XC7K325T-2FBG676I
Mouser编号：217-C7K325T-2FBG676I
制造商编号：
XC7K325T-2FBG676I
制造商：Xilinx
说明：
FPGA - 现场可编程门阵列 XC7K325T-2FBG676I
寿命周期: 新产品: 此制造商的新产品。
数据表:
XC7K325T-2FBG676I 数据表
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更多信息:了解Xilinx XC7K325T-2FBG676I详情
规格
产品属性属性值搜索类似
制造商:Xilinx
产品种类:FPGA - 现场可编程门阵列
RoHS: 详细信息
产品:Kintex-7
逻辑元件数量:326080
输入/输出端数量:400 I/O
工作电源电压:1.2 V to 3.3 V
较小工作温度:- 40 C
较大工作温度:+ 100 C
安装风格:SMD/SMT
封装 / 箱体:FCBGA-676
数据速率:6.6 Gb/s
系列:XC7K325T
商标:Xilinx
分布式RAM:4000 kbit
内嵌式块RAM - EBR:16020 kbit
较大工作频率:640 MHz
湿度敏感性:Yes
收发器数量:8 Transceiver
产品类型:FPGA - Field Programmable Gate Array
工厂包装数量:1
子类别:Programmable Logic ICs
商标名:Kintex
产品合规性
更多信息
Kintex?-7 FPGA
Xilinx Kintex?-7 FPGA为快速增长应用和无线通信提供较优性价比和低功耗。Kintex-7 FPGA具有卓越的性能和连接性，售价为之前仅限于较高容量应用的价格。
Summary of 7 Series FPGA Features
? Advanced high-performance FPGA logic based on real 6-input lookup table (LUT) technology configurable as distributed memory.
? 36 Kb dual-port block RAM with built-in FIFO logic for on-chip data
buffering.
? High-performance SelectIO? technology with support for DDR3
interfaces up to 1，866 Mb/s.
? High-speed serial connectivity with built-in multi-gigabit transceivers
from 600 Mb/s to max. rates of 6.6 Gb/s up to 28.05 Gb/s， offering a
special low-power mode， optimized for chip-to-chip interfaces.
? A user configurable analog interface (XADC)， incorporating dual
12-bit 1MSPS analog-to-digital converters with on-chip thermal and_
supply sensors.
? DSP slices with 25 x 18 multiplier， 48-bit accumulator， and_pre-adder
for high-performance filtering， including optimized symmetric
coefficient filtering.
? Powerful clock management tiles (CMT)， combining phase-locked
loop (PLL) and_mixed-mode clock manager (MMCM) blocks for high
precision and_low jitter.
? Quickly deploy embedded processing with MicroBlaze? processor.
? Integrated block for PCI Express? (PCIe)， for up to x8 Gen3
Endpoint and_Root Port designs.
? Wide variety of configuration options， including support for
commodity memories， 256-bit AES encryption with HMAC/SHA-256
authentication， and_built-in SEU detection and_correction.
? Low-cost， wire-bond， bare-die flip-chip， and_high signal integrity flipchip packaging offering easy migration between family members in
the same package. All packages available in Pb-free and_selected
packages in Pb option.
? Designed for high performance and_lowest power with 28 nm，
HKMG， HPL process， 1.0V core voltage process technology and_
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