PIC32价格

参考价格:¥893.5707

型号:PIC32-MAXI-WEB 品牌:Olimex 备注:这里有PIC32多少钱,2025年最近7天走势,今日出价,今日竞价,PIC32批发/采购报价,PIC32行情走势销售排行榜,PIC32报价。
型号 功能描述 生产厂家 企业 LOGO 操作
PIC32

PIC32 Microcontroller Families With USB, CAN and Ethernet

文件:1.13035 Mbytes Page:6 Pages

Microchip

微芯科技

PIC32

USB Starter Kit III User’s Guide

文件:531.14 Kbytes Page:33 Pages

Microchip

微芯科技

PIC32

PIC32 Microcontroller Families With USB, CAN and Ethernet

Microchip

微芯科技

Ultra-Low Power, Secure and Enhanced Touch MCU

Operating Conditions • 1.62V - 3.63V, -40ºC to +125ºC, DC to 40 MHz (PIC32CM LE00/LS00) • 1.62V - 3.63V, -40ºC to +85ºC, DC to 48 MHz (PIC32CM LE00/LS00) • 2.0V - 3.63V, -40ºC to +85ºC, DC to 48 MHz (PIC32CM LS60) Core • Arm® Cortex®-M23 CPU running at up to 48 MHz: – 2.64 CoreMark/MHz and 1

Microchip

微芯科技

Ultra-Low Power, Secure and Enhanced Touch MCU

Operating Conditions • 1.62V - 3.63V, -40ºC to +125ºC, DC to 40 MHz (PIC32CM LE00/LS00) • 1.62V - 3.63V, -40ºC to +85ºC, DC to 48 MHz (PIC32CM LE00/LS00) • 2.0V - 3.63V, -40ºC to +85ºC, DC to 48 MHz (PIC32CM LS60) Core • Arm® Cortex®-M23 CPU running at up to 48 MHz: – 2.64 CoreMark/MHz and 1

Microchip

微芯科技

Ultra-Low Power, Secure and Enhanced Touch MCU

Operating Conditions • 1.62V - 3.63V, -40ºC to +125ºC, DC to 40 MHz (PIC32CM LE00/LS00) • 1.62V - 3.63V, -40ºC to +85ºC, DC to 48 MHz (PIC32CM LE00/LS00) • 2.0V - 3.63V, -40ºC to +85ºC, DC to 48 MHz (PIC32CM LS60) Core • Arm® Cortex®-M23 CPU running at up to 48 MHz: – 2.64 CoreMark/MHz and 1

Microchip

微芯科技

Ultra-Low Power, Secure and Enhanced Touch MCU

Operating Conditions • 1.62V - 3.63V, -40ºC to +125ºC, DC to 40 MHz (PIC32CM LE00/LS00) • 1.62V - 3.63V, -40ºC to +85ºC, DC to 48 MHz (PIC32CM LE00/LS00) • 2.0V - 3.63V, -40ºC to +85ºC, DC to 48 MHz (PIC32CM LS60) Core • Arm® Cortex®-M23 CPU running at up to 48 MHz: – 2.64 CoreMark/MHz and 1

Microchip

微芯科技

Ultra-Low Power, Secure and Enhanced Touch MCU

Operating Conditions • 1.62V - 3.63V, -40ºC to +125ºC, DC to 40 MHz (PIC32CM LE00/LS00) • 1.62V - 3.63V, -40ºC to +85ºC, DC to 48 MHz (PIC32CM LE00/LS00) • 2.0V - 3.63V, -40ºC to +85ºC, DC to 48 MHz (PIC32CM LS60) Core • Arm® Cortex®-M23 CPU running at up to 48 MHz: – 2.64 CoreMark/MHz and 1

