487x Family of Modules • Definable Beacon Feature to Make Various Beacons, such as iB | MICROCHIP 微芯科技 | |||
RNBD451 Bluetooth® Low Energy Module Data Sheet Features • Fully-certified Bluetooth Low Energy Module • Compact Form Factor • On-board Bluetooth 5.2 Low Energy Stack • ASCII Command Interface API over UART • ASCII Commands are Backward Compatible with RN487x Family of Modules • Definable Beacon Feature to Make Various Beacons, such as iB | MICROCHIP 微芯科技 | |||
Advanced Security and Features Set MCU Operating Conditions (PIC32CX SG41) • 1.71V - 3.63V, -40°C to +85°C, DC to 120 MHz • 1.71V - 3.63V, -40°C to +125°C, DC to 100 MHz Operating Conditions (PIC32CX SG60/SG61) • 2.7V - 3.63V, -40°C to +85°C, DC to 120 MHz • 2.7V - 3.63V, -40°C to +125°C, DC to 100 MHz Core: • Arm® Cortex®-M4F C | MICROCHIP 微芯科技 | |||
32-bit Connectivity MCU with Integrated Security Operating Conditions • VDDREG - 1.75V - 1.85V, -40°C to +85°C, DC to 300 MHz • VDDIO/AVDD - 1.75V – 3.63V, -40°C to +85°C, DC to 300 MHz Communication Interfaces • Up to 10 Serial Communication Interfaces (SERCOM), USART, I2C, SPI : – 16 byte transmit receive buffers – Baud Rate generator (B | MICROCHIP 微芯科技 | |||
32-bit Connectivity MCU with Integrated Security Operating Conditions • VDDREG - 1.75V - 1.85V, -40°C to +85°C, DC to 300 MHz • VDDIO/AVDD - 1.75V – 3.63V, -40°C to +85°C, DC to 300 MHz Communication Interfaces • Up to 10 Serial Communication Interfaces (SERCOM), USART, I2C, SPI : – 16 byte transmit receive buffers – Baud Rate generator (B | MICROCHIP 微芯科技 | |||
32-bit Connectivity MCU with Integrated Security Operating Conditions • VDDREG - 1.75V - 1.85V, -40°C to +85°C, DC to 300 MHz • VDDIO/AVDD - 1.75V – 3.63V, -40°C to +85°C, DC to 300 MHz Communication Interfaces • Up to 10 Serial Communication Interfaces (SERCOM), USART, I2C, SPI : – 16 byte transmit receive buffers – Baud Rate generator (B | MICROCHIP 微芯科技 | |||
32-bit Connectivity MCU with Integrated Security Operating Conditions • VDDREG - 1.75V - 1.85V, -40°C to +85°C, DC to 300 MHz • VDDIO/AVDD - 1.75V – 3.63V, -40°C to +85°C, DC to 300 MHz Communication Interfaces • Up to 10 Serial Communication Interfaces (SERCOM), USART, I2C, SPI : – 16 byte transmit receive buffers – Baud Rate generator (B | MICROCHIP 微芯科技 | |||
32-bit Connectivity MCU with Integrated Security Operating Conditions • VDDREG - 1.75V - 1.85V, -40°C to +85°C, DC to 300 MHz • VDDIO/AVDD - 1.75V – 3.63V, -40°C to +85°C, DC to 300 MHz Communication Interfaces • Up to 10 Serial Communication Interfaces (SERCOM), USART, I2C, SPI : – 16 byte transmit receive buffers – Baud Rate generator (B | MICROCHIP 微芯科技 | |||
32-bit Connectivity MCU with Integrated Security Operating Conditions • VDDREG - 1.75V - 1.85V, -40°C to +85°C, DC to 300 MHz • VDDIO/AVDD - 1.75V – 3.63V, -40°C to +85°C, DC to 300 MHz Communication Interfaces • Up to 10 Serial Communication Interfaces (SERCOM), USART, I2C, SPI : – 16 byte transmit receive buffers – Baud Rate generator (B | MICROCHIP 微芯科技 | |||
