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MSL-1价格
参考价格：￥21.8324
型号：MSL-1 品牌：BUSSMANN / EATON 备注：这里有MSL-1多少钱，2025年最近7天走势，今日出价，今日竞价，MSL-1批发/采购报价，MSL-1行情走势销售排行榜，MSL-1报价。| 型号 | 功能描述 | 生产厂家 企业 | LOGO | 操作 |
|---|---|---|---|---|
Surface Mount Chip LEDs Description The MSL-154B, a BLUE source Chip LED device, is designed in an indnstry standard package suitable for SMT assembly method. It utilizes InGaN on SiC LED chip technology and water clear epoxy package. Features ● Push-Button Backlighting ● LCD Backlighting ● Symbol Backlighting ● Fr | UOT 东贝光电 |   | ||
Surface Mount Chip LEDs Description The MSL-154BV, a BLUE source Chip LED device, is designed in an indnstry standard package suitable for SMT assembly method. It utilizes GaN on SiC LED chip technology and water clear epoxy package. Features Push-Button Backlighting LCD Backlighting Symbol Backlighting Front Panel | UOT 东贝光电 | | ||
Surface Mount Chip LEDs Description The MSL-154DR, a RED source Chip LED device, is designed in an indnstry standard package suitable for SMT assembly method. It utilizes AlGaAs on GaAs LED chip technology and water clear epoxy package. Features Push-Button Backlighting LCD Backlighting Symbol Backlighting Front Pa | UOT 东贝光电 | | ||
Surface Mount Chip LEDs Description The MSL-154G, a GREEN source Chip LED device, is designed in an indnstry standard package suitable for SMT assembly method. It utilizes GaP on GaP LED chip technology and water clear epoxy package. Features Push-Button Backlighting LCD Backlighting Symbol Backlighting Front Panel | UOT 东贝光电 | | ||
Surface Mount Chip LEDs Description The MSL-154HG, a GREEN source Chip LED device, is designed in an indnstry standard package suitable for SMT assembly method. It utilizes GaP on GaP LED chip technology and water clear epoxy package. Features Push-Button Backlighting LCD Backlighting Symbol Backlighting Front Pane | UOT 东贝光电 | | ||
Surface Mount Chip LEDs Description The MSL-154HR, a ORANGE source Chip LED device, is designed in an indnstry standard package suitable for SMT assembly method. It utilizes GaAsP on GaP LED chip technology and water clear epoxy package. Features Push-Button Backlighting LCD Backlighting Symbol Backlighting Front P | UOT 东贝光电 | | ||
Surface Mount Chip LEDs Description The MSL-154SG, a SIGNAL GREEN source Chip LED device, is designed in an indnstry standard package suitable for SMT assembly method. It utilizes InGaN on SiC LED chip technology and water clear epoxy package. Features Push-Button Backlighting LCD Backlighting Symbol Backlighting F | UOT 东贝光电 | | ||
Surface Mount Chip LEDs Description The MSL-154SO, a ORANGE source Chip LED device, is designed in an indnstry standard package suitable for SMT assembly method. It utilizes GaAsP on GaP LED chip technology and water clear epoxy package. Features Push-Button Backlighting LCD Backlighting Symbol Backlighting Front P | UOT 东贝光电 | | ||
Surface Mount Chip LEDs Description The MSL-154TG, a TRUE GREEN source Chip LED device, is designed in an indnstry standard package suitable for SMT assembly method. It utilizes InGaN on SiC LED chip technology and water clear epoxy package. Features Push-Button Backlighting LCD Backlighting Symbol Backlighting Fro | UOT 东贝光电 | | ||
Surface Mount Chip LEDs Description The MSL-154UG, a YELLOW GREEN source Chip LED device, is designed in an indnstry standard package suitable for SMT assembly method. It utilizes AlGaInP on GaAs LED chip technology and water clear epoxy package. Features Push-Button Backlighting LCD Backlighting Symbol Backlighting | UOT 东贝光电 | | ||
Surface Mount Chip LEDs Description The MSL-154UOL, a SUPER ORANGE source Chip LED device, is designed in an indnstry Standard package suitable for SMT assembly method. It utilizes AlGaInP on GaAs LED chip technology and water clear epoxy package. Features Push-Button Backlighting LCD Backlighting Symbol Backlightin | UOT 东贝光电 | | ||
Surface Mount Chip LEDs Description The MSL-154UR, a RED source Chip LED device, is designed in an indnstry standard package suitable for SMT assembly method. It utilizes AlGaAs on AlGaAs LED chip technology and water clear epoxy package. Features Push-Button Backlighting LCD Backlighting Symbol Backlighting Front | UOT 东贝光电 | | ||