Microchip

微芯科技

Ultra-Low Power, Secure and Enhanced Touch MCU

Operating Conditions • 1.62V - 3.63V, -40ºC to +125ºC, DC to 40 MHz (PIC32CM LE00/LS00) • 1.62V - 3.63V, -40ºC to +85ºC, DC to 48 MHz (PIC32CM LE00/LS00) • 2.0V - 3.63V, -40ºC to +85ºC, DC to 48 MHz (PIC32CM LS60) Core • Arm® Cortex®-M23 CPU running at up to 48 MHz: – 2.64 CoreMark/MHz and 1

Microchip

微芯科技

Ultra-Low Power, Secure and Enhanced Touch MCU

Operating Conditions • 1.62V - 3.63V, -40ºC to +125ºC, DC to 40 MHz (PIC32CM LE00/LS00) • 1.62V - 3.63V, -40ºC to +85ºC, DC to 48 MHz (PIC32CM LE00/LS00) • 2.0V - 3.63V, -40ºC to +85ºC, DC to 48 MHz (PIC32CM LS60) Core • Arm® Cortex®-M23 CPU running at up to 48 MHz: – 2.64 CoreMark/MHz and 1

Microchip

微芯科技

Ultra-Low Power, Secure and Enhanced Touch MCU

Operating Conditions • 1.62V - 3.63V, -40ºC to +125ºC, DC to 40 MHz (PIC32CM LE00/LS00) • 1.62V - 3.63V, -40ºC to +85ºC, DC to 48 MHz (PIC32CM LE00/LS00) • 2.0V - 3.63V, -40ºC to +85ºC, DC to 48 MHz (PIC32CM LS60) Core • Arm® Cortex®-M23 CPU running at up to 48 MHz: – 2.64 CoreMark/MHz and 1

Microchip

微芯科技

Ultra-Low Power, Secure and Enhanced Touch MCU

Operating Conditions • 1.62V - 3.63V, -40ºC to +125ºC, DC to 40 MHz (PIC32CM LE00/LS00) • 1.62V - 3.63V, -40ºC to +85ºC, DC to 48 MHz (PIC32CM LE00/LS00) • 2.0V - 3.63V, -40ºC to +85ºC, DC to 48 MHz (PIC32CM LS60) Core • Arm® Cortex®-M23 CPU running at up to 48 MHz: – 2.64 CoreMark/MHz and 1

Microchip

微芯科技

Ultra-Low Power, Secure and Enhanced Touch MCU

Operating Conditions • 1.62V - 3.63V, -40ºC to +125ºC, DC to 40 MHz (PIC32CM LE00/LS00) • 1.62V - 3.63V, -40ºC to +85ºC, DC to 48 MHz (PIC32CM LE00/LS00) • 2.0V - 3.63V, -40ºC to +85ºC, DC to 48 MHz (PIC32CM LS60) Core • Arm® Cortex®-M23 CPU running at up to 48 MHz: – 2.64 CoreMark/MHz and 1

Microchip

微芯科技

Ultra-Low Power, Secure and Enhanced Touch MCU

Operating Conditions • 1.62V - 3.63V, -40ºC to +125ºC, DC to 40 MHz (PIC32CM LE00/LS00) • 1.62V - 3.63V, -40ºC to +85ºC, DC to 48 MHz (PIC32CM LE00/LS00) • 2.0V - 3.63V, -40ºC to +85ºC, DC to 48 MHz (PIC32CM LS60) Core • Arm® Cortex®-M23 CPU running at up to 48 MHz: – 2.64 CoreMark/MHz and 1

Microchip

微芯科技

Ultra-Low Power, Secure and Enhanced Touch MCU

Operating Conditions • 1.62V - 3.63V, -40ºC to +125ºC, DC to 40 MHz (PIC32CM LE00/LS00) • 1.62V - 3.63V, -40ºC to +85ºC, DC to 48 MHz (PIC32CM LE00/LS00) • 2.0V - 3.63V, -40ºC to +85ºC, DC to 48 MHz (PIC32CM LS60) Core • Arm® Cortex®-M23 CPU running at up to 48 MHz: – 2.64 CoreMark/MHz and 1