32-bit Connectivity MCU with Integrated Security Operating Conditions • VDDREG - 1.75V - 1.85V, -40°C to +85°C, DC to 300 MHz • VDDIO/AVDD - 1.75V – 3.63V, -40°C to +85°C, DC to 300 MHz Communication Interfaces • Up to 10 Serial Communication Interfaces (SERCOM), USART, I2C, SPI : – 16 byte transmit receive buffers – Baud Rate generator (B | MICROCHIP 微芯科技 | |||
32-bit Connectivity MCU with Integrated Security Operating Conditions • VDDREG - 1.75V - 1.85V, -40°C to +85°C, DC to 300 MHz • VDDIO/AVDD - 1.75V – 3.63V, -40°C to +85°C, DC to 300 MHz Communication Interfaces • Up to 10 Serial Communication Interfaces (SERCOM), USART, I2C, SPI : – 16 byte transmit receive buffers – Baud Rate generator (B | MICROCHIP 微芯科技 | |||
32-bit Connectivity MCU with Integrated Security Operating Conditions • VDDREG - 1.75V - 1.85V, -40°C to +85°C, DC to 300 MHz • VDDIO/AVDD - 1.75V – 3.63V, -40°C to +85°C, DC to 300 MHz Communication Interfaces • Up to 10 Serial Communication Interfaces (SERCOM), USART, I2C, SPI : – 16 byte transmit receive buffers – Baud Rate generator (B | MICROCHIP 微芯科技 | |||
32-bit Connectivity MCU with Integrated Security Operating Conditions • VDDREG - 1.75V - 1.85V, -40°C to +85°C, DC to 300 MHz • VDDIO/AVDD - 1.75V – 3.63V, -40°C to +85°C, DC to 300 MHz Communication Interfaces • Up to 10 Serial Communication Interfaces (SERCOM), USART, I2C, SPI : – 16 byte transmit receive buffers – Baud Rate generator (B | MICROCHIP 微芯科技 | |||
32-bit Connectivity MCU with Integrated Security Operating Conditions • VDDREG - 1.75V - 1.85V, -40°C to +85°C, DC to 300 MHz • VDDIO/AVDD - 1.75V – 3.63V, -40°C to +85°C, DC to 300 MHz Communication Interfaces • Up to 10 Serial Communication Interfaces (SERCOM), USART, I2C, SPI : – 16 byte transmit receive buffers – Baud Rate generator (B | MICROCHIP 微芯科技 | |||
32-bit Connectivity MCU with Integrated Security Operating Conditions • VDDREG - 1.75V - 1.85V, -40°C to +85°C, DC to 300 MHz • VDDIO/AVDD - 1.75V – 3.63V, -40°C to +85°C, DC to 300 MHz Communication Interfaces • Up to 10 Serial Communication Interfaces (SERCOM), USART, I2C, SPI : – 16 byte transmit receive buffers – Baud Rate generator (B | MICROCHIP 微芯科技 | |||
32-bit Connectivity MCU with Integrated Security Operating Conditions • VDDREG - 1.75V - 1.85V, -40°C to +85°C, DC to 300 MHz • VDDIO/AVDD - 1.75V – 3.63V, -40°C to +85°C, DC to 300 MHz Communication Interfaces • Up to 10 Serial Communication Interfaces (SERCOM), USART, I2C, SPI : – 16 byte transmit receive buffers – Baud Rate generator (B | MICROCHIP 微芯科技 | |||
32-bit Connectivity MCU with Integrated Security Operating Conditions • VDDREG - 1.75V - 1.85V, -40°C to +85°C, DC to 300 MHz • VDDIO/AVDD - 1.75V – 3.63V, -40°C to +85°C, DC to 300 MHz Communication Interfaces • Up to 10 Serial Communication Interfaces (SERCOM), USART, I2C, SPI : – 16 byte transmit receive buffers – Baud Rate generator (B | MICROCHIP 微芯科技 | |||
32-bit Connectivity MCU with Integrated Security Operating Conditions • VDDREG - 1.75V - 1.85V, -40°C to +85°C, DC to 300 MHz • VDDIO/AVDD - 1.75V – 3.63V, -40°C to +85°C, DC to 300 MHz Communication Interfaces • Up to 10 Serial Communication Interfaces (SERCOM), USART, I2C, SPI : – 16 byte transmit receive buffers – Baud Rate generator (B | MICROCHIP 微芯科技 | |||
