Power MOSFET

Low Profile, Small Footprint Packaging ON Semiconductor offers the latest in low-profile, small-outline packaging. We enable the design and production of ultra-thin end-user products for the consumer market, by manufacturing some of the lowest profile packaging available in the world, in vast vol

High Efficiency DC-DC Converters

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Single N-Channel ChipFET™ Power MOSFET 20V 7.2A 30mΩ

Power MOSFET

Low Profile, Small Footprint Packaging ON Semiconductor offers the latest in low-profile, small-outline packaging. We enable the design and production of ultra-thin end-user products for the consumer market, by manufacturing some of the lowest profile packaging available in the world, in vast vol

Power MOSFET

Low Profile, Small Footprint Packaging ON Semiconductor offers the latest in low-profile, small-outline packaging. We enable the design and production of ultra-thin end-user products for the consumer market, by manufacturing some of the lowest profile packaging available in the world, in vast vol

Solenoids with Kick and Drop

The Kick and Drop variants of the AC10 and AC19 coil types use two windings in one solenoid. Thanks to an increased inrush power for the first winding, the switchable pressure range is increased as installation volumes stay the same. The second winding is switched in series after 500 ms. Thanks

22 (7/30) AWG Tinned Copper

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OPTICS CATALOGUE

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Hex Inverting Gates

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Hex Inverting Gates

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