Microchip

微芯科技

Ultra-Low Power, Secure and Enhanced Touch MCU

Operating Conditions • 1.62V - 3.63V, -40ºC to +125ºC, DC to 40 MHz (PIC32CM LE00/LS00) • 1.62V - 3.63V, -40ºC to +85ºC, DC to 48 MHz (PIC32CM LE00/LS00) • 2.0V - 3.63V, -40ºC to +85ºC, DC to 48 MHz (PIC32CM LS60) Core • Arm® Cortex®-M23 CPU running at up to 48 MHz: – 2.64 CoreMark/MHz and 1

Microchip

微芯科技

Ultra-Low Power, Secure and Enhanced Touch MCU

Operating Conditions • 1.62V - 3.63V, -40ºC to +125ºC, DC to 40 MHz (PIC32CM LE00/LS00) • 1.62V - 3.63V, -40ºC to +85ºC, DC to 48 MHz (PIC32CM LE00/LS00) • 2.0V - 3.63V, -40ºC to +85ºC, DC to 48 MHz (PIC32CM LS60) Core • Arm® Cortex®-M23 CPU running at up to 48 MHz: – 2.64 CoreMark/MHz and 1

Microchip

微芯科技

Ultra-Low Power, Secure and Enhanced Touch MCU

Operating Conditions • 1.62V - 3.63V, -40ºC to +125ºC, DC to 40 MHz (PIC32CM LE00/LS00) • 1.62V - 3.63V, -40ºC to +85ºC, DC to 48 MHz (PIC32CM LE00/LS00) • 2.0V - 3.63V, -40ºC to +85ºC, DC to 48 MHz (PIC32CM LS60) Core • Arm® Cortex®-M23 CPU running at up to 48 MHz: – 2.64 CoreMark/MHz and 1

Microchip

微芯科技

Ultra-Low Power, Secure and Enhanced Touch MCU

Operating Conditions • 1.62V - 3.63V, -40ºC to +125ºC, DC to 40 MHz (PIC32CM LE00/LS00) • 1.62V - 3.63V, -40ºC to +85ºC, DC to 48 MHz (PIC32CM LE00/LS00) • 2.0V - 3.63V, -40ºC to +85ºC, DC to 48 MHz (PIC32CM LS60) Core • Arm® Cortex®-M23 CPU running at up to 48 MHz: – 2.64 CoreMark/MHz and 1

Microchip

微芯科技

Ultra-Low Power, Secure and Enhanced Touch MCU

Operating Conditions • 1.62V - 3.63V, -40ºC to +125ºC, DC to 40 MHz (PIC32CM LE00/LS00) • 1.62V - 3.63V, -40ºC to +85ºC, DC to 48 MHz (PIC32CM LE00/LS00) • 2.0V - 3.63V, -40ºC to +85ºC, DC to 48 MHz (PIC32CM LS60) Core • Arm® Cortex®-M23 CPU running at up to 48 MHz: – 2.64 CoreMark/MHz and 1

Microchip

微芯科技

Ultra-Low Power, Secure and Enhanced Touch MCU

Operating Conditions • 1.62V - 3.63V, -40ºC to +125ºC, DC to 40 MHz (PIC32CM LE00/LS00) • 1.62V - 3.63V, -40ºC to +85ºC, DC to 48 MHz (PIC32CM LE00/LS00) • 2.0V - 3.63V, -40ºC to +85ºC, DC to 48 MHz (PIC32CM LS60) Core • Arm® Cortex®-M23 CPU running at up to 48 MHz: – 2.64 CoreMark/MHz and 1