32-bit Connectivity MCU with Integrated Security Operating Conditions • VDDREG - 1.75V - 1.85V, -40°C to +85°C, DC to 300 MHz • VDDIO/AVDD - 1.75V – 3.63V, -40°C to +85°C, DC to 300 MHz Communication Interfaces • Up to 10 Serial Communication Interfaces (SERCOM), USART, I2C, SPI : – 16 byte transmit receive buffers – Baud Rate generator (B | MICROCHIP 微芯科技 | |||
32-bit Connectivity MCU with Integrated Security Operating Conditions • VDDREG - 1.75V - 1.85V, -40°C to +85°C, DC to 300 MHz • VDDIO/AVDD - 1.75V – 3.63V, -40°C to +85°C, DC to 300 MHz Communication Interfaces • Up to 10 Serial Communication Interfaces (SERCOM), USART, I2C, SPI : – 16 byte transmit receive buffers – Baud Rate generator (B | MICROCHIP 微芯科技 | |||
32-bit Connectivity MCU with Integrated Security Operating Conditions • VDDREG - 1.75V - 1.85V, -40°C to +85°C, DC to 300 MHz • VDDIO/AVDD - 1.75V – 3.63V, -40°C to +85°C, DC to 300 MHz Communication Interfaces • Up to 10 Serial Communication Interfaces (SERCOM), USART, I2C, SPI : – 16 byte transmit receive buffers – Baud Rate generator (B | MICROCHIP 微芯科技 | |||
32-bit Connectivity MCU with Integrated Security Operating Conditions • VDDREG - 1.75V - 1.85V, -40°C to +85°C, DC to 300 MHz • VDDIO/AVDD - 1.75V – 3.63V, -40°C to +85°C, DC to 300 MHz Communication Interfaces • Up to 10 Serial Communication Interfaces (SERCOM), USART, I2C, SPI : – 16 byte transmit receive buffers – Baud Rate generator (B | MICROCHIP 微芯科技 | |||
32-bit Connectivity MCU with Integrated Security Operating Conditions • VDDREG - 1.75V - 1.85V, -40°C to +85°C, DC to 300 MHz • VDDIO/AVDD - 1.75V – 3.63V, -40°C to +85°C, DC to 300 MHz Communication Interfaces • Up to 10 Serial Communication Interfaces (SERCOM), USART, I2C, SPI : – 16 byte transmit receive buffers – Baud Rate generator (B | MICROCHIP 微芯科技 | |||
32-bit Connectivity MCU with Integrated Security Operating Conditions • VDDREG - 1.75V - 1.85V, -40°C to +85°C, DC to 300 MHz • VDDIO/AVDD - 1.75V – 3.63V, -40°C to +85°C, DC to 300 MHz Communication Interfaces • Up to 10 Serial Communication Interfaces (SERCOM), USART, I2C, SPI : – 16 byte transmit receive buffers – Baud Rate generator (B | MICROCHIP 微芯科技 | |||
32-bit Connectivity MCU with Integrated Security Operating Conditions • VDDREG - 1.75V - 1.85V, -40°C to +85°C, DC to 300 MHz • VDDIO/AVDD - 1.75V – 3.63V, -40°C to +85°C, DC to 300 MHz Communication Interfaces • Up to 10 Serial Communication Interfaces (SERCOM), USART, I2C, SPI : – 16 byte transmit receive buffers – Baud Rate generator (B | MICROCHIP 微芯科技 | |||
32-bit Connectivity MCU with Integrated Security Operating Conditions • VDDREG - 1.75V - 1.85V, -40°C to +85°C, DC to 300 MHz • VDDIO/AVDD - 1.75V – 3.63V, -40°C to +85°C, DC to 300 MHz Communication Interfaces • Up to 10 Serial Communication Interfaces (SERCOM), USART, I2C, SPI : – 16 byte transmit receive buffers – Baud Rate generator (B | MICROCHIP 微芯科技 | |||