Surface Mount Chip LEDs Description The MSL-154UYL, a AMBER source Chip LED device, is designed in an indnstry standard package suitable for SMT assembly method. It utilizes AlGaInP on GaAs LED chip technology and water clear epoxy package. Features Push-Button Backlighting LCD Backlighting Symbol Backlighting Fr | UOT 东贝光电 | | ||
Surface Mount Chip LEDs Description The MSL-154Y, a YELLOW source Chip LED device, is designed in an indnstry standard package suitable for SMT assembly method. It utilizes GaAsP on GaP LED chip technology and water clear epoxy package. Features Push-Button Backlighting LCD Backlighting Symbol Backlighting Front Pa | UOT 东贝光电 | | ||
Surface Mount Full Color Chip LEDs Description The MSL-157RGB , a full colors device, is made with InGaN ( on Sapphire substrate) BLUE, TRUE GREEN and AlInGaP SOFT RED LED dice. It is PCB type package, suitable for all SMT assembly methods. Features Key pad backlighting Symbol backlighting Front panel indicator | UOT 东贝光电 | | ||
Surface Mount Chip LEDs Description The MSL-174B, a BLUE source Chip LED device, is designed in an indnstry standard package suitable for SMT assembly method. It utilizes InGaN on SiC LED chip technology and water clear epoxy package. Features Push-Button Backlighting LCD Backlighting Symbol Backlighting Front Pane | UOT 东贝光电 | | ||
Surface Mount Chip LEDs Description The MSL-174BV, a BLUE source Chip LED device, is designed in an indnstry standard package suitable for SMT assembly method. It utilizes GaN on SiC LED chip technology and water clear epoxy package. Features Push-Button Backlighting LCD Backlighting Symbol Backlighting Front Panel | UOT 东贝光电 | | ||
Surface Mount Chip LEDs Description The MSL-174DR, a RED source Chip LED device, is designed in an indnstry standard package suitable for SMT assembly method. It utilizes AlGaAs on GaAs LED chip technology and water clear epoxy package. Features Push-Button Backlighting LCD Backlighting Symbol Backlighting Front Pa | UOT 东贝光电 | | ||
Surface Mount Chip LEDs Description The MSL-174G, a GREEN source Chip LED device, is designed in an indnstry standard package suitable for SMT assembly method. It utilizes GaP on GaP LED chip technology and water clear epoxy package. Features Push-Button Backlighting LCD Backlighting Symbol Backlighting Front Panel | UOT 东贝光电 | | ||
Surface Mount Chip LEDs Description The MSL-174HG, a GREEN source Chip LED device, is designed in an indnstry standard package suitable for SMT assembly method. It utilizes GaP on GaP LED chip technology and water clear epoxy package. Features Push-Button Backlighting LCD Backlighting Symbol Backlighting Front Pane | UOT 东贝光电 | | ||
Surface Mount Chip LEDs Description The MSL-174HR, a ORANGE source Chip LED device, is designed in an indnstry standard package suitable for SMT assembly method. It utilizes GaAsP on GaP LED chip technology and water clear epoxy package. Features Push-Button Backlighting LCD Backlighting Symbol Backlighting Front P | UOT 东贝光电 | | ||
Surface Mount Chip LEDs Description The MSL-174SG, a SIGNAL GREEN source Chip LED device, is designed in an indnstry standard package suitable for SMT assembly method. It utilizes InGaN on SiC LED chip technology and water clear epoxy package. Features Push-Button Backlighting LCD Backlighting Symbol Backlighting | UOT 东贝光电 | | ||
Surface Mount Chip LEDs Description The MSL-174SO, a ORANGE source Chip LED device, is designed in an indnstry standard package suitable for SMT assembly method. It utilizes GaAsP on GaP LED chip technology and water clear epoxy package. Features Push-Button Backlighting LCD Backlighting Symbol Backlighting Front P | UOT 东贝光电 | | ||
Surface Mount Chip LEDs Description The MSL-174TG, a TRUE GREEN source Chip LED device, is designed in an indnstry standard package suitable for SMT assembly method. It utilizes InGaN on SiC LED chip technology and water clear epoxy package. Features Push-Button Backlighting LCD Backlighting Symbol Backlighting Fro | UOT 东贝光电 | | ||