Microchip

微芯科技

Ultra-Low Power, Secure and Enhanced Touch MCU

Operating Conditions • 1.62V - 3.63V, -40ºC to +125ºC, DC to 40 MHz (PIC32CM LE00/LS00) • 1.62V - 3.63V, -40ºC to +85ºC, DC to 48 MHz (PIC32CM LE00/LS00) • 2.0V - 3.63V, -40ºC to +85ºC, DC to 48 MHz (PIC32CM LS60) Core • Arm® Cortex®-M23 CPU running at up to 48 MHz: – 2.64 CoreMark/MHz and 1

Microchip

微芯科技

Advanced Security and Features Set MCU

Operating Conditions (PIC32CX SG41) • 1.71V - 3.63V, -40°C to +85°C, DC to 120 MHz • 1.71V - 3.63V, -40°C to +125°C, DC to 100 MHz Operating Conditions (PIC32CX SG60/SG61) • 2.7V - 3.63V, -40°C to +85°C, DC to 120 MHz • 2.7V - 3.63V, -40°C to +125°C, DC to 100 MHz Core: • Arm® Cortex®-M4F C

Microchip

微芯科技

RNBD451 Bluetooth® Low Energy Module Data Sheet

Features • Fully-certified Bluetooth Low Energy Module • Compact Form Factor • On-board Bluetooth 5.2 Low Energy Stack • ASCII Command Interface API over UART • ASCII Commands are Backward Compatible with RN487x Family of Modules • Definable Beacon Feature to Make Various Beacons, such as iB

Microchip

微芯科技

RNBD451 Bluetooth® Low Energy Module Data Sheet

Features • Fully-certified Bluetooth Low Energy Module • Compact Form Factor • On-board Bluetooth 5.2 Low Energy Stack • ASCII Command Interface API over UART • ASCII Commands are Backward Compatible with RN487x Family of Modules • Definable Beacon Feature to Make Various Beacons, such as iB

Microchip

微芯科技

Advanced Security and Features Set MCU

Operating Conditions (PIC32CX SG41) • 1.71V - 3.63V, -40°C to +85°C, DC to 120 MHz • 1.71V - 3.63V, -40°C to +125°C, DC to 100 MHz Operating Conditions (PIC32CX SG60/SG61) • 2.7V - 3.63V, -40°C to +85°C, DC to 120 MHz • 2.7V - 3.63V, -40°C to +125°C, DC to 100 MHz Core: • Arm® Cortex®-M4F C

Microchip

微芯科技

32-bit Connectivity MCU with Integrated Security

Operating Conditions • VDDREG - 1.75V - 1.85V, -40°C to +85°C, DC to 300 MHz • VDDIO/AVDD - 1.75V – 3.63V, -40°C to +85°C, DC to 300 MHz Communication Interfaces • Up to 10 Serial Communication Interfaces (SERCOM), USART, I2C, SPI : – 16 byte transmit receive buffers – Baud Rate generator (B

Microchip

微芯科技

32-bit Connectivity MCU with Integrated Security

Operating Conditions • VDDREG - 1.75V - 1.85V, -40°C to +85°C, DC to 300 MHz • VDDIO/AVDD - 1.75V – 3.63V, -40°C to +85°C, DC to 300 MHz Communication Interfaces • Up to 10 Serial Communication Interfaces (SERCOM), USART, I2C, SPI : – 16 byte transmit receive buffers – Baud Rate generator (B

Microchip

微芯科技

32-bit Connectivity MCU with Integrated Security

Operating Conditions • VDDREG - 1.75V - 1.85V, -40°C to +85°C, DC to 300 MHz • VDDIO/AVDD - 1.75V – 3.63V, -40°C to +85°C, DC to 300 MHz Communication Interfaces • Up to 10 Serial Communication Interfaces (SERCOM), USART, I2C, SPI : – 16 byte transmit receive buffers – Baud Rate generator (B

Microchip

微芯科技

32-bit Connectivity MCU with Integrated Security

Operating Conditions • VDDREG - 1.75V - 1.85V, -40°C to +85°C, DC to 300 MHz • VDDIO/AVDD - 1.75V – 3.63V, -40°C to +85°C, DC to 300 MHz Communication Interfaces • Up to 10 Serial Communication Interfaces (SERCOM), USART, I2C, SPI : – 16 byte transmit receive buffers – Baud Rate generator (B