32-bit Connectivity MCU with Integrated Security Operating Conditions • VDDREG - 1.75V - 1.85V, -40°C to +85°C, DC to 300 MHz • VDDIO/AVDD - 1.75V – 3.63V, -40°C to +85°C, DC to 300 MHz Communication Interfaces • Up to 10 Serial Communication Interfaces (SERCOM), USART, I2C, SPI : – 16 byte transmit receive buffers – Baud Rate generator (B | MICROCHIP 微芯科技 | |||
32-Bit Flash Microcontroller with MIPS32® microAptiv™ UC Core with Low Power and Low Pin Count Microcontroller Features •Low Pin Count Packages, Ranging from 20 to 36 Pins, including UQFN as Small as 4x4 mm •Up to 64K Flash Memory: -20,000 erase/write cycle endurance -20 years minimum data retention -Self-programmable under software control •Up to 8K Data Memory •Pin-Compatible with | MICROCHIP 微芯科技 | |||
32-Bit Flash Microcontroller with MIPS32® microAptiv™ UC Core with Low Power and Low Pin Count Microcontroller Features •Low Pin Count Packages, Ranging from 20 to 36 Pins, including UQFN as Small as 4x4 mm •Up to 64K Flash Memory: -20,000 erase/write cycle endurance -20 years minimum data retention -Self-programmable under software control •Up to 8K Data Memory •Pin-Compatible with | MICROCHIP 微芯科技 | |||
32-Bit Flash Microcontroller with MIPS32® microAptiv™ UC Core with Low Power and Low Pin Count Microcontroller Features •Low Pin Count Packages, Ranging from 20 to 36 Pins, including UQFN as Small as 4x4 mm •Up to 64K Flash Memory: -20,000 erase/write cycle endurance -20 years minimum data retention -Self-programmable under software control •Up to 8K Data Memory •Pin-Compatible with | MICROCHIP 微芯科技 | |||
32-Bit Flash Microcontroller with MIPS32® microAptiv™ UC Core with Low Power and Low Pin Count Microcontroller Features •Low Pin Count Packages, Ranging from 20 to 36 Pins, including UQFN as Small as 4x4 mm •Up to 64K Flash Memory: -20,000 erase/write cycle endurance -20 years minimum data retention -Self-programmable under software control •Up to 8K Data Memory •Pin-Compatible with | MICROCHIP 微芯科技 | |||
32-Bit Flash Microcontroller with MIPS32® microAptiv™ UC Core with Low Power and Low Pin Count Microcontroller Features •Low Pin Count Packages, Ranging from 20 to 36 Pins, including UQFN as Small as 4x4 mm •Up to 64K Flash Memory: -20,000 erase/write cycle endurance -20 years minimum data retention -Self-programmable under software control •Up to 8K Data Memory •Pin-Compatible with | MICROCHIP 微芯科技 | |||
32-Bit Flash Microcontroller with MIPS32® microAptiv™ UC Core with Low Power and Low Pin Count Microcontroller Features •Low Pin Count Packages, Ranging from 20 to 36 Pins, including UQFN as Small as 4x4 mm •Up to 64K Flash Memory: -20,000 erase/write cycle endurance -20 years minimum data retention -Self-programmable under software control •Up to 8K Data Memory •Pin-Compatible with | MICROCHIP 微芯科技 | |||
32-Bit Flash Microcontroller with MIPS32® microAptiv™ UC Core with Low Power and Low Pin Count Microcontroller Features •Low Pin Count Packages, Ranging from 20 to 36 Pins, including UQFN as Small as 4x4 mm •Up to 64K Flash Memory: -20,000 erase/write cycle endurance -20 years minimum data retention -Self-programmable under software control •Up to 8K Data Memory •Pin-Compatible with | MICROCHIP 微芯科技 | |||
