Thermal Cutoff

Description: Twenty One Thermal Cut−offs (also known as Thermal Fuses) are now included in the NTE product line. They are miniature, NON−RESETTABLE temperature sensitive devices designed to prevent appliances and electronic equipment from overheating. NTE thermal cutoffs are UL and CSA listed. L

325 MHz, 8 x 8 Buffered Video Crosspoint Switches

GENERAL DESCRIPTION The AD8108/AD8109 are high speed 8 × 8 video crosspoint switch matrices. They offer a −3 dB signal bandwidth greater than 250 MHz and channel switch times of less than 25 ns with 1 settling. With −83 dB of crosstalk and −98 dB isolation (@5 MHz), the AD8108/AD8109 are useful i

Very fast high-voltage soft-recovery controlled avalanche rectifiers

DESCRIPTION Rugged glass package, using a high temperature alloyed construction. This package is hermetically sealed and fatigue free as coefficients of expansion of all used parts are matched. The package is designed to be used in an insulating medium such as resin, oil or SF6 gas. FEATURES

6-Pin DIP Optoisolators for Power Supply Applications(No Base Connection)

The MOC8106, MOC8107 and MOC8108 devices consist of a gallium arsenide LED optically coupled to a silicon phototransistor in a dual–in–line package. • Closely Matched Current Transfer Ratio (CTR) Minimizes Unit–to–Unit Variation • Narrow (CTR) Windows that translate to a Narrow and Predictable O

TMUX810x 100-V, Flat RON, Single 8:1 and Dual 4:1 Multiplexers with Latch-Up Immunity and 1.8-V Logic

1 Features • High supply voltage capable: – Dual supply: ±10 V to ±50 V – Single supply: 10 V to 100 V – Asymmetric dual supply operation • Consistent parametrics across supply voltages • Latch-up immune • Low crosstalk: –110 dB • Low input leakage: 40 pA • Low on resistance flatness: 0.5

MIXER OSCILLATOR IC FOR PAGER SYSTEM

DESCRIPTION µPC8103T and µPC8108T are silicon monolithic integrated circuits designed as mixer-oscillator series for pager system. Due to 1 V supply voltage, these ICs are suitable for low voltage pager system. These ICs are packaged in 6 pin mini mold suitable for high-density surface mounting.