Microchip

微芯科技

32-bit Connectivity MCU with Integrated Security

Operating Conditions • VDDREG - 1.75V - 1.85V, -40°C to +85°C, DC to 300 MHz • VDDIO/AVDD - 1.75V – 3.63V, -40°C to +85°C, DC to 300 MHz Communication Interfaces • Up to 10 Serial Communication Interfaces (SERCOM), USART, I2C, SPI : – 16 byte transmit receive buffers – Baud Rate generator (B

Microchip

微芯科技

32-bit Connectivity MCU with Integrated Security

Operating Conditions • VDDREG - 1.75V - 1.85V, -40°C to +85°C, DC to 300 MHz • VDDIO/AVDD - 1.75V – 3.63V, -40°C to +85°C, DC to 300 MHz Communication Interfaces • Up to 10 Serial Communication Interfaces (SERCOM), USART, I2C, SPI : – 16 byte transmit receive buffers – Baud Rate generator (B

Microchip

微芯科技

32-bit Connectivity MCU with Integrated Security

Operating Conditions • VDDREG - 1.75V - 1.85V, -40°C to +85°C, DC to 300 MHz • VDDIO/AVDD - 1.75V – 3.63V, -40°C to +85°C, DC to 300 MHz Communication Interfaces • Up to 10 Serial Communication Interfaces (SERCOM), USART, I2C, SPI : – 16 byte transmit receive buffers – Baud Rate generator (B

Microchip

微芯科技

32-bit Connectivity MCU with Integrated Security

Operating Conditions • VDDREG - 1.75V - 1.85V, -40°C to +85°C, DC to 300 MHz • VDDIO/AVDD - 1.75V – 3.63V, -40°C to +85°C, DC to 300 MHz Communication Interfaces • Up to 10 Serial Communication Interfaces (SERCOM), USART, I2C, SPI : – 16 byte transmit receive buffers – Baud Rate generator (B

Microchip

微芯科技

32-bit Connectivity MCU with Integrated Security

Operating Conditions • VDDREG - 1.75V - 1.85V, -40°C to +85°C, DC to 300 MHz • VDDIO/AVDD - 1.75V – 3.63V, -40°C to +85°C, DC to 300 MHz Communication Interfaces • Up to 10 Serial Communication Interfaces (SERCOM), USART, I2C, SPI : – 16 byte transmit receive buffers – Baud Rate generator (B

Microchip

微芯科技

32-bit Connectivity MCU with Integrated Security

Operating Conditions • VDDREG - 1.75V - 1.85V, -40°C to +85°C, DC to 300 MHz • VDDIO/AVDD - 1.75V – 3.63V, -40°C to +85°C, DC to 300 MHz Communication Interfaces • Up to 10 Serial Communication Interfaces (SERCOM), USART, I2C, SPI : – 16 byte transmit receive buffers – Baud Rate generator (B

Microchip

微芯科技

32-bit Connectivity MCU with Integrated Security

Operating Conditions • VDDREG - 1.75V - 1.85V, -40°C to +85°C, DC to 300 MHz • VDDIO/AVDD - 1.75V – 3.63V, -40°C to +85°C, DC to 300 MHz Communication Interfaces • Up to 10 Serial Communication Interfaces (SERCOM), USART, I2C, SPI : – 16 byte transmit receive buffers – Baud Rate generator (B

Microchip

微芯科技

32-bit Connectivity MCU with Integrated Security

Operating Conditions • VDDREG - 1.75V - 1.85V, -40°C to +85°C, DC to 300 MHz • VDDIO/AVDD - 1.75V – 3.63V, -40°C to +85°C, DC to 300 MHz Communication Interfaces • Up to 10 Serial Communication Interfaces (SERCOM), USART, I2C, SPI : – 16 byte transmit receive buffers – Baud Rate generator (B