32-Bit Flash Microcontroller with MIPS32® microAptiv™ UC Core with Low Power and Low Pin Count Microcontroller Features •Low Pin Count Packages, Ranging from 20 to 36 Pins, including UQFN as Small as 4x4 mm •Up to 64K Flash Memory: -20,000 erase/write cycle endurance -20 years minimum data retention -Self-programmable under software control •Up to 8K Data Memory •Pin-Compatible with | MICROCHIP 微芯科技 | |||
32-Bit Flash Microcontroller with MIPS32® microAptiv™ UC Core with Low Power and Low Pin Count Microcontroller Features •Low Pin Count Packages, Ranging from 20 to 36 Pins, including UQFN as Small as 4x4 mm •Up to 64K Flash Memory: -20,000 erase/write cycle endurance -20 years minimum data retention -Self-programmable under software control •Up to 8K Data Memory •Pin-Compatible with | MICROCHIP 微芯科技 | |||
32-Bit Flash Microcontroller with MIPS32® microAptiv™ UC Core with Low Power and Low Pin Count Microcontroller Features •Low Pin Count Packages, Ranging from 20 to 36 Pins, including UQFN as Small as 4x4 mm •Up to 64K Flash Memory: -20,000 erase/write cycle endurance -20 years minimum data retention -Self-programmable under software control •Up to 8K Data Memory •Pin-Compatible with | MICROCHIP 微芯科技 |
PIC32产品属性
- 类型
描述
- 型号
PIC32
- 制造商
MICROCHIP
- 制造商全称
Microchip Technology
- 功能描述
PIC32 Microcontroller Families With USB, CAN and Ethernet
| IC供应商 | 芯片型号 | 品牌 | 批号 | 封装 | 库存 | 备注 | 价格 |
|---|---|---|---|---|---|---|---|
MICROCHIP |
23+ |
QFN-64 |
10000 |
全新、原装 |
|||
MICROCHIP |
25+ |
TQFP100 |
18000 |
原厂授权一级代理,专注军工、汽车、医疗、工业、新能源、电力! |
|||
MICROCHIP/微芯 |
24+ |
TQFP-64 |
860000 |
明嘉莱只做原装正品现货 |
|||
MICROCHIP/微芯 |
24+ |
VTLA-44 |
1200 |
AI芯片,车规MCU原装现货/为新能源汽车电子行业采购保驾护航 |
|||
MICROCHIP/微芯 |
21+ |
TQFP144 |
3 |
只做自己库存,全新原装进口正品假一赔百,可开82%增 |
|||
MICROCHIP/微芯 |
23+ |
TQFP100 |
5555 |
原装正品,有挂就有19926463211 |
|||
MICROCHIP/微芯 |
25+ |
TQFP-100 |
32000 |
MICROCHIP/微芯全新特价PIC32MX575F512L-80I/PT即刻询购立享优惠#长期有 |
|||
Microchip/微芯 |
2226 |
TQFP-64 |
30 |
星辰微电只做原装,终端可送样 |
|||
MICROCHIP/微芯 |
2025+ |
NA |
5000 |
原装进口,免费送样品! |
|||
MICROCHIP/微芯 |
2021 |
TQFP64 |
2450 |
PIC32规格书下载地址
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- PIC24HF
- PIC24H
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- PIC24FJ
- PIC24FG
- PIC24FD
- PIC24F
- PIC24EF
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PIC32数据表相关新闻
PIC32MK0512MCJ048-E/7MX
PIC32MK0512MCJ048-E/7MX
2023-3-28PIC32CM6408MC00048-I/Y8X
PIC32CM6408MC00048-I/Y8X
2023-3-28PIC24HJ256GP210-I/PF
PIC24HJ256GP210-I/PF
2022-10-19PIC24HJ128GP504-E/PT
PIC24HJ128GP504-E/PT
2022-9-23PIC32CM1216MC00048-I/Y8X
PIC32CM1216MC00048-I/Y8X
2021-10-8PIC24HJ128GP506-I/PT
製造商: Microchip 產品類型: 16-位微控制器 - MCU RoHS: 詳細資料 系列: PIC24HJxxxGPx06 安裝風格: SMD/SMT 封裝/外殼: TQFP-64 核心: PIC24H 程序內存大小: 128 kB 數據匯流排寬度: 16 bit ADC解析度: 12 bit 最高時鐘頻率: 80 MHz 輸入/輸出數: 53 I/O 數據存儲器大小: 8 kB 工作電源電壓:
2020-10-16
DdatasheetPDF页码索引
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