Surface Mount Chip LEDs Description The MSL-174UG, a YELLOW GREEN source Chip LED device, is designed in an indnstry standard package suitable for SMT assembly method. It utilizes AlGaInP on GaAs LED chip technology and water clear epoxy package. Features Push-Button Backlighting LCD Backlighting Symbol Backlighting | UOT 东贝光电 | | ||
Surface Mount Chip LEDs Description The MSL-174UOL, a SUPER ORANGE source Chip LED device, is designed in an indnstry Standard package suitable for SMT assembly method. It utilizes AlGaInP on GaAs LED chip technology and water clear epoxy package. Features Push-Button Backlighting LCD Backlighting Symbol Backlightin | UOT 东贝光电 | | ||
Surface Mount Chip LEDs Description The MSL-174UR, a RED source Chip LED device, is designed in an indnstry standard package suitable for SMT assembly method. It utilizes AlGaAs on AlGaAs LED chip technology and water clear epoxy package. Features Push-Button Backlighting LCD Backlighting Symbol Backlighting Front | UOT 东贝光电 | | ||
Surface Mount Chip LEDs Description The MSL-174UYL, a AMBER source Chip LED device, is designed in an indnstry standard package suitable for SMT assembly method. It utilizes AlGaInP on GaAs LED chip technology and water clear epoxy package. Features Push-Button Backlighting LCD Backlighting Symbol Backlighting Fron | UOT 东贝光电 | | ||
Surface Mount Chip LEDs Description The MSL-174Y, a YELLOW source Chip LED device, is designed in an indnstry standard package suitable for SMT assembly method. It utilizes GaAsP on GaP LED chip technology and water clear epoxy package. Features Push-Button Backlighting LCD Backlighting Symbol Backlighting Front Pa | UOT 东贝光电 | | ||
Surface Mount Chip LEDs Description The MSL-1947HB3, a BLUE source Chip LED device, is designed in an indnstry standard package suitable for SMT assembly method. It utilizes GaN on Sapphire LED chip technology and water clear epoxy package. Features Push-Button Backlighting LCD Backlighting Symbol Backlighting Fron | UOT 东贝光电 | | ||
Surface Mount Chip LEDs Description The MSL-1947HB3-5, a BLUE source Chip LED device, is designed in an indnstry standard package suitable for SMT assembly method. It utilizes GaN on Sapphire LED chip technology and water clear epoxy package. Features Push-Button Backlighting LCD Backlighting Symbol Backlighting Fr | UOT 东贝光电 | | ||
Surface Mount Chip LEDs Description The MSL-1947HB3, a BLUE source Chip LED device, is designed in an indnstry standard package suitable for SMT assembly method. It utilizes GaN on Sapphire LED chip technology and water clear epoxy package. Features Push-Button Backlighting LCD Backlighting Symbol Backlighting Fron | UOT 东贝光电 | | ||
Surface Mount Chip LEDs Description The MSL-194B, a BLUE source Chip LED device, is designed in an indnstry standard package suitable for SMT assembly method. It utilizes InGaN on SiC LED chip technology and water clear epoxy package. Features Push-Button Backlighting LCD Backlighting Symbol Backlighting Front Pane | UOT 东贝光电 | | ||
Surface Mount Chip LEDs Description The MSL-194BV, a BLUE source Chip LED device, is designed in an indnstry standard package suitable for SMT assembly method. It utilizes GaN on SiC LED chip technology and water clear epoxy package. Features Push-Button Backlighting LCD Backlighting Symbol Backlighting Front Panel | UOT 东贝光电 | | ||
Surface Mount Chip LEDs Description The MSL-194DR, a RED source Chip LED device, is designed in an indnstry standard package suitable for SMT assembly method. It utilizes AlGaAs on GaAs LED chip technology and water clear epoxy package. Features Push-Button Backlighting LCD Backlighting Symbol Backlighting Front Pa | UOT 东贝光电 | | ||
Surface Mount Chip LEDs Description The MSL-194G, a GREEN source Chip LED device, is designed in an indnstry standard package suitable for SMT assembly method. It utilizes GaP on GaP LED chip technology and water clear epoxy package. Features Push-Button Backlighting LCD Backlighting Symbol Backlighting Front Panel | UOT 东贝光电 | | ||