Microchip

微芯科技

32-bit Connectivity MCU with Integrated Security

Operating Conditions • VDDREG - 1.75V - 1.85V, -40°C to +85°C, DC to 300 MHz • VDDIO/AVDD - 1.75V – 3.63V, -40°C to +85°C, DC to 300 MHz Communication Interfaces • Up to 10 Serial Communication Interfaces (SERCOM), USART, I2C, SPI : – 16 byte transmit receive buffers – Baud Rate generator (B

Microchip

微芯科技

32-bit Connectivity MCU with Integrated Security

Operating Conditions • VDDREG - 1.75V - 1.85V, -40°C to +85°C, DC to 300 MHz • VDDIO/AVDD - 1.75V – 3.63V, -40°C to +85°C, DC to 300 MHz Communication Interfaces • Up to 10 Serial Communication Interfaces (SERCOM), USART, I2C, SPI : – 16 byte transmit receive buffers – Baud Rate generator (B

Microchip

微芯科技

32-bit Connectivity MCU with Integrated Security

Operating Conditions • VDDREG - 1.75V - 1.85V, -40°C to +85°C, DC to 300 MHz • VDDIO/AVDD - 1.75V – 3.63V, -40°C to +85°C, DC to 300 MHz Communication Interfaces • Up to 10 Serial Communication Interfaces (SERCOM), USART, I2C, SPI : – 16 byte transmit receive buffers – Baud Rate generator (B

Microchip

微芯科技

32-bit Connectivity MCU with Integrated Security

Operating Conditions • VDDREG - 1.75V - 1.85V, -40°C to +85°C, DC to 300 MHz • VDDIO/AVDD - 1.75V – 3.63V, -40°C to +85°C, DC to 300 MHz Communication Interfaces • Up to 10 Serial Communication Interfaces (SERCOM), USART, I2C, SPI : – 16 byte transmit receive buffers – Baud Rate generator (B

Microchip

微芯科技

32-bit Connectivity MCU with Integrated Security

Operating Conditions • VDDREG - 1.75V - 1.85V, -40°C to +85°C, DC to 300 MHz • VDDIO/AVDD - 1.75V – 3.63V, -40°C to +85°C, DC to 300 MHz Communication Interfaces • Up to 10 Serial Communication Interfaces (SERCOM), USART, I2C, SPI : – 16 byte transmit receive buffers – Baud Rate generator (B

Microchip

微芯科技

32-bit Connectivity MCU with Integrated Security

Operating Conditions • VDDREG - 1.75V - 1.85V, -40°C to +85°C, DC to 300 MHz • VDDIO/AVDD - 1.75V – 3.63V, -40°C to +85°C, DC to 300 MHz Communication Interfaces • Up to 10 Serial Communication Interfaces (SERCOM), USART, I2C, SPI : – 16 byte transmit receive buffers – Baud Rate generator (B

Microchip

微芯科技

32-bit Connectivity MCU with Integrated Security

Operating Conditions • VDDREG - 1.75V - 1.85V, -40°C to +85°C, DC to 300 MHz • VDDIO/AVDD - 1.75V – 3.63V, -40°C to +85°C, DC to 300 MHz Communication Interfaces • Up to 10 Serial Communication Interfaces (SERCOM), USART, I2C, SPI : – 16 byte transmit receive buffers – Baud Rate generator (B

Microchip

微芯科技

32-bit Connectivity MCU with Integrated Security

Operating Conditions • VDDREG - 1.75V - 1.85V, -40°C to +85°C, DC to 300 MHz • VDDIO/AVDD - 1.75V – 3.63V, -40°C to +85°C, DC to 300 MHz Communication Interfaces • Up to 10 Serial Communication Interfaces (SERCOM), USART, I2C, SPI : – 16 byte transmit receive buffers – Baud Rate generator (B

