Silver Wirebonding

KEY FEATURES Ag-Alloy wire is softer than Cu wire resulting in lower Al-Splash and lower risk of bond pad damage Ag-Alloy wire has a wide process window that improves manufacturability for devices with fragile bond pad structures

Innovative designs and expanding package offerings provide a platform from prototype-to-production

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Amkor’s PBGA/TEPBGA packages incorporate the most advanced assembly processes and designs for cost/performance applications.

Features Innovative designs and expanding package offerings provide a platform from prototype-to-production. Custom ball counts up to 1521 1.00, 1.27 & 1.50 mm standard ball pitch available (other ball pitches available upon request, e.g. 0.8 mm) 17 to 40 mm body sizes Thin Au wire or Cu