Surface Mount Chip LEDs Description The MSL-194HG, a GREEN source Chip LED device, is designed in an indnstry standard package suitable for SMT assembly method. It utilizes GaP on GaP LED chip technology and water clear epoxy package. Features Push-Button Backlighting LCD Backlighting Symbol Backlighting Front Pane | UOT 东贝光电 | | ||
Surface Mount Chip LEDs Description The MSL-194HR, a ORANGE source Chip LED device, is designed in an indnstry standard package suitable for SMT assembly method. It utilizes GaAsP on GaP LED chip technology and water clear epoxy package. Features Push-Button Backlighting LCD Backlighting Symbol Backlighting Front P | UOT 东贝光电 | | ||
Surface Mount Chip LEDs Description The MSL-194SG, a SIGNAL GREEN source Chip LED device, is designed in an indnstry standard package suitable for SMT assembly method. It utilizes InGaN on SiC LED chip technology and water clear epoxy package. Features Push-Button Backlighting LCD Backlighting Symbol Backlighting F | UOT 东贝光电 | | ||
Surface Mount Chip LEDs Description The MSL-194SO, a ORANGE source Chip LED device, is designed in an indnstry standard package suitable for SMT assembly method. It utilizes GaAsP on GaP LED chip technology and water clear epoxy package. Features Push-Button Backlighting LCD Backlighting Symbol Backlighting Front P | UOT 东贝光电 | | ||
Surface Mount Chip LEDs Description The MSL-194TG, a TRUE GREEN source Chip LED device, is designed in an indnstry standard package suitable for SMT assembly method. It utilizes InGaN on SiC LED chip technology and water clear epoxy package. Features Push-Button Backlighting LCD Backlighting Symbol Backlighting Fro | UOT 东贝光电 | | ||
Surface Mount Chip LEDs Description The MSL-194UOL, a SUPER ORANGE source Chip LED device, is designed in an indnstry Standard package suitable for SMT assembly method. It utilizes AlGaInP on GaAs LED chip technology and water clear epoxy package. Features Push-Button Backlighting LCD Backlighting Symbol Backlightin | UOT 东贝光电 | | ||
Surface Mount Chip LEDs Description The MSL-194UR, a RED source Chip LED device, is designed in an indnstry standard package suitable for SMT assembly method. It utilizes AlGaAs on AlGaAs LED chip technology and water clear epoxy package. Features Push-Button Backlighting LCD Backlighting Symbol Backlighting Front | UOT 东贝光电 | | ||
Surface Mount Chip LEDs Description The MSL-194UYL, a AMBER source Chip LED device, is designed in an indnstry standard package suitable for SMT assembly method. It utilizes AlGaInP on GaAs LED chip technology and water clear epoxy package. Features Push-Button Backlighting LCD Backlighting Symbol Backlighting Fron | UOT 东贝光电 | | ||
Surface Mount Chip LEDs Description The MSL-194Y, a YELLOW source Chip LED device, is designed in an indnstry standard package suitable for SMT assembly method. It utilizes GaAsP on GaP LED chip technology and water clear epoxy package. Features Push-Button Backlighting LCD Backlighting Symbol Backlighting Front Pa | UOT 东贝光电 | | ||
Surface Mount Bi-Color Chip LEDs 文件：48.11 Kbytes Page：3 Pages | UOT 东贝光电 | | ||
Surface Mount Bi-Color Chip LEDs 文件：48.11 Kbytes Page：3 Pages | UOT 东贝光电 | | ||
Surface Mount Bi-Color Chip LEDs 文件：48.11 Kbytes Page：3 Pages | UOT 东贝光电 | | ||
Surface Mount Bi-Color Chip LEDs 文件：48.11 Kbytes Page：3 Pages | UOT 东贝光电 | | ||
Surface Mount Bi-Color Chip LEDs 文件：48.11 Kbytes Page：3 Pages | UOT 东贝光电 | | ||
Surface Mount Bi-Color Chip LEDs 文件：48.11 Kbytes Page：3 Pages | UOT 东贝光电 | |
MSL-1产品属性
- 类型
描述
- 型号
MSL-1
- 制造商
Cooper Bussmann
| IC供应商 | 芯片型号 | 品牌 | 批号 | 封装 | 库存 | 备注 | 价格 |
|---|---|---|---|---|---|---|---|
N/A |
2022+ |
8000 |
全新原装 货期两周 |
||||
MSL |
23+ |
O603 |
50000 |
全新原装正品现货,支持订货 |
|||
MSL |
25+23+ |
O603 |
29043 |
绝对原装正品现货,全新深圳原装进口现货 |
|||
UNITYOP |
23+ |
SMD发光 |
8560 |
受权代理!全新原装现货特价热卖! |
|||
MSL |
23+ |
O603 |
89630 |
当天发货全新原装现货 |
|||
MSL |
22+ |
O603 |
20000 |
只做原装 |
|||
MSL |
24+ |
O603 |
20000 |
全新原厂原装，进口正品现货，正规渠道可含税！！ |
|||
UNITYOPTO |
23+ |
1206 |
10381 |
原厂授权一级代理,专业海外优势订货,价格优势、品种 |
|||
MSL |
24+ |
O603 |
18560 |
假一赔十全新原装现货特价供应工厂客户可放款 |
|||
MSL |
23+24 |
O603 |
28950 |
专营原装正品SMD二三极管,电源IC |
MSL-1规格书下载地址
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