Microchip

微芯科技

32-bit Connectivity MCU with Integrated Security

Operating Conditions • VDDREG - 1.75V - 1.85V, -40°C to +85°C, DC to 300 MHz • VDDIO/AVDD - 1.75V – 3.63V, -40°C to +85°C, DC to 300 MHz Communication Interfaces • Up to 10 Serial Communication Interfaces (SERCOM), USART, I2C, SPI : – 16 byte transmit receive buffers – Baud Rate generator (B

Microchip

微芯科技

32-bit Connectivity MCU with Integrated Security

Operating Conditions • VDDREG - 1.75V - 1.85V, -40°C to +85°C, DC to 300 MHz • VDDIO/AVDD - 1.75V – 3.63V, -40°C to +85°C, DC to 300 MHz Communication Interfaces • Up to 10 Serial Communication Interfaces (SERCOM), USART, I2C, SPI : – 16 byte transmit receive buffers – Baud Rate generator (B

Microchip

微芯科技

32-bit Connectivity MCU with Integrated Security

Operating Conditions • VDDREG - 1.75V - 1.85V, -40°C to +85°C, DC to 300 MHz • VDDIO/AVDD - 1.75V – 3.63V, -40°C to +85°C, DC to 300 MHz Communication Interfaces • Up to 10 Serial Communication Interfaces (SERCOM), USART, I2C, SPI : – 16 byte transmit receive buffers – Baud Rate generator (B

Microchip

微芯科技

32-bit Connectivity MCU with Integrated Security

Operating Conditions • VDDREG - 1.75V - 1.85V, -40°C to +85°C, DC to 300 MHz • VDDIO/AVDD - 1.75V – 3.63V, -40°C to +85°C, DC to 300 MHz Communication Interfaces • Up to 10 Serial Communication Interfaces (SERCOM), USART, I2C, SPI : – 16 byte transmit receive buffers – Baud Rate generator (B

Microchip

微芯科技

32-Bit Flash Microcontroller with MIPS32® microAptiv™ UC Core with Low Power and Low Pin Count

Microcontroller Features •Low Pin Count Packages, Ranging from 20 to 36 Pins, including UQFN as Small as 4x4 mm •Up to 64K Flash Memory: -20,000 erase/write cycle endurance -20 years minimum data retention -Self-programmable under software control •Up to 8K Data Memory •Pin-Compatible with

Microchip

微芯科技

32-Bit Flash Microcontroller with MIPS32® microAptiv™ UC Core with Low Power and Low Pin Count

Microcontroller Features •Low Pin Count Packages, Ranging from 20 to 36 Pins, including UQFN as Small as 4x4 mm •Up to 64K Flash Memory: -20,000 erase/write cycle endurance -20 years minimum data retention -Self-programmable under software control •Up to 8K Data Memory •Pin-Compatible with

Microchip

微芯科技

32-Bit Flash Microcontroller with MIPS32® microAptiv™ UC Core with Low Power and Low Pin Count

Microcontroller Features •Low Pin Count Packages, Ranging from 20 to 36 Pins, including UQFN as Small as 4x4 mm •Up to 64K Flash Memory: -20,000 erase/write cycle endurance -20 years minimum data retention -Self-programmable under software control •Up to 8K Data Memory •Pin-Compatible with

Microchip

微芯科技

32-Bit Flash Microcontroller with MIPS32® microAptiv™ UC Core with Low Power and Low Pin Count

Microcontroller Features •Low Pin Count Packages, Ranging from 20 to 36 Pins, including UQFN as Small as 4x4 mm •Up to 64K Flash Memory: -20,000 erase/write cycle endurance -20 years minimum data retention -Self-programmable under software control •Up to 8K Data Memory •Pin-Compatible with

Microchip

微芯科技

32-Bit Flash Microcontroller with MIPS32® microAptiv™ UC Core with Low Power and Low Pin Count

Microcontroller Features •Low Pin Count Packages, Ranging from 20 to 36 Pins, including UQFN as Small as 4x4 mm •Up to 64K Flash Memory: -20,000 erase/write cycle endurance -20 years minimum data retention -Self-programmable under software control •Up to 8K Data Memory •Pin-Compatible with

Microchip

微芯科技

32-Bit Flash Microcontroller with MIPS32® microAptiv™ UC Core with Low Power and Low Pin Count

Microcontroller Features •Low Pin Count Packages, Ranging from 20 to 36 Pins, including UQFN as Small as 4x4 mm •Up to 64K Flash Memory: -20,000 erase/write cycle endurance -20 years minimum data retention -Self-programmable under software control •Up to 8K Data Memory •Pin-Compatible with

Microchip

微芯科技

32-Bit Flash Microcontroller with MIPS32® microAptiv™ UC Core with Low Power and Low Pin Count

Microcontroller Features •Low Pin Count Packages, Ranging from 20 to 36 Pins, including UQFN as Small as 4x4 mm •Up to 64K Flash Memory: -20,000 erase/write cycle endurance -20 years minimum data retention -Self-programmable under software control •Up to 8K Data Memory •Pin-Compatible with

Microchip

微芯科技

32-Bit Flash Microcontroller with MIPS32® microAptiv™ UC Core with Low Power and Low Pin Count

Microcontroller Features •Low Pin Count Packages, Ranging from 20 to 36 Pins, including UQFN as Small as 4x4 mm •Up to 64K Flash Memory: -20,000 erase/write cycle endurance -20 years minimum data retention -Self-programmable under software control •Up to 8K Data Memory •Pin-Compatible with

Microchip

微芯科技

32-Bit Flash Microcontroller with MIPS32® microAptiv™ UC Core with Low Power and Low Pin Count

Microcontroller Features •Low Pin Count Packages, Ranging from 20 to 36 Pins, including UQFN as Small as 4x4 mm •Up to 64K Flash Memory: -20,000 erase/write cycle endurance -20 years minimum data retention -Self-programmable under software control •Up to 8K Data Memory •Pin-Compatible with

Microchip

微芯科技

32-Bit Flash Microcontroller with MIPS32® microAptiv™ UC Core with Low Power and Low Pin Count

Microcontroller Features •Low Pin Count Packages, Ranging from 20 to 36 Pins, including UQFN as Small as 4x4 mm •Up to 64K Flash Memory: -20,000 erase/write cycle endurance -20 years minimum data retention -Self-programmable under software control •Up to 8K Data Memory •Pin-Compatible with

Microchip

微芯科技

PIC32产品属性

  • 类型

    描述

  • 型号

    PIC32

  • 制造商

    MICROCHIP

  • 制造商全称

    Microchip Technology

  • 功能描述

    PIC32 Microcontroller Families With USB, CAN and Ethernet

更新时间:2025-10-15 20:00:00
IC供应商 芯片型号 品牌 批号 封装 库存 备注 价格
MICROCHIP
25+
QFN-28
1600
代理渠道/只做原装/可含税
Microchip(微芯)
24+
NA/
8735
原厂直销,现货供应,账期支持!
MICROCHI
22+
QFP80
100000
代理渠道/只做原装/可含税
MICROCHIP
22+
TQFP-64
640
仓库现货,终端可送样品
MICROCHIP/微芯
21+
TQFP144
160
一级代理,专注军工、汽车、医疗、工业、新能源、电力
MICROCHIP/微芯
24+
TQFP-64
860000
明嘉莱只做原装正品现货
MICROCH
25+
QFP-100
3
全新原装正品支持含税
Microchip
24+
64QFN
10000
全新原厂原装,进口正品现货,正规渠道可含税!!
TI
20+
NA
53650
TI原装主营-可开原型号增税票
MICROCH
24+/25+
TQFP64
1120
原装正品现货库存价优

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